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Green ENIG Custom Circuit Boards FR4 DIP Double Layer PCB with RoHs UL

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Good quality Flexible PCB Board
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The board quality is very good! We have been WonDa’s customer for more than 4 years. Your good service and quality is too good.

—— Jay

Cooperation is very satisfactory and the Company of the past few years, we are very willing to continue long-term cooperation.

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The board quality is very good! I’m surprised with the low cost and quick delivery. It is totally out of my expectation. I will definitely come back.

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Double Layer PCB

  • High Precision Double Layer PCB suppliers
  • High Precision Double Layer PCB suppliers

 

Material


FR4 fiberglass panels, aluminum plate, copper substrate, iron substrate, PTFE, F4B, F4BM, Kangtai Li, CER-10, Rogers, FPC soft board and some other high-precision plate.

 


Crafts


Light copper, nickel, gold, tin spray; Immersion Gold, antioxidant, HASL, immersion tin, etc.

 

 

Double Layer PCB Leadfree HASL with blue solder mask


- Leadfree HASL Surface finish required to meet ROHS compliant
-FR-4 material with 0.25mm-6mm boards thickness
-Copper weight:1/3OZ,0.5OZ,1OZ,2OZ,3OZ,4OZ,5OZ,6OZ
-3-3mils min track width & spacing -0.2mm min finished hole size
-Certificate: UL,ISO14001,TS16949 and ROHS
-Company management: ISO9001
-Markets: Europe, America, Asia,etc.

 

 

Application


electronic products, like

computer peripherals,aerospace,telecommunication,automotives,medicaldevices,camermas,optoelectronic devices,VCD,LCD and verious other comsumer electronic products.

Green ENIG Custom Circuit Boards FR4 DIP Double Layer PCB with RoHs UL

Green ENIG Custom Circuit Boards FR4 DIP Double Layer PCB with RoHs UL
Green ENIG Custom Circuit Boards FR4 DIP Double Layer PCB with RoHs UL

Large Image :  Green ENIG Custom Circuit Boards FR4 DIP Double Layer PCB with RoHs UL

Product Details:

Place of Origin: China
Brand Name: SYF
Certification: UL,ISO9001:2008,ROHS,REACH, HALOGEN FREE,SGS
Model Number: SYF-276
Material: FR4
Solder Mask: Green/Yellow/Red/Black
Quality: 100% E-Test
Service: PCB, PCBA, OEM, ODM
Surface Finished: ENIG, HAL, HASL, OSP, Immersion Silver, Immersion Tin
Detailed Product Description
High Light:

custom circuit boards

,

custom pc boards

Green ENIG Custom Circuit Boards FR4 DIP Double Layer PCB with RoHs UL

 

Quick Details

  1. Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.
  2. Best service with quick response is always provided for our customers.
  3. All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver,Immersion Tin,               Immersion Gold, Lead-free HASL,HAL.
  4. Advanced  production equipment imported from Japan and Germany,such as                                          PCB Lamination Machine, CNC drilling machine,Auto-PTH line,                                                               AOI(Automatic Optic Inspection),Probe Flying Machine and so on.
  5. BGA,Blind&Buried Vias and Impedence Control is accepted.
  6. Quality guarantee and professional after-sale service.
  7. Gerber file needed.

 

PRODUCT’S DETAILS

Raw Material

FR-4 (Tg 180 available)

Layer Count

4-Layer

Board Thickness

2.0mm

Copper Thickness

2.0oz

Surface Finish

ENIG(Electroless Nickel Immersion Gold)

Solder Mask

Green

Silkscreen

White

Min. Trace Width/Spacing

0.075/0.075mm

Min. Hole Size

0.25mm

Hole Wall Copper Thickness

≥20μm

Measurement

300×400mm

Packaging

Inner: Vacuum-packed in soft plastic bales 
Outer: Cardboard Cartons with double straps

Application

Communication,automobile,cell,computer,medical

Advantage

Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug, 
BGA Soldering And Gold Finger Are Acceptable

Certification

UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

 

 

 

PRODUCTION CAPABILITY OF PCB

 
PROCESS Engineer

ITEMS Item

         
 PRODUCTION CAPABILITY Manufacturing Capability

Laminate

Type

FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ,
ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON

Thickness

0.2~3.2mm

Production Type

    Layer Count

2L-16L

Surface Treatment

 HAL,Gold Plating,Immersion Gold,OSP,
Immersion Silver,Immersion Tin,Lead Free HAL

 Cut Lamination

Max. Working Panel size

 1000×1200mm

 Inner Layer

 Internal Core Thickness

0.1~2.0mm

 Internal width/spacing

Min: 4/4mil

 Internal Copper Thickness

1.0~3.0oz

 Dimension

Board Thickness Tolerance

±10%

 Interlayer Alignment

±3mil

Drilling

 Manufacture Panel Size

Max: 650×560mm

 Drilling Diameter

≧0.25mm

 Hole Diameter Tolerance

±0.05mm

 Hole Position Tolerance

±0.076mm

 Min.Annular Ring 

0.05mm

PTH+Panel Plating

 Hole Wall copper Thickness

≧20um

 Uniformity

≧90%

 Outer Layer

 Track Width

Min: 0.08mm

Track Spacing

Min: 0.08mm

 Pattern Plating

 Finished Copper Thickness

1oz~3oz

EING/Flash Gold

 Nickel Thickness

2.5um~5.0um

 Gold Thickness

0.03~0.05um

Solder Mask

Thickness

15~35um

 Solder Mask Bridge

3mil

 Legend

 Line width/Line spacing

6/6mil

 Gold Finger

 Nickel Thickness

≧120u〞

 Gold Thickness

1~50u〞

 Hot Air Level

 Tin Thickness

100~300u〞

 Routing

 Tolerance of Dimension

±0.1mm

 Slot Size

Min:0.4mm

Cutter Diameter

0.8~2.4mm

 Punching

 Outline Tolerance

±0.1mm

Slot Size

Min:0.5mm

V-CUT

 V-CUT Dimension

Min:60mm

 Angle

15°30°45°

 Remain Thickness Tolerance

±0.1mm

Beveling

Beveling Dimension

30~300mm

Test

Testing Voltage

250V

Max.Dimension

540×400mm

Impedance Control

 
    Tolerance
 

±10%

Aspect Ration

12:1

Laser Drilling Size

4mil(0.1mm)

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug, 
BGA Soldering and Gold Finger Are Acceptable

 

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