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Material
FR4 fiberglass panels, aluminum plate, copper substrate, iron substrate, PTFE, F4B, F4BM, Kangtai Li, CER-10, Rogers, FPC soft board and some other high-precision plate.
Crafts
Light copper, nickel, gold, tin spray; Immersion Gold, antioxidant, HASL, immersion tin, etc.
Double Layer PCB Leadfree HASL with blue solder mask
- Leadfree HASL Surface finish required to meet ROHS compliant
-FR-4 material with 0.25mm-6mm boards thickness
-Copper weight:1/3OZ,0.5OZ,1OZ,2OZ,3OZ,4OZ,5OZ,6OZ
-3-3mils min track width & spacing -0.2mm min finished hole size
-Certificate: UL,ISO14001,TS16949 and ROHS
-Company management: ISO9001
-Markets: Europe, America, Asia,etc.
Application
electronic products, like
computer peripherals,aerospace,telecommunication,automotives,medicaldevices,camermas,optoelectronic devices,VCD,LCD and verious other comsumer electronic products.
Product Details:
Payment & Shipping Terms:
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| Base Material: | FR-4 | Copper Thickness: | 0.5--5OZ |
|---|---|---|---|
| Board Thickness: | 0.2--6mm | Min. Hole Size: | 0.1mm |
| Min. Line Width: | 4mil | Min. Line Spacing: | 4mil |
| Surface Finishing: | HAL,Lead Free HAL,Immersion Gold, OSP,Immersion Tin,Immersion Silver | Color: | Green, Black, Blue, Red Or You Need . |
| High Light: | two layer pcb,2 layer pcb |
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PCB Assembly
Military standard assembly
Minimum lead time for assembly is only 3 days
Turnkey service(PCB manufacture, components procurement and assembly)
Prototype building, No Minimum quantity Required
Reliable Parts
Surface mount, through hole, BGA, QFP, QFN …
ROHS compliant and lead-free process
PCB Capability
Material: FR4, High TG FR4, Halogen Free material, Rogers HF material, etc.
Layer counts: 2-28 layers
Finished Copper Thickness: 0.5-5 OZ
Finished Board Thickness: 0.2-6.0mm
Min. Line/Track Width: 4mil
Min. Line/Track Space: 4mil
Min. Contour Tolerance: +/-0.1mm
Min. Finished Diameter of PTH Hole: 0.2mm
Max. Board Thickness/Hole Ratio: 12:1
Min. Solder Mask Bridge: 4mil (Min. SMT Pad Space 8mil)
Min. Legend (Silk screen) Track Width: 5mil
Min. Legend (Silk screen) Height: 30mil
Min. drilling slot size: 0.6mm
Solder mask color: green, black, blue, white, yellow, purple, and matt, etc.
Solder mask hardness: 6H
Legend/Silk screen Color: white, yellow, black, etc.
Surface Treatment: HAL, Lead Free HAL, Immersion gold, OSP, Immersion tin, Immersion silver, etc.
Other Technology: Gold finger, peelable mask, Non-across blind/buried vias, characteristic impedance control, Rigid-flex board etc.
Reliability Test: flying probe test/fixture test, impedance test, solderability test, thermal shock test, hole resistance test, and micro metallographic section analysis, etc.
Wrap and twist: ≤0
Flammability: 94V-0
4. Professional engineering staff to provide technical support.
5.OEM and ODM service are welcome.
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NO |
ITEM |
Technical capabilities |
|
1 |
Layers |
2-20 layers |
|
2 |
Max. Board size |
2000×610mm |
|
3 |
Min. board Thickness |
2-layer 0.15mm |
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4-layer 0.38mm |
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6-layer 0.55mm |
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8-layer 0.80mm |
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10-layer 1.0mm |
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|
4 |
Min. line Width/Space |
0.075mm(3mil) |
|
5 |
Max. Copper thickness |
6OZ |
|
6 |
Min. S/M Pitch |
0.075mm(3mil) |
|
7 |
Min. hole size |
0.1mm(4mil) |
|
8 |
Hole dia. Tolerance (PTH) |
±0.05mm(2mil) |
|
9 |
Hole dia. Tolerance (NPTH) |
+0/-0.05mm(2mil) |
|
10 |
Hole position deviation |
±0.05mm(2mil) |
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11 |
Outline tolerance |
±0.10mm(4mil) |
|
12 |
Twist & Bent |
0.75% |
|
13 |
Insulation Resistance |
>1012 Ω Normal |
|
14 |
Electric strength |
>1.3kv/mm |
|
15 |
S/M abrasion |
>6H |
|
16 |
Thermal stress |
288°C 20Sec |
|
17 |
Test Voltage |
50-300V |
|
18 |
Min. blind/buried via |
0.15mm (6mil) |
|
19 |
Surface Finished |
HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
|
20 |
Materials |
FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
