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Flash Gold High TG Rigid PCB 2 Layer Green Solder Mask FR4 ITEQ IT180 PCB

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Good quality Flexible PCB Board
Good quality Flexible PCB Board
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Rigid PCB Board

  • High Precision Rigid PCB Board suppliers
  • High Precision Rigid PCB Board suppliers

 

 

Introduction


Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.

Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.

 


Material Types


FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base

 

 

Surface Treatment


HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger

 


Production Process

 

Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.

Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.

The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.

 


Application


LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a

Flash Gold High TG Rigid PCB 2 Layer Green Solder Mask FR4 ITEQ IT180 PCB

Flash Gold High TG Rigid PCB 2 Layer Green Solder Mask FR4 ITEQ IT180 PCB
Flash Gold High TG Rigid PCB 2 Layer Green Solder Mask FR4 ITEQ IT180 PCB

Large Image :  Flash Gold High TG Rigid PCB 2 Layer Green Solder Mask FR4 ITEQ IT180 PCB

Product Details:

Place of Origin: China
Brand Name: LT Circuit
Certification: UL E354810,SGS

Payment & Shipping Terms:

Minimum Order Quantity: NO MOQ
Price: Negotiable
Packaging Details: 20pcs/vacuum bag+export packing
Delivery Time: 5-12Days
Payment Terms: T/T,OA, L/C, Western Union
Supply Ability: Ten thousand square meters/month
Detailed Product Description
High Light:

Rigid Printed Circuit Boards

,

quick turn pcb

 

Flash Gold High TG Rigid PCB 2 Layer Green Solder Mask FR4 ITEQ IT180 PCB

 

 

High Tg PCB General Info

 

Tg means Glass Transition Temperature. As flammability of board is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of board will be affected.

 

If working temperature of your product is higher than normal (130-140C), then have to use high Tg material which is > 170C. Here are some popular High Tg board raw material in market:

 

S1170&S1000-2: SYL (Shengyi Technology);
 

Also there're a lot of different hi-tg material not listed here, different country, different company prefer using different material. Please view datasheet for each of them to choose most suitable material for you. If without special notice, normally we will use S1170 from SYL.

 

170Tg is also popular in LED industry, because heat dissipation of LED is higher than normal electronic components, and same structure of FR4 board is much cheaper than that of MCPCB. If working temperature is higher than 170/180C, such as 200C, 280C, or even higher, then you'd better use Ceramic boardwhich can go through -55~880C.

 

Please contact usfor more information about Hi Tg circuit board.

 

Heavy Copper PCB General Info

 

Heavy Copper Board does not have a set of definition per IPC. According to PCB industry, however, peopel generally use this name to identify a printed circuit board with copper conductors 3 oz/ft2 - 10 oz/ft2 in inner and/or outer layers. And Extreme heavy copper PCB refers to 20 oz/ft2 to 200 oz/ft2 printed circuit board

 

Heavy copper normally used for a various products but not limited to: high power distribution, heat dissipation, planar transformers, power convertors, and so on

 

Design Guide for Heavy Copper PCB

 

Typical conductor width/spacing/thickness tolerance is +/-20%, although tighter tolerance is achievable.

 

The minimum width and thickness of a heavy copper PCB conductor is determined primarily on the basis of the current carrying capacity required and the maximum permissible conductor temperature rise.

 

A circuit board trace, depending on its size and manufacturing process, may not be rectangular in shape. Heavy copper conductors can significantly add to the overall board thickness.

 

Additive (plating) processed are preferred to subtractive (etching) processes but are more expensive).

 

Capability of Heavy Copper PCB

Base material: FR4/Aluminum

Copper thickness: 4 OZ~6OZ

Outline: Routing, punching, V-Cut

Soldermask: White/Black/Blue/Green/Red Oil

Surface finishing: Immersion Gold, HASL, OSP

 

Description

1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

 

Application

Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries

 

Advantage

1.PCB factory directly
2.PCB Have the comprehensive quality control system

3.PCB good price
4.PCB quick turn delivery time from 48hours.
5.PCB certification(ISO/UL E354810/RoHS)

6.8 years experience in exporting service

7.PCB is no MOQ/MOV.

8.PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

 

 

High precision prototype

PCB bulk production

Max Layers

1-28 layers

1-14 layers

MIN Line width(mil)

3mil

4mil

MIN Line space(mil)

3mil

4mil

Min via (mechanical drilling)

Board thickness≤1.2mm

0.15mm

0.2mm

Board thickness≤2.5mm

0.2mm

0.3mm

Board thickness>2.5mm

Aspect Ration≤13:1

Aspect Ration≤13:1

Aspect Ration

Aspect Ration≤13:1

Aspect Ration≤13:1

Board thickness

MAX

8mm

7mm

MIN

2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm

2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm

MAX Board size

610*1200mm

610*1200mm

Max copper thickness

0.5-6oz

0.5-6oz

Immersion Gold/

Gold Plated Thickness

Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u”

 

Hole copper thick

25um 1mil

25um 1mil

Tolerance

Board thickness

Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%

Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
 Board thickness>2.0mm:+/-8%

Outline Tolerance
 

≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
 >300mm:+/-0.2mm

≤100mm:+/-0.13mm
100<  ≤300mm:+/-0.15mm
 >300mm:+/-0.2mm

Impedance

±10%

±10%

MIN Solder mask bridge

 0.08mm

 0.10mm

Plugging Vias capability

 0.25mm--0.60mm

 0.70mm--1.00mm

 

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