Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Payment & Shipping Terms:
rigid printed circuit board,
electronic circuit board
|Place of Origin:||China (Mainland)||Brand Name:||OEM||Model Number:||0378785|
|Base Material:||Fr4||Copper Thickness:||1OZ||Board Thickness:||0.2mm-1.6mm|
|Min. Hole Size:||0.15mm||Min. Line Width:||0.2mm||Min. Line Spacing:||0.2mm|
|Surface Finishing:||HASL,LF,OPS||Key Words:||PCB board||Independence tolerance:||+/-10%|
|Aspecr Ratio:||6:1||Layer count:||1-20||Solder mask abrasion:||â¥6H|
|Gold finger:||Ni: 80~250u", Au: 1~5u"||Warp and twist:||â¤0.75%||Via plug:||Max via size: 24mil (0.6mm)|
You give us problem, we offer solution
1.Advanced production lines and professional staff.
2.Honesty credibility in china’s top.
3.Competest price but high quality.
4. One-stop service.
5.Delivery on time.
|2||Base Material for PCB||FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material|
|3||Rang of finish baords Thickness||0.21-7.0mm|
|4||Max size of finish board||900MM*900MM|
|5||Minimum Linewidth||3mil (0.075mm)|
|6||Minimum Line space||3mil (0.075mm)|
|7||Min space between pad to pad||3mil (0.075mm)|
|8||Minimum hole diameter||0.10 mm|
|9||Min bonding pad diameter||10mil|
|10||Max proportion of drilling hole and board thickness||1:12.5|
|11||Minimum linewidth of Idents||4mil|
|12||Min Height of Idents||25mil|
|13||Finishing Treatment||HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.|
|14||Soldermask||Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask.|
|15||Minimun thickness of soldermask||10um|
|16||Color of silk-screen||White, Black, Yellow ect.|
|17||E-Testing||100% E-Testing (High Voltage Testing); Flying Probe Testing|
|18||Other test||ImpedanceTesting,Resistance Testing, Microsection etc.,|
|19||Date file format||GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++|
|20||Special technological requirement||Blind & Buried Vias and High Thickness copper|
|21||Thickness of Copper||0.5-14oz (18-490um)|
Contact Person: Miss. aaa
Tel: 86 755 8546321