Introduction
Rigid flex printed circuit boards are boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.
Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale rigid flex PCB fabrication and PCB assembly, the technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of flex-rigid solutions and a proper assessment of the available options at the early stages in the rigid flex PCB design phase will return significant benefits. It is critical the rigid flex PCB fabricator is involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The rigid flex manufacturing phase is also more complex and time consuming than rigid board fabrication. All the flexible components of the rigid flex assembly have completely different handling, etching and soldering processes than rigid FR4 boards.
Applications
Rigid flexible PCBs offer a wide array of applications, ranging from military weaponry and aerospace systems to cell phones and digital cameras. Increasingly, rigid flex board fabrication has been used in medical devices such as pacemakers for their space and weight reduction capabilities. The same advantages for rigid flex PCB usage can be applied to military weaponry and weapon control systems.
In consumer products, rigid flex doesn't just maximize space and weight but greatly improves reliability, eliminating many needs for solder joints and delicate, fragile wiring that are prone to connection issues. These are just some examples, but rigid flex PCBs can be used to benefit nearly all advanced electrical applications including testing equipment, tools and automobiles. Not sure what technology needs to be used for your project? Call our experts and we can help you figure out whether you need rigid flex, flex or HDI PCB technology.
Product Details:
Payment & Shipping Terms:
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Product Name: | High Frequency Pcb | Layer Of Number: | 2 |
---|---|---|---|
Surface Finish: | Gold Plating | Base Material: | Rogers 4003C |
Cu THK: | 1OZ | Board THK: | 0.2mm |
High Light: | high frequency pcb design,printed circuit board design |
Rogers 4003C High Frequency PCB With Gold Plating Surface Finish
Specification:
Materia raw |
Rogers RO4003c |
Board THK |
0.2mm |
Layer |
2 |
Solder mask |
white |
Surface finish |
gold plated |
Line space |
0.1mm |
Copper THK |
1OZ |
Line width |
0.1mm |
Quick detail:
Model:XCEH
Board size:5*6cm
Origin: China
Brand:XCE
Parameter
XCE PCB technical specifications |
|
Material |
F4B |
Layer No. |
6 |
Min board thickness |
2 layer0.2mm 4 layer0.4mm 6 layer 0.6mm 8 layer 0.8mm 10 layer 1.0mm |
Max panel size |
508*610mm |
Board thickness tolerance |
T≥0.8mm±8%.,T<0.8mm±5% |
Wall hole copper thickness |
>0.025mm(1mil) |
Finished hole |
0.2mm-6.3mm |
Min line width |
4mil/4mil(0.1/0.1mm) |
Min bonding pad space |
0.1mm(4mil) |
PTH aperture tolerance |
±0.075mm(3mil) |
NPTH aperture tolerance |
±0.05mm(2mil) |
Hole site deviation |
±0.05mm(2mil) |
Profile tolerance |
±0.10mm(4mil) |
Board bend&warp |
≤0.7% |
Insulation resistance |
>1012Ωnormal |
Through-hole resistance |
<300Ωnormal |
Electric strength |
>1.3kv/mm |
Current breakdown |
10A |
Peel strength |
1.4N/mm |
Soldmask regidity |
>6H |
Thermal stress |
288℃20Sec |
Testing voltage |
50-300V |
Min buried blind via |
0.2mm(8mil) |
Outer copper thickness |
1oz-5oz |
Inner cooper thickness |
1/2 oz-4oz |
Aspect ratio |
8:1 |
SMT min green oil width |
0.08mm |
Min green oil open window |
0.05mm |
Insulation layer thickless |
0.075mm-5mm |
Taphole aperture |
0.2mm-0.6mm |
Special technology |
Indepedance,Blind buried via,thick gold,aluminum PCB |
Surface finish |
HASL,Lead free HASL,Immersion Gold, Immersion Tin, Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating |
Application:
Mobile communication products, amplifier, low noise amplifier,GSM, CDMA,
3G smart antenna,splitters, diplexers, filters, couplers and other passive components
Advantage:
OEM/ODM services are welcome
Heavy copper PCB, Heavy gold PCB, Blind & Buried PCB Board, FPC Flex-Rigid,HDI PCB, Impedance
control panel High layer count PCB, are available.
Factory direct wholesale price
Replying with price within 1 hour
Shipping within 24 hours
Certificate: ROHS, UL,SGS,9001-2000, ISO14001, SGS Lead-Free
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345