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Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Material Types
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
Surface Treatment
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Application
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Product Details:
Payment & Shipping Terms:
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| High Light: | high speed pcb design,high frequency pcb |
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ARLON TEFLON 6 Layer High-tg Cell PCB Rigid Plate , Custom PCB Boards
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PRODUCT’S DETAILS |
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Raw Material |
FR-4(Tg 180) |
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Layer Count |
6-Layer |
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Board Thickness |
2.0mm |
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Copper Thickness |
2.0oz |
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Surface Finish |
ENIG |
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Solder Mask |
Green |
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Silkscreen |
White |
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Min. Trace Width/Spacing |
0.075/0.075mm |
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Min. Hole Size |
0.25mm |
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Hole Wall Copper Thickness |
≥20μm |
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Measurement |
300×400mm |
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Packaging |
Inner: Vacuum-packed in soft plastic bales |
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Application |
Communication,automobile,cell,computer,medical |
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Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
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Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
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Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
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PRODUCTION CAPABILITY OF PCB |
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ITEMS Item |
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Laminate |
Type |
FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, |
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Thickness |
0.2～3.2mm |
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Production Type |
Layer Count |
2L-16L |
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Surface Treatment |
HAL,Gold Plating,Immersion Gold,OSP, |
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Cut Lamination |
Max. Working Panel size |
1000×1200mm |
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Inner Layer |
Internal Core Thickness |
0.1～2.0mm |
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Internal width/spacing |
Min: 4/4mil |
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Internal Copper Thickness |
1.0~3.0oz |
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Dimension |
Board Thickness Tolerance |
±10% |
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Interlayer Alignment |
±3mil |
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Drilling |
Manufacture Panel Size |
Max: 650×560mm |
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Drilling Diameter |
≧0.25mm |
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Hole Diameter Tolerance |
±0.05mm |
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Hole Position Tolerance |
±0.076mm |
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Min.Annular Ring |
0.05mm |
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PTH+Panel Plating |
Hole Wall copper Thickness |
≧20um |
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Uniformity |
≧90% |
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Outer Layer |
Track Width |
Min: 0.08mm |
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Track Spacing |
Min: 0.08mm |
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Pattern Plating |
Finished Copper Thickness |
1oz～3oz |
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EING/Flash Gold |
Nickel Thickness |
2.5um~5.0um |
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Gold Thickness |
0.03~0.05um |
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Solder Mask |
Thickness |
15～35um |
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Solder Mask Bridge |
3mil |
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Legend |
Line width/Line spacing |
6/6mil |
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Gold Finger |
Nickel Thickness |
≧120u〞 |
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Gold Thickness |
1～50u〞 |
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Hot Air Level |
Tin Thickness |
100～300u〞 |
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Routing |
Tolerance of Dimension |
±0.1mm |
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Slot Size |
Min:0.4mm |
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Cutter Diameter |
0.8～2.4mm |
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Punching |
Outline Tolerance |
±0.1mm |
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Slot Size |
Min:0.5mm |
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V-CUT |
V-CUT Dimension |
Min:60mm |
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Angle |
15°30°45° |
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Remain Thickness Tolerance |
±0.1mm |
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Beveling |
Beveling Dimension |
30～300mm |
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Test |
Testing Voltage |
250V |
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Max.Dimension |
540×400mm |
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Impedance Control |
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±10% |
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Aspect Ration |
12:1 |
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Laser Drilling Size |
4mil(0.1mm) |
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Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
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OEM&ODM Service |
Yes |
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Quick Details
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
