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High Performance Flex PCB Membrane Switch , 25-100ma Rated Current

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Rigid Flex PCB

  • High Precision Rigid Flex PCB suppliers
  • High Precision Rigid Flex PCB suppliers

Introduction


Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.

Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.

 

 

Production Process


Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.

Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.

The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.

 

 


Applications


Rigid flexible PCBs offer a wide array of applications, ranging from military weaponry and aerospace systems to cell phones and digital cameras. Increasingly, rigid flex board fabrication has been used in medical devices such as pacemakers for their space and weight reduction capabilities. The same advantages for rigid flex PCB usage can be applied to military weaponry and weapon control systems.

In consumer products, rigid flex doesn't just maximize space and weight but greatly improves reliability, eliminating many needs for solder joints and delicate, fragile wiring that are prone to connection issues. These are just some examples, but rigid flex PCBs can be used to benefit nearly all advanced electrical applications including testing equipment, tools and automobiles. Not sure what technology needs to be used for your project? Call our experts and we can help you figure out whether you need rigid flex, flex or HDI PCB technology.

High Performance Flex PCB Membrane Switch , 25-100ma Rated Current

High Performance Flex PCB Membrane Switch , 25-100ma Rated Current
High Performance Flex PCB Membrane Switch , 25-100ma Rated Current

Large Image :  High Performance Flex PCB Membrane Switch , 25-100ma Rated Current

Product Details:

Place of Origin: China
Brand Name: TKM MS
Certification: ISO9001:2008, SGS,Rohs
Model Number: TKM--MS--110

Payment & Shipping Terms:

Minimum Order Quantity: 100pcs
Price: negotiation
Packaging Details: Polybag per pcs,50per cartoon
Delivery Time: 15-20days
Payment Terms: T/T or L/C, Western Union
Supply Ability: 100000Pieces per month
Detailed Product Description
Material: Black PET PIN: Two PIN
Shape: Oval Adhesive: DP
High Light:

Push Button membrane switch

,

membrane keyboard switch

 

High Performance Flex PCB Membrane Switch , 25-100ma Rated Current

 

 

Quick Detail:

 

Type

PCB

Application

Electronic Products

Color

blue

Feature

  • Energy-efficient & Low power

Machine Stiffness

Rigid

Lays

 

1-26

Material

PET /PC

I nsulation Material

Organic resin

I nsulation layer thichness

General

Antiflaming Speciality

VO

Processing Technic

Electrolytic foil

Reinforcing material

Glass fiber

Insulating Resin

Phenolic

Export Markets

Global

 

 

Description:

 

1. Copper foil substrate (Copper Film)
Copper foil: basically divided into two kinds of electrolytic copper and rolled copper common thickness 1oz 1/2oz and 1/3 oz
Substrate film: a common thickness of the 1mil with 1/2mil two kinds.
Glue (adhesive): thickness according to customer requirements.

 

2. Cover film protection film (Cover Film)
Cover film protection film: surface insulation. The common thickness 1mil with 1/2mil.
Glue (adhesive): thickness according to customer requirements.
Adhesive buildup of foreign matter before pressing the shape from the paper: avoid; easy job.

 

3. Stiffener (PI Stiffener Film)
Stiffener: reinforcing the mechanical strength of the FPC, to facilitate the surface mounting job. Common thickness 3mil to 9mil.
Shape from the paper: to avoid foreign matter adhesive buildup Crimping before the.

 

4. EMI: electromagnetic shielding film, the protection circuit board line without interference from the outside world (a strong electromagnetic District or susceptible to interference zone).
 

 

Applications: 


1. Disk drives
Regardless of the hard disk, or diskette, is very dependent on FPC high softness and thickness of the 0.1 mm slim, read data finish quickly. Either a PC or NOTEBOOK.


2. Computer and LCD screen
Use the one line configuration of flexible circuit boards, and thin thickness. The digital signal into the picture, through the LCD screen


3. CD player
Focuses on three dimensional assembly characteristics of flexible circuit boards and thin thickness. The huge CD to carry around


4. The mobile phone
Focuses on the flexible circuit board light weight and thin thickness. Can effectively save the volume of products, easy connection of the battery, microphone, and buttons and into one.

 


5. The latest applications
Hard disk drives (HDDS, hard disk drive) of suspended circuit (Su ensi. N cireuit) and the components of xe packaging board, etc

 

 

Specifications

 

As per request OEM/OEM

 

Material:pi

1 mil

Cu:

1 oz

PI:

1 mil

Surface treatment:

pure-tin plating

Minimum hole dimension:

0.3mm

Minimum linear width:

0.08mm

Minimum linear distance:

0.08mm

External tolerance:

+/-0.05mm

Welding resistance:

280 more than 10 seconds

Peeling Strength:

1.2kg/cm2

Heat resistance:

-200 to +300 degrees C

Surface resistivity:

1.0 x 1011

Bandability:

meet IPC standard

Chemical resistance:

meet IPC standard

 

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