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Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards

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Rigid PCB Board

  • High Precision Rigid PCB Board suppliers
  • High Precision Rigid PCB Board suppliers

 

 

Introduction


Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.

Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.

 


Material Types


FR-4, CEM-1,CEM-3, IMS, High TG,High Frequency, Halogen Free,Aluminum base, metal core base

 

 

Surface Treatment


HASL(LF), Flash gold, ENIG,OSP(Lead free compatible), Carbon ink,
Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger

 


Production Process

 

Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.

Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.

The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.

 


Application


LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.a

Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards

Resin Fill Laser Drill  Blind Via Of  0.1mm Rigid PCB Multilayer Circuit Boards
Resin Fill Laser Drill  Blind Via Of  0.1mm Rigid PCB Multilayer Circuit Boards Resin Fill Laser Drill  Blind Via Of  0.1mm Rigid PCB Multilayer Circuit Boards

Large Image :  Resin Fill Laser Drill Blind Via Of 0.1mm Rigid PCB Multilayer Circuit Boards

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Detailed Product Description
Min Line Space: 0.2mm Min Line Width: 0.2mm
Copper Thickness: 2OZ Size: 11*7cm
Board THK: 2.MM Panel: 1
Surface Finish: ENIG Color: Green
Material: Rogers Model: XCER
High Light:

rigid pcb board

,

printed circuit board pcb

Resin Fill Laser Drill  Blind Via Of  0.1mm Rigid PCB Multilayer Circuit Boards

 

 

Specification:

 

  • Material: Rogers R4350
  • Layer counts: 6
  • Finish thickness: 2.72±10%mm
  • Min via diameter: 0.35mm
  • Surface finish: ENIG

 

 

Parameter:

 

Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

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