Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Applications
Rigid flexible PCBs offer a wide array of applications, ranging from military weaponry and aerospace systems to cell phones and digital cameras. Increasingly, rigid flex board fabrication has been used in medical devices such as pacemakers for their space and weight reduction capabilities. The same advantages for rigid flex PCB usage can be applied to military weaponry and weapon control systems.
In consumer products, rigid flex doesn't just maximize space and weight but greatly improves reliability, eliminating many needs for solder joints and delicate, fragile wiring that are prone to connection issues. These are just some examples, but rigid flex PCBs can be used to benefit nearly all advanced electrical applications including testing equipment, tools and automobiles. Not sure what technology needs to be used for your project? Call our experts and we can help you figure out whether you need rigid flex, flex or HDI PCB technology.
Product Details:
Payment & Shipping Terms:
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High Light: | flexible pcb board,flexible pcb prototype |
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Polyimide Rigid Flex PCB Immersion Silver , FR - 4 Aluminium Pcb Board For LCD Display
Quick Details
PCB Type: |
Flexible Printed Circuit |
Layer : |
2 layer |
Min .Line Width/Space: |
3mil/3mil |
Min. Via Diameter: |
0.3mm |
Finish Thickness: |
0.1mm |
Surface Finish: |
ENIG |
Size: |
60*100MM |
Material: |
PI |
Color: |
Gold |
Application: |
Mobile |
Description
Shenzhen Hengda Electronics is a leading manufacturer of precision Flexible Printed Circuit (FPC) for customers worldwide. We specialize in quick-turn FPC prototypes to FPC mass productions, provide high quality and cost effective turn key solutions to our customers.
This table lists the standard flex circuits materials and material thicknesses that we may have daily available. If the material or thickness you require is not listed, consult us. We have full specification of each material available for your required.
FPC Materials
Material Function |
Material Type |
Options |
Flexible Insulator |
Polyimide(PI) |
1/2 mil to 5 mil |
Conductor |
Copper |
1/4 oz(0.009mm) to 10 oz(0.356mm) |
Rigid Substrate (Rigid-Flex) |
FR-4 |
3 mil to 125 mil |
Adhesive |
Acrylic Adhesive |
1/2 mil to 3 mil |
Adhesiveless Material also available |
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Stiffener |
FR-4 Polyimide(PI) Polyester(PET) Adhesivetape Steel/Aluminum/Copper |
3mil to 125 mil 1/2 mil to 5mil 1 mil to 15mil 6 mil |
Solder Mask |
Polyimide(PI) Photoimageable Coverlay Liquid Photoimageable Covercoat |
1/2 mil to 5 mil 1 mil to 2.5 mil Liquid Typically for surface mount and dense applications |
Surface Finish Options |
Tin |
Immersion Tin |
Gold |
Electrolytic Nickel Immersion Gold Electrolytic Hard Nickel /Gold Electrolytic Soft Nickel/Gold |
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Silver |
Immersion Silver |
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OSP |
OSP |
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Shielding |
Solid Copper Crosshatched Copper Conductive Silver Aluminum |
Required To Limited Electromagnetic and/or Electrostatic |
FPC Standard Structure
Technical Capabilities
Layer (Max) |
Up to 8 Layers |
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Board Size (Max) |
500*1000mm |
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Outer tolerance |
a+/-0.2mm Hand Trim |
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Hole |
Diameter(Min) |
0.1mm(Finished) |
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Diameter Tolerance |
a.Plating Through Holes+/-0.08mm b.Non-Plating Through Holes+/-0.05mm |
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Drill Position Tolerance |
+/-0.076mm |
Conductor |
Width Tolerance |
+/-15% |
Spacing(Min) |
2mil |
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Spacing Tolerance |
+/-15% |
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Pad |
Pad(Non-Wiring) |
>=0.04mm+ Hole |
Pad(Wiring) |
>=0.3mm+Hole |
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Coverlay |
Coverlay to Pad(Min) |
100um |
Coverlay to Conductor (Min) |
100um |
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Coverlay Width(Min) |
250um |
|
Stiffener holes |
>=0.25mm+Access hole |
FPC Application
Testing Procedures
We perform multiple quality assurance procedures before shipping out any PCB board. These include:
Quick turn lead times
For HDI PCB production, we can provid 7 to10 days turn around times. For multilayer PCBs, the fastestturnaround time depends on the number of layers and quantity.
Service Guarantee
We make sure to serve each customer professionally, truthfully and friendly to the best of our ability. We will gladly re-work your project if your project isn’t 100% satisfactory.
Get a quick quote now
By sending in a bill of material, gerber files including assembly drawing and we will have a quotation back to you within hours. With Shenzhen hengda there is never a hidden cost and our prices are very competitive and reasonable.
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345