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FR4 10 Layers Prototype Cell Phone PCB Board Gold Plating , ENIG / 1.2mm Thickness

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Good quality Flexible PCB Board
Customer Reviews
The board quality is very good! We have been WonDa’s customer for more than 4 years. Your good service and quality is too good.

—— Jay

Cooperation is very satisfactory and the Company of the past few years, we are very willing to continue long-term cooperation.

—— Rob

The board quality is very good! I’m surprised with the low cost and quick delivery. It is totally out of my expectation. I will definitely come back.

—— Victoria, Australia

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Cell Phone PCB

  • High Precision Cell Phone PCB suppliers

 

Introduction


We can make single/double sided board, multi-layer board, high density board, including MLB with blind/buried via holes

 


Main Base Material


FR-1, FR-2, FR-4, CEM-1, CEM-3, High Frequency Laminate with various dielectric constant (imported or from local supplier), Aluminum base laminate, Metal core Aluminum
We choose the best base material suppliers as our partners, such as KB and Shengyi to guarantee our products with high quality.

 


Surface Finish


Hot air Lev p lead free HASL, immersion gold/silver/tin, plating gold, OSP

 


Board Thickness


Inner core thickness 0.15-1.5mm, finished board thickness 0.20-3mm

 

 

Service

 

*- Comprehensive documents audit to prevent mistakes in PCB Gerber and Bom.

*- Suggest best quality replacement with lower price.

*- Engineering support for test and provide suggestions for mass production.

*- Suggest best shipment method.

*- Sign NDA to keep your design safe.

Cell Phone PCB Sample Introduction

FR4 10 Layers Prototype Cell Phone PCB Board Gold Plating , ENIG / 1.2mm Thickness

China FR4 10 Layers Prototype Cell Phone PCB Board Gold Plating , ENIG / 1.2mm Thickness Supplier

Large Image :  FR4 10 Layers Prototype Cell Phone PCB Board Gold Plating , ENIG / 1.2mm Thickness

Product Details:

Place of Origin: shen zhen ,china
Brand Name: WonDa
Certification: CE, ROHS, UL

Payment & Shipping Terms:

Minimum Order Quantity: None
Price: Negotiable
Packaging Details: Vacuum bag + Outer carton
Delivery Time: 5-15 days
Payment Terms: L/C,T/T,Paypal
Supply Ability: 10000 Sq.meter/month
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Detailed Product Description
Number Of Layers: 10-Layer Base Material: FR4
Copper Thickness: 1OZ Board Thickness: 1.2mm
Min. Hole Size: 0.2mm Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm Surface Finishing: ENIG
Soldermask Colour: Blue/white/green/yellow... Process Finish: OSP, HASL, Gold Plating, ENIG
Other Service: PCB Copy, PCB Assembly Service

FR4 10 Layers Prototype Cell Phone PCB Board Gold Plating , ENIG / 1.2mm Thickness

 

Specifications

 
1.Multi-layer pcb
2.UL,SGS,ROHS,IS09001,CEC
3.Fast delivery with high quality
4.12 years in Pinted circuit board


 

1.Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly


2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180


3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
 

 

Advantage

 

1.PCB factory directly
2.PCB Have the comprehensive quality control system
3.PCB good price
4.PCB quick turn delivery time from 48hours.
5.PCB certification(ISO/UL E354810/RoHS)
6.8 years experience in exporting service
7.PCB is no MOQ/MOV.
8.PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

 

The information about our company's process capacity for your reference:

 

 

Specification Inch (mm) 

Material

FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium

Layer No.

1-30

Board thickness

0.015"(0.4mm)-0.125"(3.2mm)

 

Board Thickness Tolerance

±10%

Cooper thickness

1/2OZ-3OZ

Impedance Control

±10%

Warpage

0.075%-1.5%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

 

Min Trace Width (a)

0.005"(0.125mm)

Min Space Width (b)

0.005"(0.125mm)

Min Annular Ring

0.005"(0.125mm)

SMD Pitch (a)

0.012"(0.3mm)

BGA Pitch (b)

0.027"(0.675mm)

Regesiter torlerance

0.05mm

 

Min Solder Mask Dam (a)

0.005"(0.125mm)

Soldermask Clearance (b)

0.005"(0.125mm)

Min SMT Pad spacing (c)

0.004"(0.1mm)

Solder Mask Thickness

0.0007"(0.018mm)

 

Hole size

0.01"(0.25mm)-- 0.257"(6.5mm)

Hole Size Tol (+/-)

±0.003"(±0.0762mm)

Aspect Ratio

6:1

Hole Registration

0.004"(0.1mm)

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel  3-7um  Au:1-3u''

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

±0.004''(±0.1mm)

Beveling

30°45°

V-cut

15° 30° 45° 60°

Certificate 

ROHS  ISO9001:2000  TS16949  SGS  UL

 

 

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