Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Payment & Shipping Terms:
|OEM For:||ARJE-0034||Original MPN:||LPJ3011ABNL|
|Connector Type:||RJ45||Applications:||10/100 Base-T|
|Mounting Type:||Surface Mount||Orientation:||90～ Angle (Right)|
|Termination:||Solder||Shielding:||Shielded, EMI Finger|
rj45 smt connector,
modular rj45 connectors
|LPJ3011ABNL||Surface Mount Rj45 Connector||SMD Magnetic Connector||SMT Rj45 Jack|
Designing Model: 【ARJE-0034】 Mass Production Model:【LPJ3011ABNL】
♦ Designed for network interface card application.
♦ Designed to meet IEEE802.3u requirement.
♦ Available in all turn ratios used by LAN ICmanufactures.
♦ Primary center taps available for additional EMIreduction.
♦ Simplest magnetic component to place androute on PCB.
♦ Conserves minimizing PCB space.
MAG.REVERSE LATCH ,
LED optional ; EMI-finger Optional.
1. Product Type Features:
1) Product Type = Connector
2) Jack Type = RJ45
3) Profile = Standard
4) PCB Mounting Orientation = Side Entry (Right Angle)/Top Entry(Vertical)
2. Mechanical Attachment:
1) Jack Configuration = 1 x 1
3. Electrical Characteristics:
1) Shielded = Yes
4. Termination Related Features:
1) EMI Finger - Bottom = Without
2) Termination Method = Solder
5. Body Related Features:
1) Port Configuration = Single/Multi
2) EMI Fingers -Top and Sides = With/ Without
3) Latch Orientation = Standard - Latch Down
4) PCB Tail Length
6. Contact Related Features:
1) Preloaded = Yes
2) Contact Termination Type = Through Hole/Surface Mount
7. Housing Related Features:
1) Connector Style = Jack
8. Industry Standards:
1) RoHS/ELV Compliance = RoHS compliant, ELV compliant
2) Lead Free Solder Processes = Wave solder capable to 240°C,
Wave solder capable to 260°C, Wave solder capable to 265°C
3) RoHS/ELV Compliance History = Always was RoHS compliant
9. Identification Marking:
1) Left LED Color (Position #1) = Green - 250 ohm resistor
2) Right LED Color (Position #2) = Green - 250 ohm resistor
10. Conditions for Usage:
1) Applies To = Printed Circuit Board
2) Environmental Conditions = Office / Premises
3) Operating Temperature (°C ) = 0 - 70/-40 - +85
Designed to support applications, such as ADSL modems, LAN-on-Motherboard. Networking and communication equipments such as HUB, PC card, Switch, Router, PC Mainboard, SDH, PDH, IP Phone, xDSL modem,Call Center solutions , Complex set top boxes , VOIP gateways setup,Border Gateway Protocol,fast ethernet switch ...
ARJE-0034 > LPJ3011ABNL
18 years production experience,
Flexible delivery time
Design for Ti , Intel , Samsung , Fluke , Jabil , Flextronics ,Cypress, Freescale,EKF.......
Built-in Flexible PCB Assembly; Rigid-Flexible PCB Assembly; Microelectronic, Flip Chip; Microelectronic, Chip On Board; Optoelectronic Assembly; RF / Wireless Assembly; Through Hole Assembly; Surface Mount Assembly; System Assembly; Printed Circuit Board Assembly
Other Replaceable List
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