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Round Impedance Control Multilayer PCB Board V-Score With 1OZ Copper Thickness

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Multilayer PCB Board

  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers
  • High Precision Multilayer PCB Board suppliers

Introduction

 

Multilayer printed circuit boards (PCBs) represented the next major evolution in fabrication technology. From the base platform of double sided plated thru came a very sophisticated and complex methodology that would again allow circuit board designers a dynamic range of interconnects and applications.

Multilayer circuit boards were essential in the advancement of modern computing. The multilayer PCB basic construction and fabrication are similar to micro chip fabrication on a macro size. The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills. Multilayer can be built on ceramic, copper, and aluminum. Blind and buried vias are commonly produced, along with pad on via technology.

 

 

Production Process

 

1. Chemical Clean

 

In order to obtain good quality etched pattern, it is necessary to ensure a strong bond of the resist layer and the substrate surface, a substrate or a surface oxide layer, oil, dust, fingerprints and other dirt. Therefore, before the resist layer is first applied to the surface of the board and the copper foil surface cleaning roughened layer reaches a certain degree.
Inner plate: started four panels, the inner (second and third layers) is a must do first. The inner sheet is made of glass fiber and epoxy resin-based composite upper and lower surfaces of the copper sheet.

 

 

 

2. Cut Sheet Dry Film Lamination

 

Coating a photoresist: we need to make the shape of the inner plate, we first affixed dry film (resist, photoresist) over the inner layer sheet. The dry film is a polyester thin film, a photoresist film and a polyethylene protective film composed of three parts. When the foil, the dry film starting with a polyethylene protective film is peeled off, and then under the conditions of heat and pressure in the dry film is pasted on copper.

 


3. Image Expose & Image Develop

 

Exposure: In the UV irradiation, photoinitiators absorb light decompose into radicals, radical photopolymerization initiator and then polymerizing the monomer to generate a crosslinking reaction, forming insoluble in dilute alkali solution after the reaction of the polymer structure. Polymerization to continue for some time, in order to ensure the stability of the process, not to tear immediately after exposure polyester film should stay more than 15 minutes to the polymerization reaction to proceed, before developing torn polyester film.
Developer: the reaction active groups solution unexposed portions of the photosensitive film with a dilute alkali-soluble matter dissolved production down, leaving the already hardened by crosslinking the photosensitive pattern portion

 

 

4. Copper Etch

 

In flexible printed boards or printed board manufacturing process, the chemical reaction to the copper foil portion not to be removed, so as to form a desired circuit pattern of copper beneath the photoresist is not etched retained impact.

 

 

5. Strip Resist & Post Etch Punch & AOI Inspection & Oxide

 

The purpose of the film is to etch the board retained after clearing the resist layer so that the following copper exposed. "Film slag" filter and recycle waste shall be disposed of properly. If you go after the film can be washed completely clean, you might consider not pickling. Finally, the board is completely dry after washing, avoid residual moisture.

 

 

6. Layup with prepreg

 

Before entering pressure machine, the need to use all of multilayer materials ready to pack (Lay-up) In addition to the inner handle the job has been oxidized, but still need a protective film film (Prepreg) -. Epoxy resin impregnated glass fibers. Role of laminations is a certain order to the board covered with a protective film since the stacked and placed between the floor plate.

 

 

7. Layup with copper foil & Vacuum Lamination Press

 

Foil - to present the inner sheet and then covered with a layer of copper foil on both sides, and then the multilayer pressurization (within a fixed period of time necessary to measure the temperature and pressure extrusion) was cooled to room temperature after completion of the remaining is a multi-layer sheet of together.

 

 

8. CNC Drill

 

Under the conditions of the inner precision, CNC drilling drilling depending on the mode. Drilling high precision, to ensure that the hole is in the correct position.

 

 

9. Electroless Copper

 

In order to make the through-hole between the layers can be turned on (the resin and glass fiber bundle of a non-conductive portion of the wall of the hole metallization), the holes must be filled in the copper. The first step is a thin layer of copper plating in the hole, this process is completely chemical reaction. Final plated copper thickness of 50 inches millionth.

 

 

10. Cut Sheet & Dry Film Lamination

 

 

Photoresist coating: We have one in the outer coating of the photoresist.

 

 

11. Mage Expose & Image Develop

 

Outer exposure and development

 

 

12. Copper Pattern Electro Plating

 

This has become a secondary copper, the main purpose is to thicken the line of copper and copper vias thick.

 

 

13. Tin Pattern Electro Plating

 

Its main purpose is an etching resist, protect it covers the copper conductors will not be attacked (internal protection of all copper lines and vias) in alkaline corrosion of copper.

 

 

14. Strip Resist

 

We already know the purpose, just use the chemical method, the surface of the copper is exposed.

 

 

15. Copper Etch

 

We know that the purpose of protecting the tin partially etched foil below.

 

 

16. LPI coating side 1 & Tack Dry & LPI coating side 2 & Tack Dry & Image Expose & Image Develop & Thermal Cure Solder mask

 

Solder mask is exposed to the pads used, it is often said that the green oil, oil is actually digging holes in the green, the green oil does not need to cover the pads and other exposed areas. Proper cleaning can get a suitable surface features.

 

 

17. Surface finish

 

HASL solder coating HAL (commonly known as HAL) process is first dipped on the PCB flux, then dipping in molten solder, and then from between two air knives by compressed air with a knife in the heat air to blow off excess solder on printed circuit board, at the same time eliminate excess solder metal hole, resulting in a bright, smooth, uniform solder coating.
Gold Finger, purpose-designed Edge Connector, plug the connector as board liaison foreign exports, and therefore need to cheat the process. Chose gold because of its superior conductivity and oxidation resistance. However, because the cost of gold applies only to cheat so high, local gold plated or chemically.

 

Round Impedance Control Multilayer PCB Board V-Score With 1OZ Copper Thickness

Round Impedance Control Multilayer PCB Board V-Score With 1OZ Copper Thickness
Round Impedance Control Multilayer PCB Board V-Score With 1OZ Copper Thickness

Large Image :  Round Impedance Control Multilayer PCB Board V-Score With 1OZ Copper Thickness

Product Details:

Place of Origin: China
Brand Name: HD-PCB
Certification: UL,ISO9001,TS16949.
Model Number: Multilayer PCB-2

Payment & Shipping Terms:

Minimum Order Quantity: No MOQ
Price: Negotiation
Packaging Details: Packed in antistatic bag
Detailed Product Description
High Light:

multilayer pcb design

,

multilayer circuit board

 

Round Impedance Control Multilayer PCB Board V-Score With 1OZ Copper Thickness

 

 

Quick Details 

 

PCB Type:

Multilayer PCB

Layer :

4 layer

Min .Line Width/Space:

3mil/3mil

Min. Via Diameter:

0.3mm

Finish Thickness:

1.6mm

Surface Finish:

HASL

Size:

40*60MM

Material:

FR4

Color:

Blue

Application:

Controller

 

 

Description

 

    We are one-stop printed circuit board manufacturer , providing PCB fabrication services for single, double or multi-layer PCBs in low volume and high-volume production amounts with a wide range of materials and technology options.
    Leveraging our design and assembly services in a turnkey production system, we can provide low cost PCB manufacturing with the highest quality. Using a variety of inspection methodologies to ensure the functionality of the final product. We offer Full Spec, small quantity printed circuit boards and Custom Spec quick turn PCBs. In addition, we are the premier provider of printed circuit boards to the Military/Aerospace/Defense/Medical and Commercial Industries.

 

 

 

Technical Capabilities

 

Number of layers

1, 2, 4 or 6, up  to 36 layers

Order Quantity

1 to 500,000

Board shape

Rectangular, round, slots, cutouts, complex, irregular

Board type

Rigid, flexible, rigid-flexible

Board material

FR4 glass epoxy, FR4 High Tg, RoHS compliant; Aluminum, Rogers, etc.

Board cutting

Shear, V-score, tab-routed

Board thickness

Flex, 0.2 ~ 6.0 mm, 0.01 ~ 0.25″

Copper weight

1.0, 1.5, 2.0 Oz

Solder mask

Double-sided green LPI, Also support red, white, yellow, blue, black

Silk screen

Double-sided or single-sided in white, yellow, black, or negative

Silk screen min line width

0.006″ or 0.15mm

Max board dimensions

45 x 45″ or 114 x 114 cm

Min trace/gap

0.004”, 0.1mm, or 4 mils

Min drill hole diameter

0.006”, 0.15mm, or 6 mils

Surface finish

HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.

Board thickness tolerance

±10%

Copper weight tolerance

±0.25 oz

Minimal slot width

0.12”, 3.0 mm, or 120 mils

V-score depth

20-25% of board thickness

Plated through holes

Yes

Sink holes

Yes

Design file format

Gerber RS-274X, 274D, Eagle and AutoCAD’s DXF, DWG

 

 

 

PCB Production Flow Chart

 

Round Impedance Control Multilayer PCB Board V-Score With 1OZ Copper Thickness

 

Testing Procedures

 

We perform multiple quality assurance procedures before shipping out any PCB board. These include:

  • Visual Inspection
  • Flying probe
  • Bed of nails
  • Impedance control
  • Solder-ability detection
  • Digital metallograghic microscope
  • AOI (Automated Optical Inspection)

 

Quick turn lead times

 

For PCB production, we can provide 2 to 7 days turn around times. For multilayer PCBs, the fastest  turnaround time depends on the number of layers and quantity.

 

Service Guarantee

 

We make sure to serve each customer professionally, truthfully and friendly to the best of our ability.   We will gladly re-work your project if your project isn’t 100% satisfactory.

 

 

Get a quick quote now

 

By sending in a bill of material, gerber files including assembly drawing and we will have a quotation back to you within hours. With Shenzhen hengda there is never a hidden cost and our prices are very competitive and reasonable.

 

 

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