PCB Board Online Marketplace

High quality, Best service,Reasonable price.

Home
About Us
PCB Services
Equipment
PCB Capabilities
Quality Assurance
Contact Us
Request A Quote
Home SamplesMultilayer PCB Board

4 Layer PCB FR4 MultiLayer PCB Board UL Marked RED Solder Mask for Power Supplier

PCB Certifications
Good quality Flexible PCB Board
Good quality Flexible PCB Board
Customer Reviews
The board quality is very good! We have been WonDa’s customer for more than 4 years. Your good service and quality is too good.

—— Jay

Cooperation is very satisfactory and the Company of the past few years, we are very willing to continue long-term cooperation.

—— Rob

The board quality is very good! I’m surprised with the low cost and quick delivery. It is totally out of my expectation. I will definitely come back.

—— Victoria, Australia

I'm Online Chat Now

Multilayer PCB Board

  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers

Introduction

 

Multilayer printed circuit boards (PCBs) represented the next major evolution in fabrication technology. From the base platform of double sided plated thru came a very sophisticated and complex methodology that would again allow circuit board designers a dynamic range of interconnects and applications.

Multilayer circuit boards were essential in the advancement of modern computing. The multilayer PCB basic construction and fabrication are similar to micro chip fabrication on a macro size. The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills. Multilayer can be built on ceramic, copper, and aluminum. Blind and buried vias are commonly produced, along with pad on via technology.

 

 

Production Process

 

1. Chemical Clean

 

In order to obtain good quality etched pattern, it is necessary to ensure a strong bond of the resist layer and the substrate surface, a substrate or a surface oxide layer, oil, dust, fingerprints and other dirt. Therefore, before the resist layer is first applied to the surface of the board and the copper foil surface cleaning roughened layer reaches a certain degree.
Inner plate: started four panels, the inner (second and third layers) is a must do first. The inner sheet is made of glass fiber and epoxy resin-based composite upper and lower surfaces of the copper sheet.

 

 

 

2. Cut Sheet Dry Film Lamination

 

Coating a photoresist: we need to make the shape of the inner plate, we first affixed dry film (resist, photoresist) over the inner layer sheet. The dry film is a polyester thin film, a photoresist film and a polyethylene protective film composed of three parts. When the foil, the dry film starting with a polyethylene protective film is peeled off, and then under the conditions of heat and pressure in the dry film is pasted on copper.

 


3. Image Expose & Image Develop

 

Exposure: In the UV irradiation, photoinitiators absorb light decompose into radicals, radical photopolymerization initiator and then polymerizing the monomer to generate a crosslinking reaction, forming insoluble in dilute alkali solution after the reaction of the polymer structure. Polymerization to continue for some time, in order to ensure the stability of the process, not to tear immediately after exposure polyester film should stay more than 15 minutes to the polymerization reaction to proceed, before developing torn polyester film.
Developer: the reaction active groups solution unexposed portions of the photosensitive film with a dilute alkali-soluble matter dissolved production down, leaving the already hardened by crosslinking the photosensitive pattern portion

 

 

4. Copper Etch

 

In flexible printed boards or printed board manufacturing process, the chemical reaction to the copper foil portion not to be removed, so as to form a desired circuit pattern of copper beneath the photoresist is not etched retained impact.

 

 

5. Strip Resist & Post Etch Punch & AOI Inspection & Oxide

 

The purpose of the film is to etch the board retained after clearing the resist layer so that the following copper exposed. "Film slag" filter and recycle waste shall be disposed of properly. If you go after the film can be washed completely clean, you might consider not pickling. Finally, the board is completely dry after washing, avoid residual moisture.

 

 

6. Layup with prepreg

 

Before entering pressure machine, the need to use all of multilayer materials ready to pack (Lay-up) In addition to the inner handle the job has been oxidized, but still need a protective film film (Prepreg) -. Epoxy resin impregnated glass fibers. Role of laminations is a certain order to the board covered with a protective film since the stacked and placed between the floor plate.

 

 

7. Layup with copper foil & Vacuum Lamination Press

 

Foil - to present the inner sheet and then covered with a layer of copper foil on both sides, and then the multilayer pressurization (within a fixed period of time necessary to measure the temperature and pressure extrusion) was cooled to room temperature after completion of the remaining is a multi-layer sheet of together.

 

 

8. CNC Drill

 

Under the conditions of the inner precision, CNC drilling drilling depending on the mode. Drilling high precision, to ensure that the hole is in the correct position.

 

 

9. Electroless Copper

 

In order to make the through-hole between the layers can be turned on (the resin and glass fiber bundle of a non-conductive portion of the wall of the hole metallization), the holes must be filled in the copper. The first step is a thin layer of copper plating in the hole, this process is completely chemical reaction. Final plated copper thickness of 50 inches millionth.

 

 

10. Cut Sheet & Dry Film Lamination

 

 

Photoresist coating: We have one in the outer coating of the photoresist.

 

 

11. Mage Expose & Image Develop

 

Outer exposure and development

 

 

12. Copper Pattern Electro Plating

 

This has become a secondary copper, the main purpose is to thicken the line of copper and copper vias thick.

 

 

13. Tin Pattern Electro Plating

 

Its main purpose is an etching resist, protect it covers the copper conductors will not be attacked (internal protection of all copper lines and vias) in alkaline corrosion of copper.

 

 

14. Strip Resist

 

We already know the purpose, just use the chemical method, the surface of the copper is exposed.

 

 

15. Copper Etch

 

We know that the purpose of protecting the tin partially etched foil below.

 

 

16. LPI coating side 1 & Tack Dry & LPI coating side 2 & Tack Dry & Image Expose & Image Develop & Thermal Cure Solder mask

 

Solder mask is exposed to the pads used, it is often said that the green oil, oil is actually digging holes in the green, the green oil does not need to cover the pads and other exposed areas. Proper cleaning can get a suitable surface features.

 

 

17. Surface finish

 

HASL solder coating HAL (commonly known as HAL) process is first dipped on the PCB flux, then dipping in molten solder, and then from between two air knives by compressed air with a knife in the heat air to blow off excess solder on printed circuit board, at the same time eliminate excess solder metal hole, resulting in a bright, smooth, uniform solder coating.
Gold Finger, purpose-designed Edge Connector, plug the connector as board liaison foreign exports, and therefore need to cheat the process. Chose gold because of its superior conductivity and oxidation resistance. However, because the cost of gold applies only to cheat so high, local gold plated or chemically.

 

4 Layer PCB FR4 MultiLayer PCB Board UL Marked RED Solder Mask for Power Supplier

4 Layer PCB FR4 MultiLayer PCB Board UL Marked RED Solder Mask for Power Supplier
4 Layer PCB FR4 MultiLayer PCB Board UL Marked RED Solder Mask for Power Supplier 4 Layer PCB FR4 MultiLayer PCB Board UL Marked RED Solder Mask for Power Supplier

Large Image :  4 Layer PCB FR4 MultiLayer PCB Board UL Marked RED Solder Mask for Power Supplier

Product Details:

Place of Origin: China
Brand Name: SYF
Certification: REACH, UL, SGS, ISO9001:2008, RoHs
Model Number: SYF-310

Payment & Shipping Terms:

Minimum Order Quantity: 10PCS
Price: Negotiation
Packaging Details: INNER VACCUM-PACKED WITH OUTER CARDBOARD CARTON
Delivery Time: 8-10 DAYS
Payment Terms: D/P,L/C,T/T,PAYPAL,WEST UNION
Supply Ability: 1 MILLION PIECES PER MONTH
Detailed Product Description
Solder Mask: Red/Yellow/Green/Black Materia: FR4/FR1/CEM-1/CEM-2/Metal Core
Quality: 100% E-TEST Surface Finish: HAL, OSP, HASL, ENIG, Immersion Tin, Immersion Silver
Production: Gerber File Or Design Data Needed. Service: PCB, PCBA, ODM, OEM
High Light:

multilayer circuit board

,

multilayer pcb board

4 Layer PCB FR4 MultiLayer PCB Board UL Marked RED Solder Mask for Power Supplier

 

Quick Details:

  1.  Professional PCB manufacturer.
  2.  Quality guarantee and professional after-sale service. 
  3.  Gerber file needed.

 

PCB Descriptions

 Basic Material

 High Tg-180 FR4

 Board Thickness

 2.0 mm

 Layer Count

 4-Layer

 Copper Thickness

 1.0 oz

 Surface Finish

 LEAD FREE HASL 

 Solder Mask

 RED

 Silkscreen

 White

 Trace Spacing

 0.030/0.030mm

 Hole Size

 0.25mm

 Hole Copper Thickness

 ≥20μm

 Measurement

 64×42mm

 Packing

 Outer: Cardboard Cartons with double straps

 Inner: Vacuum-packed in soft plastic bales  

 Certificates

 UL,ISO9001:2008,ROHS,REACH,SGS

 Advantage

 OEM&ODM,Competitive Price,Fast Delivery,

 Special Requirements

 Buried And Blind Via, Impedance Control, Via Plug, 
 BGA Soldering And Gold Finger Are Acceptable

 Applications

 Communication,automobile,cell,computer,medical

 
 

 PRODUCTION OF PCB PRINTED CIRCUIT BOARD

 Engineering Process

 Items

 Production Capability

 Laminate Board

 Board Thickness

 0.2~3.2mm

 Product Type

 Layers

 2L-16L

 Lamination

 Max. Panel size

 500×600mm

 Layers Inside

 Core Thickness inside

 0.1~2.0mm

 Internal Tracing

 Min: 4/4mil

 Internal Copper Thickness

 1.0~3.0oz

 Dimension Tolerance

 Board Thickness Tolerance  

 ±10%

 Inter layer Alignment

 ±3mil

 Drilling Tolerance

 Panel Measurement

 Max: 660×600mm

 Drilling Dimension

 ≧0.25mm

 Hole Diameter Tolerance

 ±0.05mm

 Hole Position Tolerance

 ±0.076mm

 Min.Annular Ring 

 0.05mm

 PTH+Panel Plating

 Hole Wall copper Thickness

 ≧20um

 Uniformity

 ≧90%

 Outer Layer

 Track Width

 Min: 0.08mm

 Track Spacing

 Min: 0.08mm

 Plating Pattern 

 Finished Copper Thickness

 1oz~2oz

 EING/Flash Gold

 Nickel Thickness

 2.5um~5.0um

 Gold Thickness

 0.03~0.05um

 Solder Mask

 Thickness

 15~35um

 Solder Mask Bridge

 3mil

 Length

 Line width/Line spacing

 6/6mil

 ENIG

 Nickel Thickness

 ≧120u〞

 Gold Thickness

 1~50u〞

 Beveling

 Beveling Dimension

 30~300mm

 Routing

 Tolerance of Dimension

 ±0.1mm

 Slot Size

 Min:0.4mm

 Cutter Diameter

 0.8~2.4mm

 Punching

 Outline Tolerance

 ±0.1mm

 Slot Size

 Min:0.5mm

 V-CUT

 V-CUT Dimension

 Min:60mm

 Angle

 15° 30° 45°

 Remain Thickness Tolerance

 ±0.1mm

 Hot Air Level

 Tin Thickness

 100~300u〞

 Test

 Testing Voltage

 250V

 Max.Dimension

 680×600mm

 Impedance Control

 Tolerance

 ±10%

 Aspect Ration

 12:1

 Laser Drilling Size

 4mil(0.1mm)

Contact Details
PCB Board Online Marketplace

Contact Person: admin

Send your inquiry directly to us (0 / 3000)