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Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Material Types
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
Surface Treatment
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Application
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Product Details:
Payment & Shipping Terms:
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| High Light: | rigid printed circuit board,electronic circuit board |
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|---|---|---|---|
| Place of Origin: | China (Mainland) | Brand Name: | OEM | Model Number: | OEM-09 |
| Base Material: |
FR-4 Glass Epoxy laminate,ALuminium Based (Others, by special order)
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Copper Thickness: | 0.5OZ-6OZ | Board Thickness: | 0.1mm-3.5mm |
| Min. Hole Size: | 0.3mm | Min. Line Width: | 0.15mm | Min. Line Spacing: | 0.15mm |
| Surface Finishing: |
HAL, LHAL, Gold plate, OSP, Immersion silver
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Soldmask: |
Green, Red, Blue, Black, White, Yellow
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Product Range: |
2- 24 layers, HDI;Aluminium Based PCBs
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Double Side Rigid PCB
1 Good quality with competitive price
2 100% E-testing
3 Certificate:UL,RoHS
Specification:
| Processing Capability Of Rigid PCB: | ||
| NO. | ITEM | Technique Data |
| 1 | Product Range | 1- 24 layers, HDI;Aluminium Based PCBs |
| 2 | Base Material | FR-4 Glass Epoxy laminate,ALuminium Based (Others, by special order) |
| 3 | Major Laminate | King Board (KB-6150/60), ShengYi(S1141, S1170), Rogers,Teflon |
| 4 | Board Thickness | 0.1mm-3.5mm |
| 5 | Thickness of copper foil for the basis materials | 18um(1/2OZ),36um(1OZ),72um(2OZ) |
| 6 | The max board size | 610*711mm(24"x28") |
| 7 | Surface Finish Treatment | Electroless nickel Immersion gold(Electroless Ni/Au),Organic Solderability Preservatives (OSP or Entek), Hot Air Leveling (=HAL-Tin/Lead),<BR>Hot Air Leveling (Lead- Free, RoHS), Carbon Ink, Peelable Mask. Gold Fingers (30µ"),Immersion Silver (3~10u"); Immersion Tin (0.6~1.2um) |
| 8 | Via Holes | Copper PTH / Blind Via / Buried Via/ HDI 2+N+2 with IVH |
| 9 | Min line width/spacing | 0.127mm width/spacing(gild board),0.15mm width/spacing(tin-sprayed board) |
| 10 | Min. Board Thickness | 0.2mm (2 layers)/0.4mm(4layers)/0.9mm(8 layers)/1.2mm(10 layers)/1.3mm (12 layers)/1.5mm (14 layers)/1.7mm (16 layers) /1.8mm/2.0mm (18 layers)/2.2mm (20 layers)/2.4mm( 22 layers)/2.6mm(24 layers) |
| 11 | Copper Foil Thickness | 18um/35um/70um~245um(outerlayer:0.5oz~7oz)18um/35um/70um~210um(innerlayers:0.5oz~6oz) |
| 12 | Coating thickness | 1.Gild thickness:0.025um-0.075um 2.Turmeric thickness:0.025um-0.15um 3.Hole wall coating thickness for finished products:18-25um 4.Thickness for hard gold gild the golden finger:0.05um 0.075um 0.100um 0.125um 0.15um |
| 13 | Solder resist | 1.Categories:sensitization oil includes TaiYo ink PSR-2000,Chuang Yu ink LSM-3000N,and Hongkong XianDa ink ST-500;Thermosel oil include HongKong Xian da ink ST-300,etc 2.Colour:green,white,black,yellow,red and blue. |
| 14 | Outline processing categories and tolerance Punch | ±0.10mm,computer gong:±0.15mm,V-CUT:±0.2mm,Golden finger faceoff:30°45° 60° |
| 15 | Tolerance | 1.Linear diameter:±0.20% 2.Aperture for gilt-through finished products:±0.1mm 3.Aperture for NPTH finished products:±0.05mm 4.Board thickness:±0.075mm for boards of 0.4-0.6mm,±0.o9mm for boards of 0.6-0.1mm, 0.09mm for boards of 0.6-0.1mm,±0.13mm for boards of 1.2-1.6mm,±0.19mm for boards of 1.6-2.5mm |
| 16 | Degree of curvature for board warp | 0.5-0.7% |
| 17 | Anti-peeling intensity for the boards | 1.44/N/mm |
| 18 | Board dielectric constant | Normal 4.6-5.1 Special 2.55-11.0 |
| 19 | Tangent loss angel | 0.035 |
| 20 | Monthly yield | 17000m2 |
| 21 | Daily yield | 560m2 |
| 22 | Delivery Time | 1-3 days for samples,and 5-7 days for mass production |
| 23 | Standards for examing goods | Please refer to grade Ⅱof"MIL-STD-105",AQL=0.65 for serious deficeency,while AQL=0.65 for serious deficiency,while AQL-1.0 for minor deficiency |
| 24 | Quality Standards | 1.Nation standards: GB4588.2-88"nical specification for single/double-sided printed boards with plated through holse" International standards:IPC-A-600E 3.Enterprise:APC-STD-01"Accelerated Printed Circuit enterprise standards" |
Advantage:
1 Good quality with competitive price
2 100% E-testing
3 Certificate:UL,RoHS
4 Welcom to OEM order.
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
