Material
FR4 fiberglass panels, aluminum plate, copper substrate, iron substrate, PTFE, F4B, F4BM, Kangtai Li, CER-10, Rogers, FPC soft board and some other high-precision plate.
Crafts
Light copper, nickel, gold, tin spray; Immersion Gold, antioxidant, HASL, immersion tin, etc.
Double Layer PCB Leadfree HASL with blue solder mask
- Leadfree HASL Surface finish required to meet ROHS compliant
-FR-4 material with 0.25mm-6mm boards thickness
-Copper weight:1/3OZ,0.5OZ,1OZ,2OZ,3OZ,4OZ,5OZ,6OZ
-3-3mils min track width & spacing -0.2mm min finished hole size
-Certificate: UL,ISO14001,TS16949 and ROHS
-Company management: ISO9001
-Markets: Europe, America, Asia,etc.
Application
electronic products, like
computer peripherals,aerospace,telecommunication,automotives,medicaldevices,camermas,optoelectronic devices,VCD,LCD and verious other comsumer electronic products.
Product Details:
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High Light: | custom circuit boards,custom pc boards |
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Green ENIG Custom Circuit Boards FR4 DIP Double Layer PCB with RoHs UL
Quick Details
PRODUCT’S DETAILS |
|
Raw Material |
FR-4 (Tg 180 available) |
Layer Count |
4-Layer |
Board Thickness |
2.0mm |
Copper Thickness |
2.0oz |
Surface Finish |
ENIG(Electroless Nickel Immersion Gold) |
Solder Mask |
Green |
Silkscreen |
White |
Min. Trace Width/Spacing |
0.075/0.075mm |
Min. Hole Size |
0.25mm |
Hole Wall Copper Thickness |
≥20μm |
Measurement |
300×400mm |
Packaging |
Inner: Vacuum-packed in soft plastic bales |
Application |
Communication,automobile,cell,computer,medical |
Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
PRODUCTION CAPABILITY OF PCB |
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|
ITEMS Item |
|
Laminate |
Type |
FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, |
Thickness |
0.2~3.2mm |
|
Production Type |
Layer Count |
2L-16L |
Surface Treatment |
HAL,Gold Plating,Immersion Gold,OSP, |
|
Cut Lamination |
Max. Working Panel size |
1000×1200mm |
Inner Layer |
Internal Core Thickness |
0.1~2.0mm |
Internal width/spacing |
Min: 4/4mil |
|
Internal Copper Thickness |
1.0~3.0oz |
|
Dimension |
Board Thickness Tolerance |
±10% |
Interlayer Alignment |
±3mil |
|
Drilling |
Manufacture Panel Size |
Max: 650×560mm |
Drilling Diameter |
≧0.25mm |
|
Hole Diameter Tolerance |
±0.05mm |
|
Hole Position Tolerance |
±0.076mm |
|
Min.Annular Ring |
0.05mm |
|
PTH+Panel Plating |
Hole Wall copper Thickness |
≧20um |
Uniformity |
≧90% |
|
Outer Layer |
Track Width |
Min: 0.08mm |
Track Spacing |
Min: 0.08mm |
|
Pattern Plating |
Finished Copper Thickness |
1oz~3oz |
EING/Flash Gold |
Nickel Thickness |
2.5um~5.0um |
Gold Thickness |
0.03~0.05um |
|
Solder Mask |
Thickness |
15~35um |
Solder Mask Bridge |
3mil |
|
Legend |
Line width/Line spacing |
6/6mil |
Gold Finger |
Nickel Thickness |
≧120u〞 |
Gold Thickness |
1~50u〞 |
|
Hot Air Level |
Tin Thickness |
100~300u〞 |
Routing |
Tolerance of Dimension |
±0.1mm |
Slot Size |
Min:0.4mm |
|
Cutter Diameter |
0.8~2.4mm |
|
Punching |
Outline Tolerance |
±0.1mm |
Slot Size |
Min:0.5mm |
|
V-CUT |
V-CUT Dimension |
Min:60mm |
Angle |
15°30°45° |
|
Remain Thickness Tolerance |
±0.1mm |
|
Beveling |
Beveling Dimension |
30~300mm |
Test |
Testing Voltage |
250V |
Max.Dimension |
540×400mm |
|
Impedance Control |
|
±10% |
Aspect Ration |
12:1 |
|
Laser Drilling Size |
4mil(0.1mm) |
|
Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345