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Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Material Types
FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base
Surface Treatment
HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Application
LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a
Product Details:
Payment & Shipping Terms:
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| Base Material: | FR-4,Polyimide | Surface Finishing: | ENIG,Gold Plating |
|---|---|---|---|
| Type: | Customizable,Electronic PCB Assembly | Layer: | 1~20 Layers |
| Copper Thickness: | 1oz,1/2OZ 1OZ 2OZ 3OZ | ||
| High Light: | electronic circuit board,multilayer printed circuit board |
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OEM Flexible FPCB Printed Pcb Board / Single Sided Printed Circuit Board
Quick Detail:
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Name |
FPCB |
Material |
Cu: 1 oz PI: 1 mil |
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Color |
Transparent,red,yellow, green,blue.Pink.,purple |
Surface treatment |
pure-tin plating |
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Minimum hole dimension |
0.3mm |
Chemical resistance |
Meet IPC standard: |
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Minimum linear width |
0.08mm |
Minimum linear distance |
0.08mm |
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External tolerance |
+/-0.05mm |
Welding resistance |
280 more than 10 seconds |
|
Peeling Strength |
1.2kg/cm2 |
Heat resistance |
-200 to +300 degrees C |
|
Surface resistivity |
1.0*1011 |
Bandability: |
Meet IPC standard |
Description:
The main technical indicators
1. Max size: single sided, double sided:600mm * 500mm Multi-layer: 400mm * 600mm
2. Processing thickness:0.2mm -4.0mm
3 Copper foil substrate thickness: 18μ(1/ 2OZ ),35μ( 1OZ ),70μ( 2OZ )
4 Common material: FR-4 , CEM-3 , CEM-1, Polytetrachloroethylene,FR-1(94V0,94HB)
5. Light copper,Nickel-plated,Gilded,HAL；Immersion Gold,Antioxidant,HASL,Immersion Tin,etc.
Applications:
1. The mobile phone
Focuses on the flexible circuit board light weight and thin thickness. Can effectively save the volume of products, easy connection of the battery, microphone, and buttons and into one.
2. Computer and LCD screen
Use the one line configuration of flexible circuit boards, and thin thickness. The digital signal into the picture, through the LCD screen
3. CD player
Focuses on three dimensional assembly characteristics of flexible circuit boards and thin thickness. The huge CD to carry around
4. Disk drives
Regardless of the hard disk, or diskette, is very dependent on FPC high softness and thickness of the 0.1 mm slim, read data finish quickly. Either a PC or NOTEBOOK.
5. The latest applications
Hard disk drives (HDDS, hard disk drive) of suspended circuit (Su ensi. N cireuit) and the components of xe packaging board, etc
Specifications
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Type |
PCB |
Application |
Electronic Products |
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Color |
blue |
Feature |
|
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Machine Stiffness |
Rigid |
Lays
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Customized |
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Material |
PET /PC |
I nsulation Material |
Organic resin |
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I nsulation layer thichness |
General |
Antiflaming Speciality |
VO |
|
Processing Technic |
Rolled foil |
Reinforcing material |
Glass fiber |
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Insulating Resin |
Polyimide resin |
Export Markets |
Global |
Process Capability
1. Drilling:The minimum diameter 0.1mm
2. Hole metallization:Minimum aperture 0.2mm,Thickness / aperture ratio 4:1
3. Wire width: Minimum:Gold plate 0.10mm, Tin plate0.1mm
4. Wire spacing: Minimum:Gold plate 0.10mm, Tin plate0.1mm
5. Gold plate: nickel layer thickness:≧2.5μ,Gold layer thickness: 0.05-0.1μm or according to customer requirements
6. HASL: tin layer thickness:≧2.5-5μ
7. Paneling: Line-to-edge minimum distance: 0.15mm hole to edge minimum distance: 0.15mm smallest form tolerance: ± 0.1mm
8. Socket chamfer: Angle: 30 degrees, 45 degrees, 60 degrees Depth: 1-3mm
9. V Cut: Angle: 30 degrees, 35 degrees, 45 degrees Depth: thickness 2/3 Minimum size: 80mm * 80mm
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