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Green Solder Mask 8 Layer etching circuit boards , multi layer pcb

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Good quality Flexible PCB Board
Good quality Flexible PCB Board
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Multilayer PCB Board

  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers

Introduction

 

Multilayer printed circuit boards (PCBs) represented the next major evolution in fabrication technology. From the base platform of double sided plated thru came a very sophisticated and complex methodology that would again allow circuit board designers a dynamic range of interconnects and applications.

Multilayer circuit boards were essential in the advancement of modern computing. The multilayer PCB basic construction and fabrication are similar to micro chip fabrication on a macro size. The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills. Multilayer can be built on ceramic, copper, and aluminum. Blind and buried vias are commonly produced, along with pad on via technology.

 

 

Production Process

 

1. Chemical Clean

 

In order to obtain good quality etched pattern, it is necessary to ensure a strong bond of the resist layer and the substrate surface, a substrate or a surface oxide layer, oil, dust, fingerprints and other dirt. Therefore, before the resist layer is first applied to the surface of the board and the copper foil surface cleaning roughened layer reaches a certain degree.
Inner plate: started four panels, the inner (second and third layers) is a must do first. The inner sheet is made of glass fiber and epoxy resin-based composite upper and lower surfaces of the copper sheet.

 

 

 

2. Cut Sheet Dry Film Lamination

 

Coating a photoresist: we need to make the shape of the inner plate, we first affixed dry film (resist, photoresist) over the inner layer sheet. The dry film is a polyester thin film, a photoresist film and a polyethylene protective film composed of three parts. When the foil, the dry film starting with a polyethylene protective film is peeled off, and then under the conditions of heat and pressure in the dry film is pasted on copper.

 


3. Image Expose & Image Develop

 

Exposure: In the UV irradiation, photoinitiators absorb light decompose into radicals, radical photopolymerization initiator and then polymerizing the monomer to generate a crosslinking reaction, forming insoluble in dilute alkali solution after the reaction of the polymer structure. Polymerization to continue for some time, in order to ensure the stability of the process, not to tear immediately after exposure polyester film should stay more than 15 minutes to the polymerization reaction to proceed, before developing torn polyester film.
Developer: the reaction active groups solution unexposed portions of the photosensitive film with a dilute alkali-soluble matter dissolved production down, leaving the already hardened by crosslinking the photosensitive pattern portion

 

 

4. Copper Etch

 

In flexible printed boards or printed board manufacturing process, the chemical reaction to the copper foil portion not to be removed, so as to form a desired circuit pattern of copper beneath the photoresist is not etched retained impact.

 

 

5. Strip Resist & Post Etch Punch & AOI Inspection & Oxide

 

The purpose of the film is to etch the board retained after clearing the resist layer so that the following copper exposed. "Film slag" filter and recycle waste shall be disposed of properly. If you go after the film can be washed completely clean, you might consider not pickling. Finally, the board is completely dry after washing, avoid residual moisture.

 

 

6. Layup with prepreg

 

Before entering pressure machine, the need to use all of multilayer materials ready to pack (Lay-up) In addition to the inner handle the job has been oxidized, but still need a protective film film (Prepreg) -. Epoxy resin impregnated glass fibers. Role of laminations is a certain order to the board covered with a protective film since the stacked and placed between the floor plate.

 

 

7. Layup with copper foil & Vacuum Lamination Press

 

Foil - to present the inner sheet and then covered with a layer of copper foil on both sides, and then the multilayer pressurization (within a fixed period of time necessary to measure the temperature and pressure extrusion) was cooled to room temperature after completion of the remaining is a multi-layer sheet of together.

 

 

8. CNC Drill

 

Under the conditions of the inner precision, CNC drilling drilling depending on the mode. Drilling high precision, to ensure that the hole is in the correct position.

 

 

9. Electroless Copper

 

In order to make the through-hole between the layers can be turned on (the resin and glass fiber bundle of a non-conductive portion of the wall of the hole metallization), the holes must be filled in the copper. The first step is a thin layer of copper plating in the hole, this process is completely chemical reaction. Final plated copper thickness of 50 inches millionth.

 

 

10. Cut Sheet & Dry Film Lamination

 

 

Photoresist coating: We have one in the outer coating of the photoresist.

 

 

11. Mage Expose & Image Develop

 

Outer exposure and development

 

 

12. Copper Pattern Electro Plating

 

This has become a secondary copper, the main purpose is to thicken the line of copper and copper vias thick.

 

 

13. Tin Pattern Electro Plating

 

Its main purpose is an etching resist, protect it covers the copper conductors will not be attacked (internal protection of all copper lines and vias) in alkaline corrosion of copper.

 

 

14. Strip Resist

 

We already know the purpose, just use the chemical method, the surface of the copper is exposed.

 

 

15. Copper Etch

 

We know that the purpose of protecting the tin partially etched foil below.

 

 

16. LPI coating side 1 & Tack Dry & LPI coating side 2 & Tack Dry & Image Expose & Image Develop & Thermal Cure Solder mask

 

Solder mask is exposed to the pads used, it is often said that the green oil, oil is actually digging holes in the green, the green oil does not need to cover the pads and other exposed areas. Proper cleaning can get a suitable surface features.

 

 

17. Surface finish

 

HASL solder coating HAL (commonly known as HAL) process is first dipped on the PCB flux, then dipping in molten solder, and then from between two air knives by compressed air with a knife in the heat air to blow off excess solder on printed circuit board, at the same time eliminate excess solder metal hole, resulting in a bright, smooth, uniform solder coating.
Gold Finger, purpose-designed Edge Connector, plug the connector as board liaison foreign exports, and therefore need to cheat the process. Chose gold because of its superior conductivity and oxidation resistance. However, because the cost of gold applies only to cheat so high, local gold plated or chemically.

 

Green Solder Mask 8 Layer etching circuit boards , multi layer pcb

Green Solder Mask 8 Layer etching circuit boards , multi layer pcb
Green Solder Mask 8 Layer etching circuit boards , multi layer pcb

Large Image :  Green Solder Mask 8 Layer etching circuit boards , multi layer pcb

Product Details:

Place of Origin: China
Brand Name: EastPCB
Certification: UL,RoHS,ISO9001,ISO14001,TS16949

Payment & Shipping Terms:

Minimum Order Quantity: 1 pcs
Price: By size, technology and quantity
Packaging Details: Vacuum sealed package
Delivery Time: 3-6 days
Payment Terms: PayPal / Western Union / Credit card / Bank
Shipping Way: By Air , DHL / FedEx / UPS / TNT
Detailed Product Description
High Light:

multi circuit boards

,

High Density PCB

 Green Solder Mask 8 Layer etching circuit boards , multi layer pcb

 

 

 

> Brand Name:    East PCB

> Material:           FR4

> Layer Count:    8 layers

> Board Thickness:       2.5 mm

> Copper Thickness:     1OZ

> Surface Finish:     Immersion Gold (RoHS)

> Solder Mask:        Green (top&bot)

> Silkscreen:           White screen (top&bot)

> Min drill/pad:         0.3mm/ 0.5mm

> Other:                    Remote Control

> Certification:          UL, RoHS, ISO9001,

                                ISO14001, TS16949

 

 

 

 

Quick Turn PCB prototype

 

In order to help customers to reduce the R&D period and be the winner in the market,

we provide quick turn PCBs, both prototypes and small volume production batches.

With our quick response and the professional service of dedicated quick-turn PCB manufacturers, we can supply PCBs within one week as normal, and 3 days in urgent situations.

 

 

Low cost PCB

 

Do you wonder how much you could be saving on prototyping PCB and low or mid volume PCB production.

 

> The tooling cost be charged only once, when repeat order, it is FREE!

 

> All of solder mask include White, Yellow, Red etc. is FREE!

 

> HASL ( Lead Free ) Surface Finish is FREE!

 

> E-testing is FREE!

 

> Technical support is FREE!> Gerber file of the paste mask (Stencil) is FREE!

 

> Highly competitive prices once volume PCB Production coming!

 

> Better discount rates from DHL can save more shipping cost!

 

> High quality PCB product in order to bring about real and significant cost savings!

 

   Now is the time to find out.

 

 

 

 

Now get best PCB boards and Price from East PCB.

 

> Prototypes PCB builds, reduce your prototyping cost with our great quotation.

 

> Ready to production, no repeat tooling cost.

 

> Faster lead time, Best service.

 

> Quote now, get more cheaper price

 

 

 

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