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Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Material Types
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
Surface Treatment
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Application
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Product Details:
Payment & Shipping Terms:
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| High Light: | Rigid PCB Boards,electronic circuit board |
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| Place of Origin: | China (Mainland) | Brand Name: | OEM | Model Number: | pcba |
| Base Material: | FR-4 | Copper Thickness: | 0.5oz-11oz | Board Thickness: | 0.8-3mm |
| Min. Hole Size: | 0.2mm | Min. Line Width: | 0.1mm | Min. Line Spacing: | 0.1mm |
| Surface Finishing: |
Immersion gold ,chemical tin, HASL
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solder mask color: |
Green,black,
white,red,blue,yellow
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Inner packing: | Vaccum packing,Plastic bag |
| Outer packing: | standard carton paking | Hole tolerance: | PTH:0.075 NPTH:0.05 |
PCB board:
1Low Volume High Mix
2Reliable quality and Agile service
3Competitive price pcba
4electronic pcba oem servic
Available service :
1.Research and manufacture electronical products
2. PCB production service.
3. PCB assembly service. Available on SMT, BGA, DIP.
4. high quality led lights towards hight-end markets.Available on highbay light and panel light
5. Electronic Component purchasing service
One-stop pcb assemblies service, We can offer 1 to 12 Layer PCB fabrication, PCB design, PCB layout, PCB manufacturing, PCB Assemblies, components sourcing, PCBA Function Test, design solution.
PCBA Assmebly/ One-stop shop Contract Manufacturing
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Item |
Manufacture Capability |
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Material |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based |
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Layer No. |
1-16 |
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Finished Board thickness |
0.2 mm-3.8mm’(8 mil-150 mil) |
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Board Thickness Tolerance |
±10% |
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Cooper thickness |
0.5 OZ-11OZ (18 um-385 um) |
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Copper Plating Hole |
18-40 um |
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Impedance Control |
±10% |
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Warp&Twist |
0.70% |
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Peelable |
0.012"(0.3mm)-0.02’(0.5mm) |
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Images |
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Min Trace Width (a) |
0.1mm (4 mil) |
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Min Space Width (b) |
0.1mm (4 mil) |
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Min Annular Ring |
0.1mm (4 mil) |
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SMD Pitch (a) |
0.2 mm(8 mil) |
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BGA Pitch (b) |
0.2 mm (8 mil) |
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Solder Mask |
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Min Solder Mask Dam (a) |
0.0635 mm (2.5mil) |
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Soldermask Clearance (b) |
0.1mm (4 mil) |
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Min SMT Pad spacing (c) |
0.1mm (4 mil) |
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Solder Mask Thickness |
0.0007"(0.018mm) |
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Holes |
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Min Hole size (CNC) |
0.2 mm (8 mil) |
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Min Punch Hole Size |
0.9 mm (35 mil) |
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Hole Size Tol (+/-) |
PTH:±0.075mm;NPTH: ±0.05mm |
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Hole Position Tol |
±0.075mm |
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Plating |
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HASL |
2.5um |
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Lead free HASL |
2.5um |
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Immersion Gold |
Nickel 3-7um Au:1-5u'' |
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OSP |
0.2-0.5um |
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Outline |
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Panel Outline Tol (+/-) |
CNC: ±0.125mm, Punching: ±0.15mm |
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Beveling |
30°45° |
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Gold Finger angle |
15° 30° 45° 60° |
Lead time of prototype:
1. 10-15days, with customers completed technical information.
2. 12-18days, with customers samples
3. 20-25days, with customers request and our new design
Production period: 15-20days (5 more days for trial order)
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
