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custom OEM fr4 multilayer pcb board supplier

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Multilayer PCB Board

  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers

Introduction

 

Multilayer printed circuit boards (PCBs) represented the next major evolution in fabrication technology. From the base platform of double sided plated thru came a very sophisticated and complex methodology that would again allow circuit board designers a dynamic range of interconnects and applications.

Multilayer circuit boards were essential in the advancement of modern computing. The multilayer PCB basic construction and fabrication are similar to micro chip fabrication on a macro size. The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills. Multilayer can be built on ceramic, copper, and aluminum. Blind and buried vias are commonly produced, along with pad on via technology.

 

 

Production Process

 

1. Chemical Clean

 

In order to obtain good quality etched pattern, it is necessary to ensure a strong bond of the resist layer and the substrate surface, a substrate or a surface oxide layer, oil, dust, fingerprints and other dirt. Therefore, before the resist layer is first applied to the surface of the board and the copper foil surface cleaning roughened layer reaches a certain degree.
Inner plate: started four panels, the inner (second and third layers) is a must do first. The inner sheet is made of glass fiber and epoxy resin-based composite upper and lower surfaces of the copper sheet.

 

 

 

2. Cut Sheet Dry Film Lamination

 

Coating a photoresist: we need to make the shape of the inner plate, we first affixed dry film (resist, photoresist) over the inner layer sheet. The dry film is a polyester thin film, a photoresist film and a polyethylene protective film composed of three parts. When the foil, the dry film starting with a polyethylene protective film is peeled off, and then under the conditions of heat and pressure in the dry film is pasted on copper.

 


3. Image Expose & Image Develop

 

Exposure: In the UV irradiation, photoinitiators absorb light decompose into radicals, radical photopolymerization initiator and then polymerizing the monomer to generate a crosslinking reaction, forming insoluble in dilute alkali solution after the reaction of the polymer structure. Polymerization to continue for some time, in order to ensure the stability of the process, not to tear immediately after exposure polyester film should stay more than 15 minutes to the polymerization reaction to proceed, before developing torn polyester film.
Developer: the reaction active groups solution unexposed portions of the photosensitive film with a dilute alkali-soluble matter dissolved production down, leaving the already hardened by crosslinking the photosensitive pattern portion

 

 

4. Copper Etch

 

In flexible printed boards or printed board manufacturing process, the chemical reaction to the copper foil portion not to be removed, so as to form a desired circuit pattern of copper beneath the photoresist is not etched retained impact.

 

 

5. Strip Resist & Post Etch Punch & AOI Inspection & Oxide

 

The purpose of the film is to etch the board retained after clearing the resist layer so that the following copper exposed. "Film slag" filter and recycle waste shall be disposed of properly. If you go after the film can be washed completely clean, you might consider not pickling. Finally, the board is completely dry after washing, avoid residual moisture.

 

 

6. Layup with prepreg

 

Before entering pressure machine, the need to use all of multilayer materials ready to pack (Lay-up) In addition to the inner handle the job has been oxidized, but still need a protective film film (Prepreg) -. Epoxy resin impregnated glass fibers. Role of laminations is a certain order to the board covered with a protective film since the stacked and placed between the floor plate.

 

 

7. Layup with copper foil & Vacuum Lamination Press

 

Foil - to present the inner sheet and then covered with a layer of copper foil on both sides, and then the multilayer pressurization (within a fixed period of time necessary to measure the temperature and pressure extrusion) was cooled to room temperature after completion of the remaining is a multi-layer sheet of together.

 

 

8. CNC Drill

 

Under the conditions of the inner precision, CNC drilling drilling depending on the mode. Drilling high precision, to ensure that the hole is in the correct position.

 

 

9. Electroless Copper

 

In order to make the through-hole between the layers can be turned on (the resin and glass fiber bundle of a non-conductive portion of the wall of the hole metallization), the holes must be filled in the copper. The first step is a thin layer of copper plating in the hole, this process is completely chemical reaction. Final plated copper thickness of 50 inches millionth.

 

 

10. Cut Sheet & Dry Film Lamination

 

 

Photoresist coating: We have one in the outer coating of the photoresist.

 

 

11. Mage Expose & Image Develop

 

Outer exposure and development

 

 

12. Copper Pattern Electro Plating

 

This has become a secondary copper, the main purpose is to thicken the line of copper and copper vias thick.

 

 

13. Tin Pattern Electro Plating

 

Its main purpose is an etching resist, protect it covers the copper conductors will not be attacked (internal protection of all copper lines and vias) in alkaline corrosion of copper.

 

 

14. Strip Resist

 

We already know the purpose, just use the chemical method, the surface of the copper is exposed.

 

 

15. Copper Etch

 

We know that the purpose of protecting the tin partially etched foil below.

 

 

16. LPI coating side 1 & Tack Dry & LPI coating side 2 & Tack Dry & Image Expose & Image Develop & Thermal Cure Solder mask

 

Solder mask is exposed to the pads used, it is often said that the green oil, oil is actually digging holes in the green, the green oil does not need to cover the pads and other exposed areas. Proper cleaning can get a suitable surface features.

 

 

17. Surface finish

 

HASL solder coating HAL (commonly known as HAL) process is first dipped on the PCB flux, then dipping in molten solder, and then from between two air knives by compressed air with a knife in the heat air to blow off excess solder on printed circuit board, at the same time eliminate excess solder metal hole, resulting in a bright, smooth, uniform solder coating.
Gold Finger, purpose-designed Edge Connector, plug the connector as board liaison foreign exports, and therefore need to cheat the process. Chose gold because of its superior conductivity and oxidation resistance. However, because the cost of gold applies only to cheat so high, local gold plated or chemically.

 

custom OEM fr4 multilayer pcb board supplier

custom OEM fr4 multilayer pcb board supplier
custom OEM fr4 multilayer pcb board supplier

Large Image :  custom OEM fr4 multilayer pcb board supplier

Product Details:

Place of Origin: Shenzhen ,China
Brand Name: OEM,ODM
Certification: UL,ISO9001:2008
Model Number: zt-pcb-0141
Base Material: FR-4,CEM-3, Roger, TEFLON, TAC...
Standard: IPC-A-600H Class 2, Class 3, TS1....
Finish: HASL/ lead Free/Gold/OSP/...
HS Code: 8534009000

Payment & Shipping Terms:

Minimum Order Quantity: 5 pieces
Price: US $0.01 - 2 / Piece
Packaging Details: Safety Package,Inner Vacuum Package,Outer Carton
Delivery Time: Sample for 3-10days, Mass production for 5days - 3weeks
Payment Terms: T/T, Paypal,Western Union, L/C
Supply Ability: 30,000sqm/month
Detailed Product Description
High Light:

pcb board supplier

,

Fr4 multilayer pcb

,

pcb supplier

Zhengte Electronics PCB&PCBA Contract Manufacturing Services Including Belows:

custom OEM fr4 multilayer pcb board supplier


custom OEM fr4 multilayer pcb board supplier

1.Fast PCB Fabrication for Samples and Mass Production
2.Electronic Components Sourcing Servics
3.PCBA Assembly Services:SMT,DIP,BGA...
4.Function Test
5.Stencil and Enclosure Assembly

6.Standard Packing and On time Delivery

Main Products Application

1.Household Appliances

2.Medical Products

3.Automotive Products

4.Industrial Products

5.Communication Products(AVL/GPS/GSM Devices)

6.Consumer Electronics

PCB Fabrication Capabilities

Number of Layer1,2,4 or 6,upto 18 layer
Order Quantity1 to 50,000
Board ShapeRetangular,round,slots,cutouts,complex,irregular
Board TypeRigid, Flexible, Rigid-flexible
Board MaterialFR-4 glass epoxy, FR-4 high Tg, Rohs compliant,Aluminum,Rogers,etc.
Board CuttingShear,V-score,Tab-routed
Board Thickness0.2-4.0mm, Flex 0.01-0.25mm
Copper Weight1.0, 1.5, 2.0 oz
Solder MaskDouble-sided green LPI,Also support Red,White,Yellow,Blue,Black
Silk ScreenDouble-sided or single-sided in white,yellow,black,or negative
Silk Screen Min Line Width0.006'' or 0.15mm
Max Board Dimensions20 inch*20inch or 500mm*500mm
Min Trace/Gap0.10mm, or 4mils
Min Drill Hole Diameter0.01'',0.25mm, or 10mils
Surface FinishHASL,Nickle,Immersion Gold,Immersion Tin,Immersion Silver,OSP,etc.
Board Thickness Tolerance±10%
Copper Weight Tolerance± 0.25 oz
Minimal Slot Width0.12'', 3.0mm, or 120mils
V-Score Depth20-25% of board thickness
Design File FormateGerber RS-274,274D,Eagle and AutoCAD's DXF,DWG,PCB file

PCB Assembly Capabilities

Quantity

Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000

Type of AssemblySMT,Thru-hole
Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

Components

Passive Down to 0201 size

BGA and VFBGA

Leadless Chip Carriers/CSP

Double-sided SMT Assembly

Fine Pitch to 0.8mils

BGA Repair and Reball

Part Removal and Replacement

Bare Board Size

Smallest:0.25*0.25 inches

Largest:20*20 inches

File Formate

Bill of Materials

Gerber files

Pick-N-Place file

Types of ServiceTurn-key,partial turn-key or consignment
Component packaging

Cut Tape,Tube,Reels,Loose Parts

Turn Time

Same day service to 15 days service

Testing

Flying Probe Test,X-ray Inspection AOI Test

PCB assembly process

Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

PCB Lead Time

Layer/DaysSample(Normal)Sample(Fast)Mass Production
Single/Double3-5days24-72hours7-10days
Four Layer5-7days5days7-12days
Six Layer10-12days8days13-15days
Eight Layer15-20days7-10days16-20days


Detailed Terms for PCB Assembly

1.Technical requirement for pcb assembly: What we can do?
1) Professional Surface-mounting and Through-hole soldering Technology
2)Various sizes like1206,0805,0603,0402,0201 components SMTTech
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity

2.Production Details:
1) Material Management
Supplier → Components Purchase → IQC → Protection Control →Material Supply → Firmware
2) Program Management
PCB Files → DCC → Program Organizing → Optimization → Checking
3) SMT Management
PCB Loader → Screen Printer → Checking → SMD Placement →Checking → Air Reflow → Vision Inspection → AOI → Keeping
4) PCBA Management
THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT →
Flash → FCT → Checking → Package → Shipment

custom OEM fr4 multilayer pcb board supplier

3.Our Advantage:

1.Related Certificate --- UL ,ISO9001:2000 , TS16949, Rosh.

2.100% electrical test, AOI testing, four times 100% QC inspection beofre shipping.

3.High reliable, Germany equipment ,competitive price andSpeedy delivery.

4.Fast Prototype Service.

5.One stop electronic assembly service(provide prototype, plastic injection molding, part painting,

components purchasing, SMT COB,DIP,PCBA service as one unit).

4.Package:

custom OEM fr4 multilayer pcb board supplier

RFQs

1.How can I get quotation in time?
Please send us the PCB File and Components list via mail or Online tool(Aliwangwang or Skype,WhatsApp)
The file will be checked and the initial quotation will be offered withing 2 working days as usual
(Gerber,Eagle,PCB,CAD file are acceptable).

2.How to Place order with Zhengte Electronics?

Step1: Send us the PO with request (Final project files confirmed) and we will confirm with PI.

Step2: The order will be entered into our order system in same day.

Step3: Deposit or full payment complete,then order confirmed by our financial department.

Step4: The order will be proceed accordingly by our purchasing system.

Step5: Sample or photos offered for approval.

Step6: Balance payment complete,shippment arranged and tracking will be offered via email.

3.What's the normal sequency of order?

Step1: * PCB board file with parts list details provided by customers.

Step2: * PCB board file checked by PCB engineer.

Step3: * PCB board components sourced by Zhengte Electronics.

Step4: * Components checked by Zhengte Electronics warehouse stuffs.

Step4: * PCB board with components assembled.

Step5: * Electronic testing circuit board or PCBA.

Step6: * Anti-static package,Fast delivery.

4.How can make sure no mistake for mass production?
The production files will be checked by our engineering teams.Samples will be
offered for approval before mass production.

5.What files in need for the PCB Assembly services?
Besides the PCB files and Components list,we also need PNP(Pick and Place)
and Components Position files for production.

6.How can I track the shipment?

When order complete,an email will be sent out to confirm the value and shipment methods.

Then the shipment tracking number will be shared with email as always.

7.How can I share the feedback?

Please send the comments with the order number within 30days to our feedback service department.

Our service department will proceed in working days as usual.

8.What service Zhengte Electronics can offer?

One stop service for PCB design,PCB layout,PCB manufacture,Components purchasing,PCB assembly,Testing,Packing and PCB delivery.

Quality Control

custom OEM fr4 multilayer pcb board supplierCONTACT USSHENZHEN ZHENGTE ELECTRONICS CO., LTD.
Tel:86-0755-25585656 EXT.801 Fax:86-0755-25563466
Website: www.zhengtepcb.cn
Whatsapp/Mobile: 0086-15814076116Skype:pcba.solutions






























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