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Testing Procedures For PCB Board
---We perform multiple quality assuring procedures before shipping out any PCB board. These include:
* Visual Inspection
* Flying probe
* Bed of nails
·* Impedance control
·* Solder-ability detection
* Digital metallograghic microscope
·*AOI (Automated Optical Inspection)
Detailed Terms for PCB Manufacturing
---Technical requirement for pcb assembly:
* Professional Surface-mounting and Through-hole soldering Technology
* Various sizes like 1206,0805,0603 components SMT technology
* ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
* PCB Assembly With UL,CE,FCC,Rohs Approval
* Nitrogen gas reflow soldering technology for SMT.
* High Standard SMT&Solder Assembly Line
* High density interconnected board placement technology capacity.
Surface Treatment
Lead-free HAL
Gold Plating (1-30 micro inch)
OSP
Silver Plating
Pure Tin Plating
Immersion Tin
Immersion Gold
Gold Finger
Other Service:
A) We have many special material as rogers, teflon, taconic, Fr-4 high tg, Ceramic in stock. Welcome to send us your inquiry.
B) We also provide sourcing components , PCB design , PCB copy , PCB drawing , PCB assembly and so on .
Product Details:
Payment & Shipping Terms:
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| High Light: | led light pcb board,high power led pcb |
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|---|---|---|---|
Double Layer LED PCB Board for Lighting / led lights circuit board assembly
Key Specifications/Special Features
| Number. of Layers: | 2 |
| Laminate Material: | Aluminum |
| Surface Finish: | HASL |
| Copper Thickness: | 3 OZ |
| Board Thickness: | 2.0mm |
| Board Size: | |
| Color of Mask: | White |
| Color of Silkscreen: | Red with Non-Conductive Ink |
| Flammability: | UL 94V-0 |
| Workmanship: | Compliance with IPC-A-600 & IPC-6012 CLASS II |
| Thermal Conductivity | 2 W |
Capacity
| High precision prototype | PCB bulk production | ||
| Max Layers | 1-28 layers | 1-14 layers | |
| MIN Line width(mil) | 3mil | 4mil | |
| MIN Line space(mil) | 3mil | 4mil | |
| Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm |
| Board thickness≤2.5mm | 0.2mm | 0.3mm | |
| Board thickness＞2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Board thickness | MAX | 8mm | 7mm |
| MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm | |
| MAX Board size | 610*1200mm | 610*1200mm | |
| Max copper thickness | 0.5-6oz | 0.5-6oz | |
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Immersion Gold/ Gold Plated Thickness |
Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u” |
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| Hole copper thick | 25um 1mil | 25um 1mil | |
| Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
| Outline Tolerance | ≤100mm:+/-0.1mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
≤100mm:+/-0.13mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
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| Impedance | ±10% | ±10% | |
| MIN Solder mask bridge | 0.08mm | 0.10mm | |
| Plugging Vias capability | 0.25mm--0.60mm | 0.70mm--1.00mm | |
Advantage
1. Factory directly
2. Comprehensive quality control system
3. Competitive price
4. Quick turn: as fast as 48hours.
5. Certification (ISO/ UL E354810/ RoHS)
6. 8 years experience in exporting service
7. No MOQ/MOV.
8. Reliable quality: AOI (Automated Optical Inspection), QA/ QC, flying probe, E-testing, etc
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
