 |
|
Introduction：
Flex PCBs, also known as flexible printed circuits or flexible electronics, provide greater options for designers and engineers when assembling electronic circuits.
They are constructed from flexible, high-performance plastic material, usually polyimide, which enables the board to bend or "flex" during use. This flexibility opens them up to use in a wide range of applications.
Product Details:
Payment & Shipping Terms:
|
| Base Material: | FR-4 | Copper Thickness: | 1oz |
|---|---|---|---|
| Board Thickness: | 1.6mm | Min. Hole Size: | 4mil |
| Min. Line Width: | 4mil | Min. Line Spacing: | 4mil |
| Surface Finishing: | ENIG | Solder Mask Color: | Green, Yellow, Black, Purple, Blue, White And Red |
| Maximum Dimension: | 610 X 1100mm | DK Thickness: | 0.076 To 6.00mm |
| PCBA Test: | 100% Function Testing | ||
| High Light: | flex pcb board,flexible printed circuit |
||
We have adapted and developed our capabilities and skill set to meet every customer requirement, from the manufacture of a selective item through to complete project management. With rich experience within pcb fabrication, components sourcing and pcb assembly service. As a professional pcb&pcba manufacturer, To reach the highest quality and most exacting standards is our mission.
Take advantage of our strength and experience and allow us to help you maintain your competitive edge. we are well positioned to support our customers through the entire product life cycle, from concept to volume production.
Your single point of contact for all of your raw materials, parts, and pcb assembly, also offers:
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Component Procurement & Material Management
- Product Design
- Fast Track Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
- Function Testing Service
1.Printed Circuit Board process capability:
| 1 | Layers | Single Sided,2 to 18 Layer |
| 2 | Board material type | FR4,CEM-1,CEM-3,ceramic substrate board, aluminum based board, high-Tg, Rogers and more |
| 3 | Compound material lamination | 4 to 6 layers |
| 4 | Maximum dimension | 610 x 1,100mm |
| 5 | Dimension tolerance | ±0.13mm |
| 6 | Board thickness coverage | 0.2 to 6.00mm |
| 7 | Board thickness tolerance | ±10% |
| 8 | DK thickness | 0.076 to 6.00mm |
| 9 | Minimum line width | 0.10mm |
| 10 | Minimum line space | 0.10mm |
| 11 | Outer layer copper thickness | 8.75 to 175µm |
| 12 | Inner layer copper thickness | 17.5 to 175µm |
| 13 | Drilling hole diameter (mechanical drill) | 0.25 to 6.00mm |
| 14 | Finished hole diameter (mechanical drill) | 0.20 to 6.00mm |
| 15 | Hole diameter tolerance (mechanical drill) | 0.05mm |
| 16 | Hole position tolerance (mechanical drill) | 0.075mm |
| 17 | Laser drill hole size | 0.10mm |
| 18 | Board thickness and hole diameter ratio | 10:1 |
| 19 | Solder mask type | Green, Yellow, Black, Purple, Blue, White and Red |
| 20 | Minimum solder mask | Ø0.10mm |
| 21 | Minimum size of solder mask separation ring | 0.05mm |
| 22 | Solder mask oil plug hole diameter | 0.25 to 0.60mm |
| 23 | Impedance control tolerance | ±10% |
| 24 | Surface finish | Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger |
Contact Person: admin
