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Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Material Types
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
Surface Treatment
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Application
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Product Details:
Payment & Shipping Terms:
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| Base Material: | FR4 | Copper Thickness: | 1OZ |
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| Board Thickness: | 0.2MM-3.0MM | Min. Hole Size: | 0.25MM |
| Min. Line Width: | 0.75MM | Min. Line Spacing: | 0.75MM |
| Surface Finishing: | HASL,OSP | Slik Screen Color: | White Black Blue Green Red |
| High Light: | pcb board design,printed circuit boards |
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Custom HASL Printer Circuit FR4 OSP Rigid PCB Board With Green Red Slik Screen
Welcome to Rigao Electronics .CO.,Ltd.
Single-side,double-sided and multilayer PCB and PCB Assembly manufacturer/OEM
- Contract Manufacturing
- Mixed-technology (High speed SMT & Through hole assembly)
- PCB Design & Assembly and copy service
- Prototyping
- Components purchasing
- Metal box,Coil,Cable and Wire Assemblies
- Plastics and Molds
| PCB Assembly Specifications | |
| Quantity | Prototype and small to middle volume are our specialty |
| Type of Assembly | SMT and Thru-hole |
| Type of Service | Turn-Key, Partial Turn-Key or Consignment |
| Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free |
| File Formats | Bill of Materials |
| Gerber Files | |
| Pick-N-Place File (XYRS) | |
| Bare Board Size | Smallest: 0.25 x 0.25 Inches |
| Largest: 20 x 20 Inches | |
| Components | Passives Down to 0201 Size |
| BGA and VFBGA | |
| Leadless Chip Carriers/ CSP | |
| Double-Sided SMT Assembly | |
| BGA Repair and Reball | |
| Part Removal and Replacement | |
| Component Packaging | Cut Tape,Tube,Reels,Loose Parts |
| Turn Time | Same Day Service to 15 day service |
| Testing | X-RAY Inspection & AOI Test |
PCB Assembly Technical Capability
We deliver high quality surface-mount technology (SMT) products through the use of modern, well maintained SMT lines that are operated by trained professionals. Our SMT lines are capable of handling both low and high volume through-put, can perform single and double sided component placement, mixture of SMT automatic and manual component assemblies, SMT and through-hole assemblies.
Capability 1.SMT with 4 million placements per day
2.Manual insertion with output 500,000pcs components per day
3.Chip mounting speed is 0.3S/unit,high-point speed is 0.16S/unit
Mount Precision: 1.Chips size:Min.0201
2.Mounting precision:0.1mm
3.Multi-functional machine can match 0.3 pitch packages such as BGA,CSP
Application
Products are applied to a wide range of High-tech industries such as: LED lighting,telecommunication, computer application, lighting, game machine, industrial control, power,automobile and high-end consumer electronics, ect.
By unremitting work and effort to the marketing, products exports to American,Canada, Europe counties,Africa and other Asia-pacific countries.
Quality Certificates
Lead free,ISO,UL,CE
View of Rigao Factory
Our Principle is simple, “Act by heart, Make the best.”
Our strengthis distinct, “Years of experiences in PCB and PCBA field”
Our Goal is achievable, “ To be the most reliable supplier of PCB and PCBA.”
Our orientation is clear, “Focus on prototypes and low to medium volume business ”
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
