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10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

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HDI PCB Board

  • High Precision HDI PCB Board suppliers
  • High Precision HDI PCB Board suppliers

 

 

Material


FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

 

 

Surface Treatment


HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

 

 

Advantage

 

1.PCB factory directly
2.PCB high quality
3.PCB good price
4.PCB quick time
5.PCB certification(ISO/UL E354810/RoHS)

 

 

Capability:

 

          -High Frequency (TACONIC material)/TG/Density/precision impedance controlled boards

          -Heavy Copper PCB, Metal based PCB. Hard Gold PCB, Blind &Buried vias boards,

Halogen Free PCB, Aluminum-backed Boards

          -Gold finger+ HAL & Leadfree HASL PCB, Leadfree compatible PCB

 

10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

10 Layer BGA High Density Interconnect PCB Immersion Gold Plated
10 Layer BGA High Density Interconnect PCB Immersion Gold Plated 10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

Large Image :  10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

Product Details:

Place of Origin: China
Brand Name: LT Circuit
Certification: UL E354810,SGS

Payment & Shipping Terms:

Minimum Order Quantity: NO MOQ
Price: Negotiable
Packaging Details: 20pcs/vacuum bag+export packing
Delivery Time: 5-12Days
Payment Terms: L/C,T/T,Paypal
Supply Ability: Ten thousand square meters/month
Detailed Product Description
Material: FR4 Layer: 10 Layer
Copper Thickness: 0.5 Oz For Inner Layers And 1 Oz For Outter Layers Surface Plating: Immersion Gold
Solder Mask: Green Silkscreen: White
High Light:

custom circuit board

,

hdi circuit boards

10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

 

 

 

 

PCB Capability

 

High precision prototype

PCB bulk production

Max Layers

1-28 layers

1-14 layers

MIN Line width(mil)

3mil

4mil

MIN Line space(mil)

3mil

4mil

Min via (mechanical drilling)

Board thickness1.2mm

0.15mm

0.2mm

Board thickness2.5mm

0.2mm

0.3mm

Board thickness2.5mm

Aspect Ration13:1

Aspect Ration13:1

Aspect Ration

Aspect Ration13:1

Aspect Ration13:1

Board thickness

MAX

8mm

7mm

MIN

2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm

2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm

MAX Board size

610*1200mm

610*1200mm

Max copper thickness

0.5-6oz

0.5-6oz

Immersion Gold/

Gold Plated Thickness

Immersion Gold:Au,1—8u”
Gold finger
:Au,1—150u”
Gold Plated
:Au,1—150u”
Nickel Plated
:50—500u”

 

Hole copper thick

25um 1mil

25um 1mil

Tolerance

Board thickness

Board thickness1.0mm:+/-0.1mm
1.0mm<Board thickness
2.0mm:+/-10%
Board thickness>2.0mm:+/-8%

Board thickness1.0mm:+/-0.1mm
1.0mm<Board thickness
2.0mm:+/-10%
 Board thickness>2.0mm:+/-8%

Outline Tolerance
 

100mm:+/-0.1mm
100<
300mm:+/-0.15mm
 >300mm:+/-0.2mm

100mm:+/-0.13mm
100< 
300mm:+/-0.15mm
 >300mm:+/-0.2mm

Impedance

±10%

±10%

MIN Solder mask bridge

 0.08mm

 0.10mm

Plugging Vias capability

 0.25mm--0.60mm

 0.70mm--1.00mm

 

 

 

 

 

10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

Description

 

1. Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly

2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180

3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

 

10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

10 Layer BGA High Density Interconnect PCB Immersion Gold Plated

 

Contact Details
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