Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Rigid flexible PCBs offer a wide array of applications, ranging from military weaponry and aerospace systems to cell phones and digital cameras. Increasingly, rigid flex board fabrication has been used in medical devices such as pacemakers for their space and weight reduction capabilities. The same advantages for rigid flex PCB usage can be applied to military weaponry and weapon control systems.
In consumer products, rigid flex doesn't just maximize space and weight but greatly improves reliability, eliminating many needs for solder joints and delicate, fragile wiring that are prone to connection issues. These are just some examples, but rigid flex PCBs can be used to benefit nearly all advanced electrical applications including testing equipment, tools and automobiles. Not sure what technology needs to be used for your project? Call our experts and we can help you figure out whether you need rigid flex, flex or HDI PCB technology.
Payment & Shipping Terms:
flexible rigid pcb,
high density pcb
|Brand Name:||OEM||Number of Layers:||4-Layer||Base Material:||FR4/Copper base|
|Copper Thickness:||1 OZ||Board Thickness:||1.6mm||Min. Hole Size:||0.15mm|
|Min. Line Width:||0.075mm||Min. Line Spacing:||0.075mm||Surface Finishing:||HASL|
specialized in pcb
pcb connector Application
Products are applied to a wide range of Hightech industries such as: LED, telecommunication, Induction cooker
pcb board computer application, lighting, game machine, industrial control, power, automobile and high-end
consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American,
Canada, Europe counties, Africa and other Asia-pacific countries.
What can we do for you ?
We can provide the products pcb connector such as 1 to 30 layers,RoHS Compliant, UL-listed,Fine line 0.07mm min,Microvia 0.2mm min,Blind Vias & Buried Vias,Surface as Chemical Tin, Silver, Gold ,HASL,Falsh Gold,HASL lead free,For high current: 3 OZ Copper,Special material: AL Based,Rogers,FR4,FR4 HTG,CEM-1,SMD-stencils,A.O.I. (Automatic Optical Inspection),X-Ray (innerlayer misalignment control),Impedance Control with Testprotocol pcb assembly .
pcb connector Advantage
1.Excellent quality and reasonable price .
2.PCB with high quality. strict test through AOI (Automated Optical Inspection),QA/QC, Flying Proble Test,
|Material||CEM-1,CEM-3,FR-4,FR4 TG170,TG180 ,HALOGEN FREE|
|Thick copper||0.5-6 OZ|
|Min line w / s||0.075mm(3mil)|
|Min Hole Side||0.20mm(8mil)|
|Min aperture Chong||0.9mm(35mil)|
|Tolerance||Hole drilling bit||±0.075mm(3mil)|
|Linewidth||±0.05mm(2mil)Or width of ± 20%|
|Shape tolerance||Milling Machine±0.15mm(6mil)|
|Pad surface treatment||Nickel/Gold Finger Plating/Flash Gold /Entek/LEAD Free Hal|
|V Engraved||Panle size||110*100mm(min.)660*600mm(max.)|
|Retention of the thickness||0.3mm(12mil)min.|
|Trough to a line||0.5mm(20mil)min|
|Trough||Slot size tlo.≥2WTolerance||PTHL:±0.15mm(6mil)|
|To circular from the hole||PTH Hole: 0.13mm(5mil)||NPTH Hole: 0.18(7mil)|
|Deviation between layers||4 layers: 0.15mm(6mil)max|
|6 layers: 0.025mm(10mil)max.|
|Aperture to the smallest distance from the inner circle||0.25mm(10mil)|
|To circular from the hole||0.25mm(10mil)|
|Thickness Tolerance||6 layers: ±0.15mm(6mil)|
|6 layers: ±0.15mm(6mil)|
Contact Person: Miss. aaa
Tel: 86 755 8546321