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Material
FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
Surface Treatment
HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Advantage
1.PCB factory directly
2.PCB high quality
3.PCB good price
4.PCB quick time
5.PCB certification(ISO/UL E354810/RoHS)
Capability:
-High Frequency (TACONIC material)/TG/Density/precision impedance controlled boards
-Heavy Copper PCB, Metal based PCB. Hard Gold PCB, Blind &Buried vias boards,
Halogen Free PCB, Aluminum-backed Boards
-Gold finger+ HAL & Leadfree HASL PCB, Leadfree compatible PCB
Product Details:
Payment & Shipping Terms:
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| High Light: | high density board,hdi circuit boards |
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FR4 tg170 6 Layer HASL / Lead free HASL Immersion Gold HDI Multilayer PCB with Red Mask
(1) material:FR4 tg170 thickness: 1.6mm
(2) Layer account: 6layers
(3) solder mask:red
(4) surface: ENIG
(5) size: 150mm*130mm
(6) place of Original: China
(7) FASTPCBA
(8) model number: HDI PCB11
(9) certification: UL
(10) MOQ: 10pcs
(11) Price:
(12) Packaging Details: ESD
(13) Delivery Time: 1 week
(14) Payment Terms: T/T in advance
(15) Supply Ability: 20Kpcs/month for food cleaning inspection machine with 8 Channels
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Reference- Our production capability for Rigid PCB:
1) layer: 1-22
2) Board finished thickness: 0.2mm-7.0mm
3) Material: FR-4, CEM-3, High TG, FR4 Halogen Free, Rogers.
4) Max. Finished board size: 580mm*900mm
5) Min hole size: 4mil(0.1mm)
6) Min trace width/space: 3.5mil/3.5mil
7) Surface finishing/treatment: HASL/Lead free HASL, Immersion Gold, Gold plating, Immersion silver, immersion Tin, OSP.
8) Copper thickness: 0.5oz to 6oz.
9) Solder mask color: Green/Yellow/Black/White/Red/Blue.
10) Copper thickness in hole: >18um
11) Inner packing: Vacuum packing/plastic bag
12) Outline tolerance:+/-0.13mm
Hole size tolerance: PTH+/-0.076mm NPTH:+/-0.05mm.
13) Quality ensure: UL approval, TS16949:2002
14) Special requirements: Buried and Blind vias, impedance control, via plug, BGA soldering, Gold finger.
15) Profiling: punching, Routing, V-cut, Beveling.
16) Provides OEM services to all sorts of printed circuit board assembly as well as Electronic encased products, and PCBA application from communication, medical, security and industrial control.
17) Assembly capacity:
Min soldering size: 0201
Capacity/day: 700, 000 points
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
