Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Applications
Rigid flexible PCBs offer a wide array of applications, ranging from military weaponry and aerospace systems to cell phones and digital cameras. Increasingly, rigid flex board fabrication has been used in medical devices such as pacemakers for their space and weight reduction capabilities. The same advantages for rigid flex PCB usage can be applied to military weaponry and weapon control systems.
In consumer products, rigid flex doesn't just maximize space and weight but greatly improves reliability, eliminating many needs for solder joints and delicate, fragile wiring that are prone to connection issues. These are just some examples, but rigid flex PCBs can be used to benefit nearly all advanced electrical applications including testing equipment, tools and automobiles. Not sure what technology needs to be used for your project? Call our experts and we can help you figure out whether you need rigid flex, flex or HDI PCB technology.
Product Details:
Payment & Shipping Terms:
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High Light: | flexible rigid pcb,high density pcb |
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4 Layers Polyester CEM-1 OSP Flex Rigid PCB, Flexible PCB Board With UL / RoHS
Detailed Product Description:
1) Min. Trace width: 0.004"
2) Min. Space between trace: 0.004"
3) Min. Hole size: 0.012"
4) Thickness tolerance:
A) Single sided: 0.005"
B) Double sided: 0.010"
5) Base materials: Polyimide and polyester
6) Conductor (copper thickness): 0.5oz., 10oz. And 20oz. (RA and ED copper)
7) Cover-layer: Polyimide and polyester (solder mask printing is available)
8) Adhesive material: Epoxy, acrylic and polyester
9) Stiffener materials: FR-4, mylar and polyimide
10) Surface finishes: Flash gold plating, selective gold plating and solder plating.
Applications:
Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries
Advantage:
1.FPC factory directly
2. FPC high quality
3. FPC good price
4. FPC quick time
5.FPC certification(ISO/UL/RoHS)...
Specifications:
SERIAL |
ITEM |
TECHNICAL DATA |
1 |
Layers |
1-4(layers) |
2 |
Max Board Size |
18" x 24" |
3 |
Max Board Thickness |
6mm |
4 |
Min Line Width |
4mil |
5 |
Min Line Space |
4mil |
6 |
Min Hole Size |
12mil |
7 |
PTH Wall Thickness |
1mil |
8 |
PTH dia tolerance |
±3mil |
9 |
NPTH hole dia tolerance |
±2mil |
10 |
Hole Position Deviation |
±2mil |
11 |
Outline Tolerance |
±6mil |
12 |
S/M Pitch |
3mil |
13 |
Insulation Resistance |
1E+12Ω(Normal) |
14 |
Thermal Shock |
288 ℃(3x10Sec) |
15 |
Warp and Twist |
≤0.7% |
16 |
Electric Strength |
>1.3KV/mm |
17 |
Peel Strength |
1.4N/mm |
18 |
Solder Mask Abrasion |
≥6H |
19 |
Flammability |
94V-0 |
20 |
Electrical test |
10V -250V |
Material |
Surface Finish |
Polyimide and polyester |
OSP |
FR-4 |
HASL |
FR-4 High TG |
HASL lead free |
Aluminum PCB |
Immersion/Chemical Gold |
FR406 |
Flash Gold |
FR408 |
Immersion Silver |
Rogers |
Immersion Tin |
Halogen Free |
Gold finger |
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345