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Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Material Types
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
Surface Treatment
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Application
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Product Details:
Payment & Shipping Terms:
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| Base Material: | FR4 | Copper Thickness: | 1OZ,0.5 To 3.0 Oz |
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| Board Thickness: | 1.6MM | Min. Hole Size: | 0.2MM |
| Min. Line Width: | 0.1MM | Min. Line Spacing: | 0.1MM |
| Surface Finishing: | HASL | Solder Mask Color: | Green/black/white/red/blue |
| Layer: | 1 To 28 Layers | Material: | FR-4, CEM-1, CEM-3, Hight TG, FR4 Halogen Free, FR-1, FR-2 |
| Max. Finished Thickness: | 0.4 To 7.0mm | Max. Finished Board Side: | 500 X 500mm |
| Surface Finish: | HALS/HALS Lead Free, Chemical Tin, Chemical Gold, Immersion Gold | Hole Tolerance: | PTH ±0.076, NTPH ±0.05 |
| Board Type: | Rigid,flexible,rigid-flexible | Board Shape: | Rectangular,round,slots,cutouts,complex,irregular |
| High Light: | rigid printed circuit board,electronic circuit board |
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- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
1.Detailed Specification of PCB Manufacturing
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layer |
1-18 layer |
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Material |
FR-4,CEM-1,CEM-3,High TG,FR4 Halogen Free,FR-1,FR-2 |
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Board thickness |
0.2mm-4mm |
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Max.finished board side |
800*508mm |
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Min.drilled hole size |
0.25mm |
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min.line width |
0.075mm(3mil) |
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7 |
min.line spacing |
0.075mm(3mil) |
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Surface finish/treatment |
HALS/HALS lead free,Chemical tin,Chemical Gold, Immersion gold Immersion Silver/Gold,Osp,Gold Plating |
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Copper thickness |
0.5-4.0oz |
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Solder mask color |
green/black/white/red/blue/yellow |
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11 |
Inner packing |
Vacuum packing,Plastic bag |
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Outer packing |
standard carton packing |
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Hole tolerance |
PTH:±0.076,NTPH:±0.05 |
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Certificate |
UL,ISO9001,ISO14001,ROHS,CQC |
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profiling punching |
Routing,V-CUT,Beveling |
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16. providing OEM service to all sorts of printed circuit board assembly |
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2.Detailed Terms for Pcb Assembly
Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Quote requirement:
· Gerber file of the bare PCB board
· BOM (Bill of material) for assembly
· To short the lead time, please kindly advise us if there is any acceptable components substitution.
· Testing Guide & Test Fixtures if necessary
· Programming files & Programming tool if necessary
· Schematic if necessary
OEM/ODM/EMS Services for PCBA:
· PCBA, PCB assembly: SMT & PTH & BGA
· PCBA and enclosure design
· Components sourcing and purchasing
· Quick prototyping
· Plastic injection molding
· Metal sheet stamping
· Final assembly
· Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
· Custom clearance for material importing and product exporting
Orientronic PCB assembly Equipment:
· SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4
· Reflow Oven: FolunGwin FL-RX860
· Wave Soldering Machine: FolunGwin ADS300
· Automated Optical Inspection (AOI): Aleader ALD-H-350B
· Fully Automatic SMT Stencil Printer: FolunGwin Win-5
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
