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4/3.5mil 1.6m Immersion Gold FR4 8 Layer Rigid Custom PCB Board For Industrial Control

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Good quality Flexible PCB Board
Good quality Flexible PCB Board
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The board quality is very good! We have been WonDa’s customer for more than 4 years. Your good service and quality is too good.

—— Jay

Cooperation is very satisfactory and the Company of the past few years, we are very willing to continue long-term cooperation.

—— Rob

The board quality is very good! I’m surprised with the low cost and quick delivery. It is totally out of my expectation. I will definitely come back.

—— Victoria, Australia

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Rigid PCB Board

  • High Precision Rigid PCB Board suppliers
  • High Precision Rigid PCB Board suppliers

 

 

Introduction


Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.

Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.

 


Material Types


FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base

 

 

Surface Treatment


HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger

 


Production Process

 

Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.

Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.

The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.

 


Application


LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a

4/3.5mil 1.6m Immersion Gold FR4 8 Layer Rigid Custom PCB Board For Industrial Control

4/3.5mil 1.6m Immersion Gold FR4 8 Layer Rigid Custom PCB Board For Industrial Control
4/3.5mil 1.6m Immersion Gold FR4 8 Layer Rigid Custom PCB Board For Industrial Control

Large Image :  4/3.5mil 1.6m Immersion Gold FR4 8 Layer Rigid Custom PCB Board For Industrial Control

Product Details:

Place of Origin: shen zhen ,china
Brand Name: WonDa
Certification: TS16949

Payment & Shipping Terms:

Payment Terms: L/C,T/T,Paypal
Detailed Product Description
High Light:

rigid printed circuit board

,

electronic circuit board

4/3.5mil 1.6m Immersion Gold FR4 8 Layer Rigid Custom PCB Board For Industrial Control

 applicaton:
 
Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.


Material: FR4

Surface treatment: immersion Gold

Width/space: 4/3.5mil
Finish thickness: 1.6m

Min Hot:0.2mm

 

SPECIFICATION

Materials

Polyimide

Polyester ( PET)

Remark&

(Kapton)

Test Method

 

 

1~8(Rigid-Flex & Multilayers  FPC)

1~2

 

 

Single Sided

0.050 mm

 

 

Double Sided

0.075 mm

 

 

Drilling P.T.H.

0.2 mm

 

 

Punching

1.0 mm

 

 

Conductor Width (W)

0.025 mm

W0.5mm

 

Hole Diameter (H)

0.05 mm (withP.T.H.0.1mm)

H1.5mm

 

Accumulated Pitch (P)

0.05 mm (Special0.03mm)

P25mm

 

Outline Dimension (L)

0.05 mm

L50 mm

 

Conductors and Outline (C)

0.15 mm (Special 0.07mm)

C5.0 mm

 

Conductors and Coverlay

0.3~0.5 mm 

 

Surface Treatment on

Soft or Hard Ni/Au Sn/Pb (2~60μm)

Primary FluxCarbon Printed

4~10μm Silver Gel printed

 

Terminals and land Areas

Insulation Resistance

1000MW

IPC-TM-650  2.6.3.2 

at Ambient

Dielectric Strength

5KV

IPC-TM-650  2.5.6.1

Surface Resistance (W)

5x012

2x015

IPC-TM-650  2.5.17

Volume Resistivity (W-cm)

1x015

1x015

IPC-TM-650  2.5.17

Dielectric Constant (1 MHz)

4

3.4

IPC-TM-650  2.5.5.3

Dissipation Factor (1 MHz)

0.04

0.02

IPC-TM-650  2.5.5.3

Peeling Strength (180 irection)

1.2kgf/cm

1.2kgf/cm

IPC-TM-650  2.4.9

Solder Heat Resistance

260 .C/10secs

210 .C/3secs

Flammability

94 V-0

94VTM-0

UL94

Water Absorption

2.90%

1.00%

ASTM D570%

(24 Hours)

 

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