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Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Material Types
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
Surface Treatment
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Application
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
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Product Details:
Payment & Shipping Terms:
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Our PCB products experiences include telecommunications, automatic mobile assemblies, consumer electronics, computer, medical equipment, industrial products and others no matter it is quick-turn prototype, short-run or high volume mass production.
The flex-rigid pcb board is now available with OEM service and ISO9001:2008, UL, RoHS, ISO14000 certificates. Also features ENIG surface finish, 1oz copper thickness and 1.6mm board thickness.
We're specializing in rigid PCB, flex PCB and rigid-flex PCB, meanwhile, we supply all kinds of rigid and flex printed circuit boards. we can offer you a wide range of selection of rigid-flex PCB at affordable price. Welcome to visit us!
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Product name
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Flexible PCB
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Rigid PCB
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Rigid-flex PCB
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Layers
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1-6L
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1-28L
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1-8L
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Base Material
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PI
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Alu,FR1,FR2,FR4,CEM1,CEM2,cte
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PI,FR4
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Copper thickness
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1-3OZ
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1-6OZ
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1-6OZ
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Min.Hole size
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0.1mm | ||
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Min.Line Width
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0.1mm | ||
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Solder masker color
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Green, red, black, white, yellow | ||
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Silkscreen color
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Black, white, yellow | ||
FPC Manufacturer Capability:
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Layers
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1-6layers
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Finished Board Thickness
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0.1-0.2mm
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Max.(Min.)panel size
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600*250mm
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Available Laminates Material
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PI, PET,ED, RA
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Finished Board Thickness tolerance
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±10%
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Finished hole diameter(Min)
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0.2mm
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Finished Hole diameter(Max)
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6mm
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NPTH Hole diameter tolerance
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±0.05mm
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PTH Hole Diameter tolerance
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±0.05mm
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Copper foil thickness
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9/12/18/35/70um
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Circuit width/spacing(Min)
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0.075mm
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Surface Finished type
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immersion tin
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immersion gold
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OSP
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plated gold
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plate tin
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Gold flash Ni/Au thickness
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1-3U
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Immersion Tin thickness
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6-12um
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Tin platig thickeess
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10-15um
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Drill hole position tolerance
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±0.075mm
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Punching dimension tolerance
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±0.05mm
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Layer |
1 to 28 layers |
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Material type |
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
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Board thickness |
0.21mm to 7.0mm |
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Copper thickness |
0.5 OZ to 7.0 OZ |
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Copper thickness in hole |
>25.0 um (>1mil) |
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Size |
Max. Board Size: 23 × 25 (580mm×900mm) |
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Min. Drilled Hole Size: 3mil (0.075mm) |
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Min. Line Width: 3mil (0.075mm) |
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Min. Line Spacing: 3mil (0.075mm) |
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Surface finishing |
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
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Tolerance
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Shape tolerance: ±0.13 |
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Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
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Certificate |
UL, ISO 9001, ISO 14001 |
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Special requirements |
Buried and blind vias+controlled impedance +BGA |
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Profiling |
Punching, Routing, V-CUT, Beveling |
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Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products. |
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Contact Us:
Sales Manager: Angle
Email:sales@sonlinpcb.com
Skype:anglepcb
Web: www.sonlinpcb.com
Tex/Fax:86-0311-80661162
Mobile: 86-15717601162
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
