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Introduction
Double sided circuit board means has a double-sided copper, and metallized holes, that is double-sided copper, and copper are holes inside
Both sides have double wiring board, but to use the wire on both sides. Both sides must be in the room with appropriate electrical connections. "Bridge" between this circuit called vias. Guide hole in the PCB, metal filled or coated with holes, which can be connected to the conductors on both sides. Because dual-panel area twice as big than the single panel, double panel to solve the single-panel wiring staggered because of difficulty (can be turned to the other side of the hole), it is more suitable for use in more complex than single-panel circuit.
Advantages
Compared with single-board: wiring convenient, simple, labor-intensive wiring smaller, shorter line length.
Double Circuit Board Design Steps
1. Prepare circuit schematics
2. Create a new file and loaded PCB component package library
3, planning board
4, into the network table and components
5, automatic layout components
6, layout adjustment
7, the network density analysis
8, wiring rules set
9, automatic routing
10, manually adjust the wiring
Product Details:
Payment & Shipping Terms:
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Custom FR-4 Red Solder Mask Double Side PCB Board 4 Layers Fabrication
4 Layers PCB
1.20mm Finish Thickness
1OZ finish Copper
Lead Free Hasl finish
Red Solder Mask
6/6 mil Min track/spacing
0.25mm hole size
V-Cut outline
Brand:China PCB Fabrication
PCB Technical Capacity
1. Files: Gerber, Protel, Powerpcb, Autocad, Orcad, etc
2. Material: FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1,
Aluminium, High frequency Material (Rogers, Teflon, Taconic)
3. Layer No.: 1 - 28 Layers
4. Board thickness: 0.0075"(0.2mm)-0.125"(3.2mm)
5. Board Thickness: Tolerance: ±10%
6. Copper thickness: 0.5OZ - 4OZ
7. Impedance Control: ±10%
8. Warpage: 0.075%-1.5%
9. Peelable: 0.012"(0.3mm)-0.02’(0.5mm)
10. Min Trace Width (a): 0.005"(0.125mm)
11. Min Space Width (b): 0.005"(0.125mm)
12. Min Annular Ring: 0.005"(0.125mm)
13. SMD Pitch (a): 0.012"(0.3mm)
14. pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b): 0.027"(0.675mm)
15. Regesiter tolerance: 0.05mm
16. Min Solder Mask Dam (a): 0.005"(0.125mm)
17. Soldermask Clearance (b): 0.005"(0.125mm)
18. Min SMT Pad spacing (c): 0.004"(0.1mm)
19. Solder Mask Thickness: 0.0007"(0.018mm)
20. Hole size: 0.01"(0.25mm)-- 0.257"(6.5mm)
21. Hole Size Tolerance: ±0.003"(±0.0762mm)
22. Aspect Ratio: 6:01:00
23. Hole Registration: 0.004"(0.1mm)
24. HASL: 2.5um
25. Lead free HASL: 2.5um
26. Immersion Gold: Nickel :3-7um Au:1-3u''
27. OSP: 0.2-0.5um
28. Panel Outline Tolerance: ±0.004''(±0.1mm)
29. Beveling: 30°45°
30. V-cut: 15° 30° 45° 60°
31. Surface finish: HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion
silver, immersion Tin, OSP, Carbon ink,
32. Certificate : ROHS ISO9001:2000 TS16949 SGS UL
33. Special requirements: Buried and blind vias, Impedance control, via plug, BGA soldering
and gold finger.
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
