Feature: 1. Our PCBs are used for wide range of electronic products Like Medical devices, CCTV, Power supply, GPS, UPS, Set-top Box,Telecomunication ,LED, etc. 2. Provides OEM services to all sorts of printed circuit board assembly as well as Electronic encased products 3. Solder mask color: Green / Yellow / Black / White / Red / Blue. 4. Board material type: FR-4, Aluminium-backed board, Halogen-free, Lead-free compatible, High-Tg, High CTI, CEM-1, CEM-3, Rogers and more 5. Compound material lamination: 2 to 12 layers 6.Surface Finished type: HASL, Flash golds, ENIG,OSP(lead freecompatible), Carbon ink, Peelable S/M, HASL(lead free), Immersion silver/tin, Gold finger plating, ENIG+gold finger plating, Immersion Silver+gold finger plating

1. Chemical Clean In order to obtain good quality etched pattern, it is necessary to ensure a strong bond of the resist layer and the substrate surface, a substrate or a surface oxide layer, oil, dust, fingerprints and other dirt. Therefore, before the resist layer is first applied to the surface of the board and the copper foil surface cleaning roughened layer reaches a certain degree. Inner plate: started four panels, the inner (second and third layers) is a must do first. The inner sheet is made of glass fiber and epoxy resin-based composite upper and lower surfaces of the copper sheet.     2. Cut Sheet Dry Film Lamination Coating a photoresist: we need to make the shape of the inner plate, we first affixed dry film (resist, photoresist) over the inner layer sheet. The dry film is a polyester thin film, a photoresist film and a polyethylene protective film composed of three parts. When the foil, the dry film starting with a polyethylene protective film is peeled off, and then under the conditions of heat and pressure in the dry film is pasted on copper.   3. Image Expose & Image Develop Exposure: In the UV irradiation, photoinitiators absorb light decompose into radicals, radical photopolymerization initiator and then polymerizing the monomer to generate a crosslinking reaction, forming insoluble in dilute alkali solution after the reaction of the polymer structure. Polymerization to continue for some time, in order to ensure the stability of the process, not to tear immediately after exposure polyester film should stay more than 15 minutes to the polymerization reaction to proceed, before developing torn polyester film. Developer: the reaction active groups solution unexposed portions of the photosensitive film with a dilute alkali-soluble matter dissolved production down, leaving the already hardened by crosslinking the photosensitive pattern portion     4. Copper Etch In flexible printed boards or printed board manufacturing process, the chemical reaction to the copper foil portion not to be removed, so as to form a desired circuit pattern of copper beneath the photoresist is not etched retained impact.     5. Strip Resist & Post Etch Punch & AOI Inspection & Oxide The purpose of the film is to etch the board retained after clearing the resist layer so that the following copper exposed. "Film slag" filter and recycle waste shall be disposed of properly. If you go after the film can be washed completely clean, you might consider not pickling. Finally, the board is completely dry after washing, avoid residual moisture.     6. Layup with prepreg Before entering pressure machine, the need to use all of multilayer materials ready to pack (Lay-up) In addition to the inner handle the job has been oxidized, but still need a protective film film (Prepreg) -. Epoxy resin impregnated glass fibers. Role of laminations is a certain order to the board covered with a protective film since the stacked and placed between the floor plate.     7. Layup with copper foil & Vacuum Lamination Press Foil - to present the inner sheet and then covered with a layer of copper foil on both sides, and then the multilayer pressurization (within a fixed period of time necessary to measure the temperature and pressure extrusion) was cooled to room temperature after completion of the remaining is a multi-layer sheet of together.     8. CNC Drill Under the conditions of the inner precision, CNC drilling drilling depending on the mode. Drilling high precision, to ensure that the hole is in the correct position.     9. Electroless Copper In order to make the through-hole between the layers can be turned on (the resin and glass fiber bundle of a non-conductive portion of the wall of the hole metallization), the holes must be filled in the copper. The first step is a thin layer of copper plating in the hole, this process is completely chemical reaction. Final plated copper thickness of 50 inches millionth.     10. Cut Sheet & Dry Film Lamination Photoresist coating: We have one in the outer coating of the photoresist.     11. Mage Expose & Image Develop Outer exposure and development     12. Copper Pattern Electro Plating This has become a secondary copper, the main purpose is to thicken the line of copper and copper vias thick.     13. Tin Pattern Electro Plating Its main purpose is an etching resist, protect it covers the copper conductors will not be attacked (internal protection of all copper lines and vias) in alkaline corrosion of copper.     14. Strip Resist We already know the purpose, just use the chemical method, the surface of the copper is exposed.     15. Copper Etch We know that the purpose of protecting the tin partially etched foil below.     16. LPI coating side 1 & Tack Dry & LPI coating side 2 & Tack Dry & Image Expose & Image Develop & Thermal Cure Solder mask Solder mask is exposed to the pads used, it is often said that the green oil, oil is actually digging holes in the green, the green oil does not need to cover the pads and other exposed areas. Proper cleaning can get a suitable surface features.     17. Surface finish HASL solder coating HAL (commonly known as HAL) process is first dipped on the PCB flux, then dipping in molten solder, and then from between two air knives by compressed air with a knife in the heat air to blow off excess solder on printed circuit board, at the same time eliminate excess solder metal hole, resulting in a bright, smooth, uniform solder coating. Gold Finger, purpose-designed Edge Connector, plug the connector as board liaison foreign exports, and therefore need to cheat the process. Chose gold because of its superior conductivity and oxidation resistance. However, because the cost of gold applies only to cheat so high, local gold plated or chemically.  

Flex PCBs, also known as flexible printed circuits, provide greater options for designers and engineers when assembling electronic circuits.They are constructed from flexible, high-performance plastic material, usually polyimide, which enables the board to bend or "flex" during use. This flexibility opens them up to use in a wide range of applications.

1. Rigid-flexible pcb board for infrared camera. 2. This rigid- flexible pcb board shows how designers use flex to reduc. Rigid- flexible pcb board. This is another pure flex package; 14 layers bonded with flexible bond plies; controlled depth laser vias on the outer three layers of each side.

Double-Sided Boards of both sides have wiring. However, to use the wire on both sides, and both sides must be in the room with appropriate electrical connections for the job. Such a circuit between the "bridge" is called the guide hole (via). Guide hole in the PCB, metal filled or coated with holes, which can be connected to the conductors on both sides. Because dual-panel area than single-panel twice as big, and because the wiring can be interleaved with each other (you can go around the other side), it is more suitable for use in more complex than single-panel circuit.  

Introduction: Focus on the most basic of PCB, components focused on one side, the other side of the wire is concentrated.Because wires only appear on one side, so this kind of PCB is called single sided PCB. Single panel wiring diagram is given priority to with the network printing, that is, in the copper surface printed on resistance agent, to prevent welding resistance after etching printed on mark, and then punching processing way to complete the parts guide hole and the appearance.In addition, part of a small amount of diverse products, are using photosensitive resistance agent forming pattern of the photographic method. Operating temperatures range from 130 C to 230 C.  Single sided boards are available with surface finishes including Organic surface protectant (OSP), Immersion Silver, Tin, and Gold plating along with both leaded or lead-free Hot Air Solder Level (HASL).                                                                                                                                       Material:     Single sided PCB base material in paper phenolic copper paper laminated board, epoxy resin copper laminated plate is given priority to.     Structure:   First, the copper foil to be etched, etc. Process to obtain a circuit required, a protective film to be drilled to expose the corresponding pad. After cleaning and then rolling method to combine the two. Then the pad portion exposed gold plating or tin protection.     Production Process: Single copper-clad plate - blanking - photochemical method/screen printing image transfer - remove corrosion was printed - cleaning, dry - hole machining - shape - dry cleaning - printing resistance welding coating - cure - printing mark symbol - cure - dry cleaning drying - pre coated flux - a finished product   Application   Single sided PCB most use in the radio, heating machine, cold storage, washing machines and other electrical appliances product, as well as the printer, vending machines, LED lighting, electronic components, such as commercial machine circuit