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Introduction
PCB Assembly is a process that requires knowledge not just of PCB components and assembly but also of printed circuit board design, PCB fabrication and a strong understanding of the final product. Circuit board assembly is just one piece of the puzzle to delivering the perfect product the first time.
San Francisco Circuits is a one-stop solution for all circuit board services so we are often entrenched with the PCB production process from design to assembly. Through our strong network of well-proven circuit assembly and manufacturing partners, we can provide the most advanced and nearly limitless capabilities for your prototype or production PCB application. Save yourself the trouble that comes with the procurement process and dealing with multiple components vendors. Our experts will find you the best parts for your final product.
PCB Assembly Services:
Quick-turn prototype assembly
Turn-key assembly
Partial turn-key assembly
Consignment assembly
RoHS compliant lead-free assembly
Non-RoHS assembly
Conformal coating
Final box-build and packaging
PCB Assembly Process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing
Testing Services
X-Ray (2-D and 3-D)
BGA X-Ray Inspection
AOI Testing (Automated Optical Inspection)
ICT Testing (In-Circuit Testing)
Functional Testing (at the board & system level)
Flying Probe
Capabilities
Surface Mount Technology / Parts (SMT Assembly)
Through-Hole Device / Parts (THD)
Mixed Parts: SMT & THD assembly
BGA / Micro BGA / uBGA
QFN, POP & lead-less chips
2800 pin-count BGA
0201 / 1005 passive components
0.3 / 0.4 Pitch
PoP Package
Flip-chip under-filled CCGA
BGA Interposer / Stack-up
and more…
Product Details:
Payment & Shipping Terms:
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| High Light: | Printed Board Assembly,Circuit Board Assembly Services |
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CEM 1 CEM 3 PCB 8 Layer Printed Circuit Board Assembly , EMS PCBA
Quick Detail:
Detailed Specification of PCB Manufacturing
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1 |
layer |
1-30 layer |
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2 |
Material |
CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
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3 |
Board thickness |
0.2mm-6mm |
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4 |
Max.finished board size |
800*508mm |
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5 |
Min.drilled hole size |
0.25mm |
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6 |
min.line width |
0.075mm(3mil) |
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7 |
min.line spacing |
0.075mm(3mil) |
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8 |
Surface finish |
HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
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9 |
Copper thickness |
0.5-4.0oz |
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10 |
Solder mask color |
green/black/white/red/blue/yellow |
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11 |
Inner packing |
Vacuum packing,Plastic bag |
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12 |
Outer packing |
standard carton packing |
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13 |
Hole tolerance |
PTH:±0.076,NTPH:±0.05 |
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14 |
Certificate |
UL,ISO9001,ISO14001,ROHS,TS16949 |
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15 |
Profiling punching |
Routing,V-CUT,Beveling |
Detailed Specification of Pcb Assembly
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1 |
Type of Assembly |
SMT and Thru-hole |
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2 |
Solder Type |
Water Soluble Solder Paste,Leaded and Lead-Free |
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3 |
Components |
Passives Down to 0201 Size |
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BGA and VFBGA |
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Leadless Chip Carries/CSP |
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Double-Sided SMT Assembly |
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Fine Pitch to 08 Mils |
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BGA Repair and Reball |
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Part Removal and Replacement-Same Day Service |
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3 |
Bare Board Size |
Smallest:0.25x0.25 Inches |
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Largest:20x20 Inches |
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4 |
File Formats |
Bill of Materials |
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Gerber Files |
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Pick-N-Place File(XYRS) |
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5 |
Type of Service |
Turn-Key,Partial Turn-Key or Consignment |
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6 |
Component Packaging |
Cut Tape |
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Tube |
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Reels |
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Loose Parts |
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7 |
Turn Time |
15 to 20 days |
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8 |
Testing |
AOI inspection |
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X-Ray inspection |
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In-Circuit testing |
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Functional test |
Welcome to Huaswin!
Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.
We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP
assembly ,IC pre-programming / burning on-line, testing, packing.
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
PCB Assembly services:
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material
Testing Methods
AOI Testing
·Checks for solder paste
·Checks for components down to 0201"
·Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
·BGAs
·Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing
ISO Certification:
Huaswin’s production facility is ISO9001 certified to ensure top quality production of your product!
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
