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14 Layer GPS PCB FR370 Quick Turn PCB Prototypes BGA and IC pad size 350X200mm

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Good quality Flexible PCB Board
Good quality Flexible PCB Board
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Flexible PCB Board

  • High Precision Flexible PCB Board suppliers
  • High Precision Flexible PCB Board suppliers
  • High Precision Flexible PCB Board suppliers
  • High Precision Flexible PCB Board suppliers

 

 

Introduction:

 

Flex PCBs, also known as flexible printed circuits or flexible electronics, provide greater options for designers and engineers when assembling electronic circuits.

They are constructed from flexible, high-performance plastic material, usually polyimide, which enables the board to bend or "flex" during use. This flexibility opens them up to use in a wide range of applications.

14 Layer GPS PCB FR370 Quick Turn PCB Prototypes BGA and IC pad size 350X200mm

14 Layer GPS PCB FR370 Quick Turn PCB Prototypes  BGA and IC pad size 350X200mm
14 Layer GPS PCB FR370 Quick Turn PCB Prototypes  BGA and IC pad size 350X200mm

Large Image :  14 Layer GPS PCB FR370 Quick Turn PCB Prototypes BGA and IC pad size 350X200mm

Product Details:

Place of Origin: China
Brand Name: CHITUN
Certification: UL/ISO/ROHS/SGS
Model Number: base on customers' requestion

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: base on gerberfiles
Packaging Details: Vacuum package
Delivery Time: 5-15days
Payment Terms: TT, LC, Western Union, D/A,, D/P,and others base on negotiation
Supply Ability: 50000 per week
Detailed Product Description
Material: FR370 Board Thickness: 3.6mm
Copper: 1oz Surface Finish: Immersion Gold
Solder Mask: Green Sillkscreen: White
Size: 350*200mm Finish: CNC
Standard: IPC Standard
High Light:

quick turn pcb fabrication

,

quick turn printed circuit boards

14 Layer GPS PCB FR370 Quick Turn PCB Prototypes  BGA and IC pad size 350X200mm

 

TECHNOLOGY:

. RoHS/ Lead Free

. HDI Microvias

. Blind Vias

. Buried Vias

. Selective Plating

. Impedance Control

Manufacturing Standard:

. IPC-A-600G Class II

. IPC-A-600G Class III

. PERFAG 2E for Double-Sided Board

. PERFAG 3C for Multilayer Board

Capability

Min. Finished Holes Size: 0.008" (0.20mm)

Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)

Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)

Maximum copper thickness: 5oz (140um)

Thin board thickness:

. DS - 0.008 inches (0.20mm)

. 4/L - 0.016 (0.40mm)

. 6/L - 0.020 inches (0.60mm)

Maximum board thickness:

. 275.8mil (7.0mm)

Surface treatment:

. HASL/lead free HAL/gold plating

. Immersion gold

. Immersion tin

. Immersion silver

. Gold fingers (hard gold)

. OSP

Contact Details
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