 |
|
Introduction
Double sided circuit board means has a double-sided copper, and metallized holes, that is double-sided copper, and copper are holes inside
Both sides have double wiring board, but to use the wire on both sides. Both sides must be in the room with appropriate electrical connections. "Bridge" between this circuit called vias. Guide hole in the PCB, metal filled or coated with holes, which can be connected to the conductors on both sides. Because dual-panel area twice as big than the single panel, double panel to solve the single-panel wiring staggered because of difficulty (can be turned to the other side of the hole), it is more suitable for use in more complex than single-panel circuit.
Advantages
Compared with single-board: wiring convenient, simple, labor-intensive wiring smaller, shorter line length.
Double Circuit Board Design Steps
1. Prepare circuit schematics
2. Create a new file and loaded PCB component package library
3, planning board
4, into the network table and components
5, automatic layout components
6, layout adjustment
7, the network density analysis
8, wiring rules set
9, automatic routing
10, manually adjust the wiring
Product Details:
Payment & Shipping Terms:
|
| High Light: | pcb printed circuit boards,prototype printed circuit board |
||
|---|---|---|---|
FR4 Double Sided PCB Green ENIG Immersion Gold Custom Printed Circuit Board OSP OEM
Characteristics:
1. Professional PCB manufacturer.
2. PCBA,OEM,ODM service are provided.
3. Gerber file needed.
4. Products are 100% E-tested.
5. Quality guarantee and professional after-sale service.
| PRODUCT’S DETAILS | |
| Raw Material | FR-4 (Tg 180 available) |
| Layer Count | 2-Layer |
| Board Thickness | 1.6mm |
| Copper Thickness | 2.0oz |
| Surface Finish | ENIG(Electroless Nickel Immersion Gold) |
| Solder Mask | Green |
| Silkscreen | White |
| Min. Trace Width/Spacing | 0.075/0.075mm |
| Min. Hole Size | 0.25mm |
| Hole Wall Copper Thickness | ≥20μm |
| Measurement | 300×400mm |
| Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
| Application | Communication,automobile,cell,computer,medical |
| Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
| Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
| PRODUCTION CAPABILITY OF PCB | ||
PROCESS Engineer |
ITEMS Item | PRODUCTION CAPABILITY Manufacturing Capability |
| Laminate | Type | FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON |
| Thickness | 0.2～3.2mm | |
| Production Type | Layer Count | 2L-16L |
| Surface Treatment | HAL,Gold Plating,Immersion Gold,OSP, Immersion Silver,Immersion Tin,Lead Free HAL |
|
| Cut Lamination | Max. Working Panel size | 1000×1200mm |
| Inner Layer | Internal Core Thickness | 0.1～2.0mm |
| Internal width/spacing | Min: 4/4mil | |
| Internal Copper Thickness | 1.0~3.0oz | |
| Dimension | Board Thickness Tolerance | ±10% |
| Interlayer Alignment | ±3mil | |
| Drilling | Manufacture Panel Size | Max: 650×560mm |
| Drilling Diameter | ≧0.25mm | |
| Hole Diameter Tolerance | ±0.05mm | |
| Hole Position Tolerance | ±0.076mm | |
| Min.Annular Ring | 0.05mm | |
| PTH+Panel Plating | Hole Wall copper Thickness | ≧20um |
| Uniformity | ≧90% | |
| Outer Layer | Track Width | Min: 0.08mm |
| Track Spacing | Min: 0.08mm | |
| Pattern Plating | Finished Copper Thickness | 1oz～3oz |
| EING/Flash Gold | Nickel Thickness | 2.5um~5.0um |
| Gold Thickness | 0.03~0.05um | |
| Solder Mask | Thickness | 15～35um |
| Solder Mask Bridge | 3mil | |
| Legend | Line width/Line spacing | 6/6mil |
| Gold Finger | Nickel Thickness | ≧120u〞 |
| Gold Thickness | 1～50u〞 | |
| Hot Air Level | Tin Thickness | 100～300u〞 |
| Routing | Tolerance of Dimension | ±0.1mm |
| Slot Size | Min:0.4mm | |
| Cutter Diameter | 0.8～2.4mm | |
| Punching | Outline Tolerance | ±0.1mm |
| Slot Size | Min:0.5mm | |
| V-CUT | V-CUT Dimension | Min:60mm |
| Angle | 15°30°45° | |
| Remain Thickness Tolerance | ±0.1mm | |
| Beveling | Beveling Dimension | 30～300mm |
| Test | Testing Voltage | 250V |
| Max.Dimension | 540×400mm | |
| Impedance Control | Tolerance |
±10% |
| Aspect Ration | 12:1 | |
| Laser Drilling Size | 4mil(0.1mm) | |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering and Gold Finger Are Acceptable |
|
| OEM&ODM Service | Yes | |
Quick Details
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
