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Multilayer Double Sided PCB Board Silkscreen Tg 180 TEFLON 1.6mm ROHS / SGS

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Double Sided PCB

  • High Precision Double Sided PCB suppliers
  • High Precision Double Sided PCB suppliers

 

 

Introduction


Double sided circuit board means has a double-sided copper, and metallized holes, that is double-sided copper, and copper are holes inside

Both sides have double wiring board, but to use the wire on both sides. Both sides must be in the room with appropriate electrical connections. "Bridge" between this circuit called vias. Guide hole in the PCB, metal filled or coated with holes, which can be connected to the conductors on both sides. Because dual-panel area twice as big than the single panel, double panel to solve the single-panel wiring staggered because of difficulty (can be turned to the other side of the hole), it is more suitable for use in more complex than single-panel circuit.

 

 

Advantages


Compared with single-board: wiring convenient, simple, labor-intensive wiring smaller, shorter line length.

 

 

Double Circuit Board Design Steps

 

     1. Prepare circuit schematics

     2. Create a new file and loaded PCB component package library

     3, planning board

     4, into the network table and components

     5, automatic layout components

     6, layout adjustment

     7, the network density analysis

     8, wiring rules set

     9, automatic routing

     10, manually adjust the wiring

 

Multilayer Double Sided PCB Board Silkscreen Tg 180 TEFLON 1.6mm ROHS / SGS

Multilayer Double Sided PCB Board Silkscreen Tg 180 TEFLON 1.6mm ROHS / SGS
Multilayer Double Sided PCB Board Silkscreen Tg 180 TEFLON 1.6mm ROHS / SGS

Large Image :  Multilayer Double Sided PCB Board Silkscreen Tg 180 TEFLON 1.6mm ROHS / SGS

Product Details:

Place of Origin: China
Brand Name: SYF
Certification: UL,ISO9001:2008,ROHS,REACH,HALOGEN FREE,SGS
Model Number: SYF-010

Payment & Shipping Terms:

Minimum Order Quantity: 100PCS
Price: NEGOTIATION
Packaging Details: INNER VACCUM-PACKED WITH CARDBOARD CARTON
Delivery Time: 5-8 DAYS
Payment Terms: L/C,T/T,Paypal
Supply Ability: 2 MILLION PCS PER MONTH
Detailed Product Description
Material: FR4/FR1/FR2/CEM-1/CEM-2/ Metal Core Solder Mask: Green/Yellow/Red/Black
Quality: 100% E-TEST Service: PCB, PCBA, OEM, ODM
Surface Finish: HASL, OSP, ENIG, HAL, Immersion Tin, Immersion Silver
High Light:

pcb printed circuit boards

,

double sided printed circuit board

 

Multilayer Double Sided PCB Board Silkscreen Tg 180 TEFLON 1.6mm ROHS / SGS 

 

Description:

  1. Best service with quick response is always provided for our customers.
  2. Advanced  production equipment imported from Japan and Germany,such as                                          PCB Lamination Machine, CNC drilling machine,Auto-PTH line,                                   AOI(Automatic Optic Inspection),Probe Flying Machine and so on.
  3. Quality guarantee and professional after-sale service.
  4. BGA,Blind&Buried Vias and Impedence Control is accepted.
  5. Gerber file needed.

 PRODUCT’S DETAILS

 Raw Material

 FR-4 (Tg 180 available)

 Layer Count

 8-Layer

 Board Thickness

 1.6mm

 Copper Thickness

 2.0oz

 Surface Finish

 ENIG(Electroless Nickel Immersion Gold)

 Solder Mask

 Green

 Silkscreen

 White

 Min. Trace Width/Spacing

 0.075/0.075mm

 Min. Hole Size

 0.25mm

 Hole Wall Copper Thickness

 ≥20μm

 Measurement

 300×400mm

 Packaging

 Inner: Vacuum-packed in soft plastic bales 
 Outer: Cardboard Cartons with double straps

 Application

 Communication,automobile,cell,computer,medical 

 Advantage

 Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

 Special Requirements

 Buried And Blind Via, Impedance Control, Via Plug, 
 BGA Soldering And Gold Finger Are Acceptable

 Certification

 UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

 
 

 PRODUCTION CAPABILITY OF PCB

 Process Engineering

 Items

 Manufacturing Capability

 Laminate

 Thickness

 0.2~3.2mm

 Production Type

 Layer Count

 2L-16L

 Cut Lamination

 Max. Working Panel size

 1000×1200mm

 Inner Layer

 Internal Core Thickness

 0.1~2.0mm

 Internal width/spacing

 Min: 4/4mil

 Internal Copper Thickness

 1.0~3.0oz

 Dimension

 Board Thickness Tolerance

 ±10%

 Interlayer Alignment

 ±3mil

 Drilling

 Manufacture Panel Size

 Max: 650×560mm

 Drilling Diameter

 ≧0.25mm

 Hole Diameter Tolerance

 ±0.05mm

 Hole Position Tolerance

 ±0.076mm

 Min.Annular Ring 

 0.05mm

 PTH+Panel Plating

 Hole Wall copper Thickness

 ≧20um

 Uniformity

 ≧90%

 Outer Layer

 Track Width

 Min: 0.08mm

 Track Spacing

 Min: 0.08mm

 Pattern Plating

 Finished Copper Thickness

 1oz~3oz

 EING/Flash Gold

 Nickel Thickness

 2.5um~5.0um

 Gold Thickness

 0.03~0.05um

 Solder Mask

 Thickness

 15~35um

 Solder Mask Bridge

 3mil

 Legend

 Line width/Line spacing

 6/6mil

 Gold Finger

 Nickel Thickness

 ≧120u〞

 Gold Thickness

 1~50u〞

 Hot Air Level

 Tin Thickness

 100~300u〞

 Routing

 Tolerance of Dimension

 ±0.1mm

 Slot Size

 Min:0.4mm

 Cutter Diameter

 0.8~2.4mm

 Punching

 Outline Tolerance

 ±0.1mm

 Slot Size

 Min:0.5mm

 V-CUT

 V-CUT Dimension

 Min:60mm

 Angle

 15°30°45°

 Remain Thickness Tolerance

 ±0.1mm

 Beveling

 Beveling Dimension

 30~300mm

 Test

 Testing Voltage

 250V

 Max.Dimension

 540×400mm

 Impedance Control

 Tolerance

 ±10%

 Aspect Ration

 12:1

 Laser Drilling Size

 4mil(0.1mm)

Contact Details
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