Material
FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
Surface Treatment
HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Advantage
1.PCB factory directly
2.PCB high quality
3.PCB good price
4.PCB quick time
5.PCB certification(ISO/UL E354810/RoHS)
Capability:
-High Frequency (TACONIC material)/TG/Density/precision impedance controlled boards
-Heavy Copper PCB, Metal based PCB. Hard Gold PCB, Blind &Buried vias boards,
Halogen Free PCB, Aluminum-backed Boards
-Gold finger+ HAL & Leadfree HASL PCB, Leadfree compatible PCB
Product Details:
Payment & Shipping Terms:
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Base Material: | FR4 | Copper Thickness: | 1 OZ |
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Board Thickness: | 1.6 Mm | Min. Hole Size: | 0.1 Mm |
Min. Line Width: | 3 Mil | Min. Line Spacing: | 3 Mil |
Surface Finishing: | ENIG, HASL, OSP, Immersion Tin | ||
High Light: | high density board,hdi circuit boards |
HASL LF HDI Buried Blind Print Circuit Board PCB
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Application | ||
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Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345