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FR4 Rigid HDI PCB High Frequency and High Density Interconnect PCB Circuit Board

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Good quality Flexible PCB Board
Good quality Flexible PCB Board
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Rigid PCB Board

  • High Precision Rigid PCB Board suppliers
  • High Precision Rigid PCB Board suppliers

 

 

Introduction


Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.

Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.

 


Material Types


FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base

 

 

Surface Treatment


HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger

 


Production Process

 

Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.

Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.

The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.

 


Application


LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a

FR4 Rigid HDI PCB High Frequency and High Density Interconnect PCB Circuit Board

FR4 Rigid HDI PCB High Frequency and High Density Interconnect PCB Circuit Board
FR4 Rigid HDI PCB High Frequency and High Density Interconnect PCB Circuit Board

Large Image :  FR4 Rigid HDI PCB High Frequency and High Density Interconnect PCB Circuit Board

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS
Model Number: XCER

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Detailed Product Description
Product Name: FR4 Rigid PCB Base Material: FR4
Thickness: 1.2 Mm Surface: Immersion Gold
Board Size: 13*5 Cm Application: Aerospace Defense
High Light:

rigid pcb board

,

printed pcb board

FR4 Rigid PCB High Quality HDI-001 High Frequency Circuit Boards

 

Specification:

 

Thickness

1.2mm

Model

XCER

Surface

ENIG

Origin

Shenzhen

Material

FR4

Packaging 

bubble bag 

Size

13*5cm

Brand

XCE

 

 

Quick detail:

 

Prodcction time:3-10 days

Shipping time:3-7 days according to express

 

 

Parameter

 

Through-hole resistance

<300Ωnormal

Electric strength

>1.3kv/mm

Current breakdown

10A

Peel strength

1.4N/mm

Soldmask regidity 

>6H

Thermal stress

288℃20Sec

Testing voltage

50-300V

Min buried blind via

0.2mm(8mil)

Outer copper thickness

1oz-5oz

Inner cooper thickness

1/2 oz-4oz

Min green oil open window

0.05mm

Insulation layer thickless

0.075mm-5mm

Taphole aperture

0.2mm-0.6mm

Special technology

Indepedance,Blind buried via,thick gold,aluminum PCB

Surface finish

Immersion Gold

 

 

Board thickness tolerance

T≥0.8mm±8%.,T<0.8mm±5%

Wall hole copper thickness

>0.025mm(1mil)

Finished hole

0.2mm-6.3mm

PTH aperture tolerance

±0.075mm(3mil)

NPTH aperture tolerance

±0.05mm(2mil)

Hole site deviation

±0.05mm(2mil)

Profile tolerance

±0.10mm(4mil)

Board bend&warp

≤0.7%

Insulation resistance

>1012Ωnormal

 

 

 

Advantage:

 

12 years pcb production experience

Full series high frequency pcb material raw

Newest production machine and top technology

experienced and professional teams

 

 

Description:

 

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave 

pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of 

printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers 

on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our

 ustomers that we will return the favors with more and more superior products in the near future.

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