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Material
FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
Surface Finish
HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek)
Description
1. Complete products contract PCB assembly and manufacturing services
2. Circuit boards 2 to 30 layers PCB layout, fabrication, PCB assembly and box build
3.Active and passive components source is directly from original manufacturer
4. Enclosure cabinet case plastic injection molding, metal stamping, manufacture and assembly
5. High-precision 0201 size components SMT technology and lead-free
6. RoHS technology SMT process
7. IC pre-program
8. High-precision E-Testing include: ICT in circuit, BGA repaire device, etc.
Prototype and Mass Printed Board Assembly (PCBA)
Services:
1.Single-sided, double side & multi-layer PCB with competitive price, good quality and excellent service.
2. Cem-1, fr-4, fr-4 high tg, aluminum base material.
3. Hal, hal lead free, immersion gold/ silver/tin, osp surface treatment.
4.100% e-test.
Product Details:
Payment & Shipping Terms:
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| Base Material: | FR-4 | Board Thickness: | 1.0mm |
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| Layer Count: | 4-Layer | ||
| High Light: | custom pcb boards,electronic printed circuit board |
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| Place of Origin: | China (Mainland) | Brand Name: | OEM | Number of Layers: | 4-Layer |
| Base Material: | FR-4 | Copper Thickness: | 35um | Board Thickness: | 1.0mm |
| Min. Hole Size: | 0.25mm | Min. Line Width: | 4mil | Min. Line Spacing: | 4mil |
| Surface Finishing: | Lead Free HAL |
1. Shengyi base material
2. Board thickness:1mm
3. Free sample
4. Best price and high quality
Below information about our company's process capacity for your reference:
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Product Categories: |
single/double sided board, multi-layer board, high density board, including MLB with blind/buried via holes |
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Main base material: |
FR-1, FR-2, FR-4, CEM-1, CEM-3, High Frequency Laminate with various dielectric constant (imported or from local supplier), Aluminum base laminate, Metal core Aluminum |
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Surface Finish: |
Hot air Lev p lead free HASL, immersion gold/silver/tin, plating gold, OSP |
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Board Thickness: |
Inner core thickness 0.15-1.5mm, finished board thickness 0.20-3mm |
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Copper Foil Thickness: |
1/3 OZ–6OZ (18um – 210um) |
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Min. hole size: |
0.2mm/8mil |
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Min. line width: |
0.1mm/4mil |
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Min. spacing: |
0.1mm/4mil |
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Maximum Size: |
600mm x 10000mm |
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Min. Size: |
5mm x 10mm |
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Solder Mask Type: |
Liquid photo-imageable, Thermosetting solder, UV solder mask |
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Outline Tolerance: |
±0.13mm(r0. ±0.13mm(routing), ±0.05mm(punching) |
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Inner Layer registration tolerance: |
±0.05mm |
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Production capacity per month: |
≥15000sqm |
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
