Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Payment & Shipping Terms:
|Number Of Layers:||6-Layer||Base Material:||FR4|
|Copper Thickness:||1oz||Board Thickness:||1.6mm|
|Min. Hole Size:||0.1mm||Min. Line Width:||0.1mm|
|Min. Line Spacing:||0.1mm||Surface Finishing:||ENIG|
|Solder Mask Color:||Green|
rigid printed circuit board,
electronic circuit board
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Component Procurement & Material Management
- Product Design
- Fast Track Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
- Function Testing Service
We have adapted and developed our capabilities and skill set to meet every customer requirement, from the manufacture of a selective item through to complete project management. With rich experience within pcb fabrication, components sourcing and pcb assembly service. As a professional pcb&pcba manufacturer, To reach the highest quality and most exacting standards is our mission.
Take advantage of our strength and experience and allow us to help you maintain your competitive edge. we are well positioned to support our customers through the entire product life cycle, from concept to volume production.
1.Printed Circuit Board process capability:
|1||Layers||Single Sided,2 to 18 Layer|
|2||Board material type||FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more|
|3||Compound material lamination||4 to 6 layers|
|4||Maximum dimension||610 x 1,100mm|
|6||Board thickness coverage||0.2 to 6.00mm|
|7||Board thickness tolerance||±10%|
|8||DK thickness||0.076 to 6.00mm|
|9||Minimum line width||0.10mm|
|10||Minimum line space||0.10mm|
|11||Outer layer copper thickness||8.75 to 175µm|
|12||Inner layer copper thickness||17.5 to 175µm|
|13||Drilling hole diameter (mechanical drill)||0.25 to 6.00mm|
|14||Finished hole diameter (mechanical drill)||0.20 to 6.00mm|
|15||Hole diameter tolerance (mechanical drill)||0.05mm|
|16||Hole position tolerance (mechanical drill)||0.075mm|
|17||Laser drill hole size||0.10mm|
|18||Board thickness and hole diameter ratio||10:1|
|19||Solder mask type||Green, Yellow, Black, Purple, Blue, White and Red|
|20||Minimum solder mask||Ø0.10mm|
|21||Minimum size of solder mask separation ring||0.05mm|
|22||Solder mask oil plug hole diameter||0.25 to 0.60mm|
|23||Impedance control tolerance||±10%|
|24||Surface finish||Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger|
♦ All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us.
Samples:4 to 5 days Mass produce:7 to 15 days depend on your PCB orders
T/T, WEST UNION, Paypal Accepted
250000 Squre meter per year
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