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Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Material Types
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
Surface Treatment
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Application
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Product Details:
Payment & Shipping Terms:
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| Layer: | 2 | Color: | White |
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| Min Line Space: | 5mil | Min Line Width: | 5mil |
| Copper Thickness: | 1OZ | Material: | Rogers |
| Size: | 20*30mm | Brand: | XCE |
| Model: | XCER | Board THK: | 0.2MM |
| High Light: | printed pcb board,printed circuit board pcb |
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Automatic Door / Sensor Lamp Rigid PCB 2 Layer Control Board With Rogers Material Raw
24GHZ PCB
5.8GHZ PCB
10GHZ PCB
Shenzhen Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of high frequency microwave PCB and multi-layer board including fastest sample production. we keen on helping customers shorten the period of production development and 24 hours sample service is available
Our company's sufficient stocks as follow:
Rogers,TACONIC,Arlon,Isola,F4B,TP-2,FR-4
Our products mainly used in the area of high technologies
like Military industry,electronics, communication device,aerospace
Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer,high TG,copper substrate,mix-compression, ceramic substrate PCB.
We are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for many years and we assure our customers that we will return the favors with more and more superior products in the near future.
Company spirit:Customer first,openness basing on sincerity.
Comapny culture:Improve employees quality with on the job training.
Quality policy:Honesty,superior quality,high efficiency.
Company tenet: Provide customers with satisfactory products and service is our eternal tenet.
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