Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Material Types
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
Surface Treatment
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Application
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Product Details:
Payment & Shipping Terms:
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High Light: | rigid printed circuit board,Rigid PCB Boards |
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BGA Digital Clock Bare Rigid PCB Board Printed Circuit Boards 10 / 12 / 28 Layer
Description
1. Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Application
Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries
Advantage
1.PCB factory directly
2.PCB Have the comprehensive quality control system
3.PCB good price
4.PCB quick turn delivery time from 48hours.
5.PCB certification(ISO/UL E354810/RoHS)
6.8 years experience in exporting service
7.PCB is no MOQ/MOV.
8.PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
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High precision prototype |
PCB bulk production |
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Max Layers |
1-28 layers |
1-14 layers |
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MIN Line width(mil) |
3mil |
4mil |
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MIN Line space(mil) |
3mil |
4mil |
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Min via (mechanical drilling) |
Board thickness≤1.2mm |
0.15mm |
0.2mm |
Board thickness≤2.5mm |
0.2mm |
0.3mm |
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Board thickness>2.5mm |
Aspect Ration≤13:1 |
Aspect Ration≤13:1 |
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Aspect Ration |
Aspect Ration≤13:1 |
Aspect Ration≤13:1 |
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Board thickness |
MAX |
8mm |
7mm |
MIN |
2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm |
2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm |
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MAX Board size |
610*1200mm |
610*1200mm |
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Max copper thickness |
0.5-6oz |
0.5-6oz |
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Immersion Gold/ Gold Plated Thickness |
Immersion Gold:Au,1—8u” |
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Hole copper thick |
25um 1mil |
25um 1mil |
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Tolerance |
Board thickness |
Board thickness≤1.0mm:+/-0.1mm |
Board thickness≤1.0mm:+/-0.1mm |
Outline Tolerance |
≤100mm:+/-0.1mm |
≤100mm:+/-0.13mm |
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Impedance |
±10% |
±10% |
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MIN Solder mask bridge |
0.08mm |
0.10mm |
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Plugging Vias capability |
0.25mm--0.60mm |
0.70mm--1.00mm |
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345