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Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Material Types
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
Surface Treatment
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Application
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Product Details:
Payment & Shipping Terms:
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High Precision Infrared LED PCB Board / Aluminum Base PCB Board
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PCB Assembly Manufacturing Capabilities: |
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Type of Assembly |
THD (Thru-Hole Device), SMT (Surface-Mount Technology), SMT & THD mixed, Double-sided SMT and THD assembly. |
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Solder Type |
Water Soluble Solder Paste, Leaded process and Lead-Free (RoHS) |
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Components |
Passives parts, smallest size 0201 BGA, uBGA, QFN, POP, and Leadless chips Fine Pitch to 0.8Mils; BGA Repair and Reball; Part Removal and Replacement Connectors and terminals |
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Bare Board Size |
Smallest:0.25’’x 0.25’’ (6.35mm x 6.35mm) Largest: 20’’ x 20’’ (508mm x 508mm) |
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Min. IC Pitch |
0.012’’ (0.3mm) |
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QFN Lead Pitch |
0.012’’ (0.3mm) |
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Max. BGA size |
2.90’’ x 2.90’’ (74mm x 74mm) |
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Type of Service |
Turn-key, partial turn-key or consignment |
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Testing |
X-ray Inspection AOI (Automated Optical Inspection) ICT (In-Circuit Test)/Functional Testing |
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Turnaround Time |
Same day service to 15 days service |
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Component packaging |
Reels, cut tape, Tube and tray, Loose parts and bulk |
Rigid-Flex & Flex Circuit General Manufacturing Capabilities:
Layer Construction:Single-sided, Double-sided, Flex Rigid, Multilayer, Dual Access, Unsupported Leads
Trace/Space:1/2 oz. copper - .003”/.003” +/- .0005”
1 oz. copper - .006”/.006” +/- .0015”
2 oz. copper - .012”/.012” +/- .003”
Etch capabilities up to 14 oz.
Radii:Outside minimum sharp 90°
Inside standard .030”
Inside absolute minimum .010”
Plating:Electroless Copper, Electrolytic Copper, Hard & Soft Gold, Tin Immersion, Electrolytic Tin Lead (Solder), Hot Air Level, Entek Organic Coating
Material:Polyimide, Kapton, Teflon/Duroid, FR4, Getek, Thermount, Epoxy & Acrylic Adhesive System (UL Approved), Adhesiveless Copper-Clad Laminates (IPC)
Kapton/Standard Thickness for Base, Cover film & Stiffeners:0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil
Electrical Testing:Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
We are able to provide you best electronics services:
Technical requirement for pcb assembly:
Quote requirement for pcb and pcb assembly:
1) Gerber file and Bom list
2) Clear pics of pcba or pcba sample for us
3) Test method for PCBA
Lead Time
Samples: 3-4 days
Mass Production: 7-15 days(depend on the quantity)
Payment Terms
T/T,Western Union
Packing and Shipment
Vacuum package in carton
Applications of Products:
1. Computers and relevant products: Movable power board, U Disk, network interface, panel computer, cameral, wire-less mouse.
2. Home appliance: smart projector/digital cameral, high-frequency board. Recorder and repeater board, auto audio equipment main board and control board.
3. Wire-less communication: mobile board,. GPS/ direction record board, wireless telephone main board, intercom main board.
4. LED Lighting: LED drive power, LED light panel, LED light belt.
Why us?
Quality
Our UL(E465880)/Rohs standards insure quality assemblies from start to finish. Whether it's a simple custom product or a complex turnkey production run, JHD PCB will adhere to the highest quality standards.
Capable
JHD PCB offers the latest in assembly capabilities and qualifications insuring that quality is built into every product we produce.
Experience
When it comes to your build you want a partner you can depend on. Our management team has over 8years of combined industry knowledge. Our engineering team has over 5 years experience.
Protecting your interests
Protecting your Intellectual Property is job one! Our staff of trained professionals are all working under a strict confidentiality contract and treat your important documentation as they would their own.
Flexibility
JHD PCB prides ourselves on our ability to custom tailor programs around our customers' needs. JHD PCB takes time to listen to your unique business needs and then set out to surpass them.
JHD PCB would like to be your reliable partner in near future!
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
