Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Payment & Shipping Terms:
|Board Size:||18*12 Cm||Board THK:||1.2mm|
rigid pcb board,
printed pcb board
Power Amplifier Rigid Multilayer PCB Bare Board With 1.2mm THK
|Place of Origin:||
Guangdong, China (Mainland)
|Brand Name:||XCE||Model Number:||XCER|
|Number of Layers:||
inner layers 1oz, outer layers 1.5oz
|Min. Hole Size:||
|Min. Line Width:||
|Min. Line Spacing:||
|NPTH aperture tolerance||±0.05mm(2mil)|
|Hole site deviation||±0.05mm(2mil)|
|Min buried blind via||0.2mm(8mil)|
|Outer cooper thickness||1oz-5oz|
|Inner cooper thickness||1/2 oz-4oz|
|SMT min green oil width||0.08mm|
|Min green oil open window||0.05mm|
|Insulation layer thickness||0.075mm-5mm|
Why choose us:
Product design: as per customer's drawing or sample
Production equipment: machining center, CNC engraving milling machine, CNC, lathe machine, milling machine, punching machine, CNC milling machines, centerless grinding, and many other precision equipment.
QC system: 100% inspection before shipment.
Packaging: vacuum bag, single polybag, bubble bags, wooden case or as requests.
Our company with good quality and sincere services.
|Min board thickness||2 layer 0.2mm|
|4 layer 0.4mm|
|6 layer 0.6mm|
|8 layer 0.8mm|
|10 layer 1.0mm|
|Max panel size||508*610mm|
|Board thickness tolerance||T≥0.8mm±8%,T＜0.8mm±5%|
|Wall hole copper thickness||＞0.025mm(1mil)|
|Min line width||4mil/4mil(0.1/0.1mm)|
|Min bonding pad space||0.1mm(4mil)|
|PTH aperture tolerance||±0.075mm(3mil)|
Contact Person: admin