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FR4 Double Side Multi-Layer PCB Board Assembly Immersion Gold Printed Circuit

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PCB Board Assembly

  • High Precision PCB Board Assembly suppliers
  • High Precision PCB Board Assembly suppliers

 

 

 

Introduction

 

PCB Assembly is a process that requires knowledge not just of PCB components and assembly but also of printed circuit board design, PCB fabrication and a strong understanding of the final product. Circuit board assembly is just one piece of the puzzle to delivering the perfect product the first time.
San Francisco Circuits is a one-stop solution for all circuit board services so we are often entrenched with the PCB production process from design to assembly. Through our strong network of well-proven circuit assembly and manufacturing partners, we can provide the most advanced and nearly limitless capabilities for your prototype or production PCB application. Save yourself the trouble that comes with the procurement process and dealing with multiple components vendors. Our experts will find you the best parts for your final product.

 


PCB Assembly Services:


Quick-turn prototype assembly
Turn-key assembly
Partial turn-key assembly
Consignment assembly
RoHS compliant lead-free assembly
Non-RoHS assembly

Conformal coating
Final box-build and packaging

 

 

PCB Assembly Process


Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

 


Testing Services


X-Ray (2-D and 3-D)
BGA X-Ray Inspection
AOI Testing (Automated Optical Inspection)
ICT Testing (In-Circuit Testing)
Functional Testing (at the board & system level)
Flying Probe

 


Capabilities


Surface Mount Technology / Parts (SMT Assembly)
Through-Hole Device / Parts (THD)
Mixed Parts: SMT & THD assembly
BGA / Micro BGA / uBGA
QFN, POP & lead-less chips
2800 pin-count BGA
0201 / 1005 passive components
0.3 / 0.4 Pitch
PoP Package
Flip-chip under-filled CCGA
BGA Interposer / Stack-up
and more…

 

 

 

PCB Board Assembly Sample Introduction

FR4 Double Side Multi-Layer PCB Board Assembly Immersion Gold Printed Circuit

China FR4 Double Side Multi-Layer PCB Board Assembly Immersion Gold Printed Circuit Supplier

Large Image :  FR4 Double Side Multi-Layer PCB Board Assembly Immersion Gold Printed Circuit

Product Details:

Place of Origin: China
Brand Name: SYF
Certification: UL,ISO9001:2008,ROHS,REACH, HALOGEN FREE,SGS
Model Number: SYF-256

Payment & Shipping Terms:

Payment Terms: L/C,T/T,Paypal
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Detailed Product Description

FR4 Double Side Multi-Layer Immersion Gold Printed Circuit Board Assembly
 

PRODUCT’S DETAILS
Raw MaterialFR-4 (Tg 180 available)
Layer Count4-Layer
Board Thickness1.0mm
Copper Thickness2.0oz
Surface FinishENIG(Electroless Nickel Immersion Gold)
Solder MaskGreen
SilkscreenWhite
Min. Trace Width/Spacing0.075/0.075mm
Min. Hole Size0.25mm
Hole Wall Copper Thickness≥20μm
Measurement300×400mm
PackagingInner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
ApplicationCommunication,automobile,cell,computer,medical
AdvantageCompetitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special RequirementsBuried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
CertificationUL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

 
 
 

PRODUCTION CAPABILITY OF PCB

PROCESS Engineer
ITEMS Item
PRODUCTION CAPABILITY Manufacturing Capability
LaminateTypeFR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ,
ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON
Thickness0.2~3.2mm
Production TypeLayer Count2L-16L
Surface TreatmentHAL,Gold Plating,Immersion Gold,OSP,
Immersion Silver,Immersion Tin,Lead Free HAL
Cut LaminationMax. Working Panel size1000×1200mm
Inner LayerInternal Core Thickness0.1~2.0mm
Internal width/spacingMin: 4/4mil
Internal Copper Thickness1.0~3.0oz
DimensionBoard Thickness Tolerance±10%
Interlayer Alignment±3mil
DrillingManufacture Panel SizeMax: 650×560mm
Drilling Diameter≧0.25mm
Hole Diameter Tolerance±0.05mm
Hole Position Tolerance±0.076mm
Min.Annular Ring0.05mm
PTH+Panel PlatingHole Wall copper Thickness≧20um
Uniformity≧90%
Outer LayerTrack WidthMin: 0.08mm
Track SpacingMin: 0.08mm
Pattern PlatingFinished Copper Thickness1oz~3oz
EING/Flash GoldNickel Thickness2.5um~5.0um
Gold Thickness0.03~0.05um
Solder MaskThickness15~35um
Solder Mask Bridge3mil
LegendLine width/Line spacing6/6mil
Gold FingerNickel Thickness≧120u〞
Gold Thickness1~50u〞
Hot Air LevelTin Thickness100~300u〞
RoutingTolerance of Dimension±0.1mm
Slot SizeMin:0.4mm
Cutter Diameter0.8~2.4mm
PunchingOutline Tolerance±0.1mm
Slot SizeMin:0.5mm
V-CUTV-CUT DimensionMin:60mm
Angle15°30°45°
Remain Thickness Tolerance±0.1mm
BevelingBeveling Dimension30~300mm
TestTesting Voltage250V
Max.Dimension540×400mm
Impedance Control
Tolerance
 
±10%
Aspect Ration12:1
Laser Drilling Size4mil(0.1mm)
Special RequirementsBuried And Blind Via, Impedance Control, Via Plug,
BGA Soldering and Gold Finger Are Acceptable
OEM&ODM ServiceYes

 
 
Quick Details

  1. One of the largest PCB(Printed Circuit Board) manufacturers in China with over 500 staff.
  2. One of the professional PCB manufacturers in China with 20 years’ experience.
  3. Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.
  4. Good quality with competitive price for all kinds of PCB manufactured by SYF.
  5. One-stop service of PCB with assembly is supplied to our customers.
  6. Best service with quick response is always provided for our customers.
  7. All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver,Immersion Tin, Immersion Gold, Lead-free HASL,HAL.
  8. Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine, CNC drilling machine,Auto-PTH line, AOI(Automatic Optic Inspection),Probe Flying Machine and so on.
  9. BGA,Blind&Buried Vias and Impedence Control is accepted. 















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