Introduction
Double sided circuit board means has a double-sided copper, and metallized holes, that is double-sided copper, and copper are holes inside
Both sides have double wiring board, but to use the wire on both sides. Both sides must be in the room with appropriate electrical connections. "Bridge" between this circuit called vias. Guide hole in the PCB, metal filled or coated with holes, which can be connected to the conductors on both sides. Because dual-panel area twice as big than the single panel, double panel to solve the single-panel wiring staggered because of difficulty (can be turned to the other side of the hole), it is more suitable for use in more complex than single-panel circuit.
Advantages
Compared with single-board: wiring convenient, simple, labor-intensive wiring smaller, shorter line length.
Double Circuit Board Design Steps
1. Prepare circuit schematics
2. Create a new file and loaded PCB component package library
3, planning board
4, into the network table and components
5, automatic layout components
6, layout adjustment
7, the network density analysis
8, wiring rules set
9, automatic routing
10, manually adjust the wiring
Product Details:
Payment & Shipping Terms:
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Maximum Substrate Size: | 24”x32” | Substrate Thickness: | 0~10mm |
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Wavelength: | 405nm | Alignment Field Of View: | 4.8mmx5.7mm |
Light Source Uniformity: | >95% | Light Source Life: | 10000hrs |
Highlight: | circuit board testing equipment,pcb board testing equipment |
Automatic PCB Testing Equipment Double Sided Maskless Exposure System
Product Attributes:
Product name |
ALDI-PBD Series Double-sided Maskless Exposure System for PCB |
Brand Name: |
ASIDA |
Model Number: |
ALDI-PBD-836 |
Certification: |
/ |
Place of Origin: |
China |
Packaging Details: |
Wooden Carton |
Application:
High volume manufacturing of high-quality HDI; Quick samples;
Small quality manufacturing of various PCB designs; All layer process application including inner layer, outer layer and solder mask.
Product Features
Double-side Laser Dynamic Imaging Technology
Our proprietary patented technology of double-sided laser dynamic imaging makes it possible to achieve super side-to side alignment accuracy and high throughput.
High Power Fiber Coupled Laser
Fiber coupled high power laser module gives lighting exposure speed on all conventional photoresist. Flash operation mode leads to energy scaling and long operation life time
Flexible Multi-Engine Scanning Technology
Our Modular Optical engine gives the flecibility to adapt variable imaging heads for all kind of application requirements.
Real-time Scaling and Regional Distortion
Compensation Technology
The system generates images in real time, allowing the dynamic compensation for substrate scalling and rotation.Serial stamping and sub-panel distortion compensation are optional.
All Layer Process Capability
Our superior exposure system applies to all layer process and different dry films, including inner layer, outer layer and solder mask.
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345