Introduction:
Focus on the most basic of PCB, components focused on one side, the other side of the wire is concentrated.Because wires only appear on one side, so this kind of PCB is called single sided PCB.
Single panel wiring diagram is given priority to with the network printing, that is, in the copper surface printed on resistance agent, to prevent welding resistance after etching printed on mark, and then punching processing way to complete the parts guide hole and the appearance.In addition, part of a small amount of diverse products, are using photosensitive resistance agent forming pattern of the photographic method.
Operating temperatures range from 130 C to 230 C. Single sided boards are available with surface finishes including Organic surface protectant (OSP), Immersion Silver, Tin, and Gold plating along with both leaded or lead-free Hot Air Solder Level (HASL).
Material:
Single sided PCB base material in paper phenolic copper paper laminated board, epoxy resin copper laminated plate is given priority to.
Structure:
First, the copper foil to be etched, etc. Process to obtain a circuit required, a protective film to be drilled to expose the corresponding pad. After cleaning and then rolling method to combine the two. Then the pad portion exposed gold plating or tin protection.
Production Process:
Single copper-clad plate - blanking - photochemical method/screen printing image transfer - remove corrosion was printed - cleaning, dry - hole machining - shape - dry cleaning - printing resistance welding coating - cure - printing mark symbol - cure - dry cleaning drying - pre coated flux - a finished product
Application
Single sided PCB most use in the radio, heating machine, cold storage, washing machines and other electrical appliances product, as well as the printer, vending machines, LED lighting, electronic components, such as commercial machine circuit
Product Details:
Payment & Shipping Terms:
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High Light: | Flexible Printed Circuit Board,flexible printed board |
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One-Stop Solution of Flexible Printed Circuit Boards (FPC Board)
Shipping Method and Payment terms:
Detailed Specification of Flexible PCB Manufacturing
Technical Specification |
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Layers: |
1~10 (flex Pcb) and 2~8 (rigid flex) |
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Min Panel Size: |
5mm x 8mm |
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Max Panel Size: |
250 x 520mm |
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Min Finished board thickness: |
0.05mm (1 sided inclusive copper) |
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Max Finished board thickness: |
0.3mm (2 sided inclusive copper) |
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Finished board thickness tolerance: |
±0.02~0.03mm |
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Material: |
Kapton, Polyimide, PET |
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Base copper thickness (RA or ED): |
1/3 oz, 1/2 oz, 1oz, 2oz |
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Base PI thickness: |
0.5mil, 0.7mil, 0.8mil, 1mil, 2mil |
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Stiffner: |
Polyimide, PET, FR4, SUS |
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Min Finished hole diameter: |
Φ 0.15mm |
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Max Finished hole diameter: |
Φ 6.30mm |
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Finished hole diameter tolerance (PTH): |
±2 mil ( ±0.050mm) |
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Finished hole diameter tolerance (NPTH): |
±1 mil ( ±0.025mm) |
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Min width/spacing (1/3oz): |
0.05mm/0.06mm |
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Min width/spacing (1/2oz): |
0.06mm/0.07mm |
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Min width/spacing (1oz): |
Single layer: 0.07mm/0.08mm |
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Double layer: 0.08mm/0.09mm |
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Aspect Ratio |
6:01 |
8:01 |
Base Copper |
1/3Oz--2Oz |
3 Oz for Prototype |
Size Tolerance |
Conductor Width:±10% |
W ≤0.5mm |
Hole Size: ±0.05mm |
H ≤1.5mm |
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Hole Registration: ±0.050mm |
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Outline Tolerance:±0.075mm |
L ≤50mm |
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Surface Treatment |
ENIG: 0.025um - 3um |
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OSP: |
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Immersion Tin: 0.04-1.5um |
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Dielectric Strength |
AC500V |
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Solder Float |
288℃/10s |
IPC Standard |
Peeling Strength |
1.0kgf/cm |
IPC-TM-650 |
Flammability |
94V-O |
UL |
PCB Assembly services:
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material
Testing Methods
AOI Testing
· Checks for solder paste
· Checks for components down to 0201"
· Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
· BGAs
· Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing
Detailed Specification of Pcb Assembly
1 |
Type of Assembly |
SMT and Thru-hole |
2 |
Solder Type |
Water Soluble Solder Paste,Leaded and Lead-Free |
3 |
Components |
Passives Down to 0201 Size |
BGA and VFBGA |
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Leadless Chip Carries/CSP |
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Double-Sided SMT Assembly |
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Fine Pitch to 08 Mils |
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BGA Repair and Reball |
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Part Removal and Replacement-Same Day Service |
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3 |
Bare Board Size |
Smallest:0.25x0.25 Inches |
Largest:20x20 Inches |
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4 |
File Formats |
Bill of Materials |
Gerber Files |
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Pick-N-Place File(XYRS) |
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Type of Service |
Turn-Key,Partial Turn-Key or Consignment |
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Component Packaging |
Cut Tape |
Tube |
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Reels |
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Loose Parts |
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Turn Time |
15 to 20 days |
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Testing |
AOI inspection |
X-Ray inspection |
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In-Circuit testing |
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Functional test |
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345