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FR4 FR1 CEM3 SMD PCB Board Assembly With Immersion Silver BGA Multi Layer

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PCB Board Assembly

  • High Precision PCB Board Assembly suppliers
  • High Precision PCB Board Assembly suppliers

 

 

 

Introduction

 

PCB Assembly is a process that requires knowledge not just of PCB components and assembly but also of printed circuit board design, PCB fabrication and a strong understanding of the final product. Circuit board assembly is just one piece of the puzzle to delivering the perfect product the first time.
San Francisco Circuits is a one-stop solution for all circuit board services so we are often entrenched with the PCB production process from design to assembly. Through our strong network of well-proven circuit assembly and manufacturing partners, we can provide the most advanced and nearly limitless capabilities for your prototype or production PCB application. Save yourself the trouble that comes with the procurement process and dealing with multiple components vendors. Our experts will find you the best parts for your final product.

 


PCB Assembly Services:


Quick-turn prototype assembly
Turn-key assembly
Partial turn-key assembly
Consignment assembly
RoHS compliant lead-free assembly
Non-RoHS assembly

Conformal coating
Final box-build and packaging

 

 

PCB Assembly Process


Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

 


Testing Services


X-Ray (2-D and 3-D)
BGA X-Ray Inspection
AOI Testing (Automated Optical Inspection)
ICT Testing (In-Circuit Testing)
Functional Testing (at the board & system level)
Flying Probe

 


Capabilities


Surface Mount Technology / Parts (SMT Assembly)
Through-Hole Device / Parts (THD)
Mixed Parts: SMT & THD assembly
BGA / Micro BGA / uBGA
QFN, POP & lead-less chips
2800 pin-count BGA
0201 / 1005 passive components
0.3 / 0.4 Pitch
PoP Package
Flip-chip under-filled CCGA
BGA Interposer / Stack-up
and more…

 

 

 

FR4 FR1 CEM3 SMD PCB Board Assembly With Immersion Silver BGA Multi Layer

FR4 FR1 CEM3 SMD PCB Board Assembly With Immersion Silver BGA Multi Layer
FR4 FR1 CEM3 SMD PCB Board Assembly With Immersion Silver BGA Multi Layer

Large Image :  FR4 FR1 CEM3 SMD PCB Board Assembly With Immersion Silver BGA Multi Layer

Product Details:

Place of Origin: China
Brand Name: SYF
Certification: UL,ISO9001:2008,ROHS,REACH, HALOGEN FREE,SGS
Model Number: SYF-202
Characteristic Service: ODM/OEM/PCBA
Features 1: Gerber file needed
Features 2: 100% E-test
Features 3: Quality guarantee and professional after-sale service

Payment & Shipping Terms:

Payment Terms: L/C,T/T,Paypal
Detailed Product Description
High Light:

smt pcb assembly

,

pcb prototype assembly

 

FR4 FR1 CEM3 SMD PCB Board Assembly With Immersion Silver BGA Multi Layer

 

 

Details:

 

1. One of the largest and professional PCB (Printed Circuit Board) manufacturers  in China with over 500 staff and 20 years’experience.

2. All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver,  Immersion Tin, Immersion Gold, Lead-free HASL,HAL.

3. BGA,Blind&Buried Via and Impedance Control is accepted.

4. Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine, CNC drilling machine,Auto-PTH line,AOI(Automatic Optic Inspection),Probe Flying Machine and so on.

5. Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.

6. One of the professional SMT/BGA/DIP/PCB Assembly manufacturers in China  with 20 years’experience.

7. High speed advanced SMT lines to reach chip +0.1mm on integrated circuit parts.

8. All kinds of integrated circuits is available,such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA.

9. Also available for 0201 chip placement, through-hole components insertion and finished products fabrication, testing and package.

10. SMD assembly and through-hole components insertion is accepted.

11. IC preprogramming is also accepted.

12. Available for Function verification and burn in testing.

13. Service for complete unit assembly,for example,plastics, metal box, coil, cable inside .

14. Environmental conformal coating to protect finished PCBA products.

15. Providing Engineering service as end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure.

16. Functional testing,repairs and inspection of the sub-finished and finished goods.

17. High mixed with low volume order is welcomed.

18. Products before delivery should be full quality checked, striving to 100% perfect.

19. One-stop service of PCB and SMT(PCB assembly) is supplied to our customers.

20. Best service with punctual delivery is always provided for our customers.

 

 

Key Specifications/Special Features 

1

We SYF have 6 PCB production lines and 4 advanced SMT lines with high speed.

2

All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP,  

QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach 

chip +0.1mm on integrated circuit parts.

3

We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging.

4

SMT/SMD assembly and through-hole components insertion

5

IC preprogramming

6

Function verification and burn in testing

7

Complete unit assembly (which including plastics, metal box, coil, cable inside and more)

8

Environmental coating

9

Engineering including end of life components, obsolete component replace 

and design support for circuit, metal and plastic enclosure

10

Packaging design and production of customized PCBA

11

100% quality assurance

12

High mixed, low volume order is also welcomed.

13

Full component procurement or the substitute components sourcing

14

UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant

 

 

PRODUCTION CAPABILITY OF PCB ASSEMBLY

Stencil Size Range

 756 mm x 756 mm

Min. IC Pitch

 0.30 mm

Max. PCB Size

 560 mm x 650 mm

Min. PCB Thickness

 0.30 mm

Min. Chip Size

 0201 (0.6 mm X 0.3 mm)

Max. BGA Size

 74 mm X 74 mm

BGA Ball Pitch

 1.00 mm (Min) / F3.00 mm (Max)

BGA Ball Diameter

 0.40 mm (Min) /F1.00 mm (Max)

QFP Lead Pitch

 0.38 mm (Min) /F2.54 mm (Max)

Frequency of Stencil Cleaning

 1 time / 5 ~ 10 Pieces

Type of Assembly

 SMT and Thru-hole

Solder Type

 Water Soluble Solder Paste,Leaded and Lead-free

Type of Service

 Turn-key,Partial Turn-key or consignment

File Formats

 Bill of Materials(BOM)

 Gerber Files

 Pick-N-Places(XYRS)

Components

 Passive Down to 0201 Size

 BGA and VF BGA

 Leadless Chip Carries/CSP

 Double Sided SMT Assembly

 BGA Repair and Reball

 Part Removal and Replacement

Component Packaging

 Cut Tape,Tube,Reels,Loose Parts

Testing Method

 X-RAY Inspection and AOI Test

Order of Quantity

 High Mixed,Low Volume Order is also welcomed

Remarks: In order to get accurate quote,the following information is required

1

Complete Data of Gerber Files for the Bare PCB Board.

2

Electronic Bill of Material(BOM) / Parts list detailing manufacturer's part number, quantity usage of 

components for reference.

3

Please state whether we can use alternative parts for passive components or not.

4

Assembly Drawings.

5

Functional Test Time Per Board.

6

Quality Standards Required

7

Send Us Samples (if available)

8

Date of the quote needs to be submitted

 

 

PRODUCTION CAPABILITY OF PCB

 
PROCESS Engineer

ITEMS Item

         
 PRODUCTION CAPABILITY Manufacturing Capability

Laminate

Type

FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ,
ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON

Thickness

0.2~3.2mm

Production Type

    Layer Count

2L-16L

Surface Treatment

 HAL,Gold Plating,Immersion Gold,OSP,
Immersion Silver,Immersion Tin,Lead Free HAL

 Cut Lamination

Max. Working Panel size

 1000×1200mm

 Inner Layer

 Internal Core Thickness

0.1~2.0mm

 Internal width/spacing

Min: 4/4mil

 Internal Copper Thickness

1.0~3.0oz

 Dimension

Board Thickness Tolerance

±10%

 Interlayer Alignment

±3mil

Drilling

 Manufacture Panel Size

Max: 650×560mm

 Drilling Diameter

≧0.25mm

 Hole Diameter Tolerance

±0.05mm

 Hole Position Tolerance

±0.076mm

 Min.Annular Ring 

0.05mm

PTH+Panel Plating

 Hole Wall copper Thickness

≧20um

 Uniformity

≧90%

 Outer Layer

 Track Width

Min: 0.08mm

Track Spacing

Min: 0.08mm

 Pattern Plating

 Finished Copper Thickness

1oz~3oz

EING/Flash Gold

 Nickel Thickness

2.5um~5.0um

 Gold Thickness

0.03~0.05um

Solder Mask

Thickness

15~35um

 Solder Mask Bridge

3mil

 Legend

 Line width/Line spacing

6/6mil

 Gold Finger

 Nickel Thickness

≧120u〞

 Gold Thickness

1~50u〞

 Hot Air Level

 Tin Thickness

100~300u〞

 Routing

 Tolerance of Dimension

±0.1mm

 Slot Size

Min:0.4mm

Cutter Diameter

0.8~2.4mm

 Punching

 Outline Tolerance

±0.1mm

Slot Size

Min:0.5mm

V-CUT

 V-CUT Dimension

Min:60mm

 Angle

15°30°45°

 Remain Thickness Tolerance

±0.1mm

Beveling

Beveling Dimension

30~300mm

Test

Testing Voltage

250V

Max.Dimension

540×400mm

Impedance Control

 
    Tolerance

 

±10%

Aspect Ration

12:1

Laser Drilling Size

4mil(0.1mm)

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug, 
BGA Soldering and Gold Finger Are Acceptable

OEM&ODM Service

Yes

 

 

 

 

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