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Material
FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
Surface Treatment
HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Advantage
1.PCB factory directly
2.PCB high quality
3.PCB good price
4.PCB quick time
5.PCB certification(ISO/UL E354810/RoHS)
Capability:
-High Frequency (TACONIC material)/TG/Density/precision impedance controlled boards
-Heavy Copper PCB, Metal based PCB. Hard Gold PCB, Blind &Buried vias boards,
Halogen Free PCB, Aluminum-backed Boards
-Gold finger+ HAL & Leadfree HASL PCB, Leadfree compatible PCB
Product Details:
Payment & Shipping Terms:
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| Number Of Layers: | 6-Layer | Base Material: | FR4 |
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| Copper Thickness: | 18um | Board Thickness: | 1.6mm |
| Min. Hole Size: | 0.5mm | Min. Line Width: | 3 Mil |
| Min. Line Spacing: | 3 Mil | Surface Finishing: | OSP |
| High Light: | custom circuit board,hdi circuit boards |
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HDI mobile phone pcb layout
Detail:
(1)PCB and PCBA
(2)PCB Copy
(3)UL,ISO,RoHS,SGS
(4)PCB manufacturer
(5)Small order accepted
(6)high quality and resonable price
Specification:
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Item |
Capabilities |
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1.Base Material |
FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC |
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2.Layers |
1-30 |
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3.Finised inner/outer copper thickness |
1-12OZ |
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4.Finished board thickness |
0.2-7.0mm |
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Tolerance |
Board thickness≤1.0mm: +/-0.1mm 1<Board thickness≤2.0mm: +/-10% Board thickness>2.0mm: +/-8% |
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5.Max panel size |
≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm |
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6.Min conductor line width/spacing |
Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil |
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7.Min hole size |
Mechanical hole: 0.15mm Laser hole: 0.1mm |
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Drilling precision: first drilling |
First drilling: 1mil Second drilling: 4mil |
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8.Warpage |
Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% |
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9.Controlled Impedance |
+/-5% |
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10. Aspect Ratio |
15:1 |
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11.Min welding ring |
4mil |
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12.Min solder mask bridge |
≥0.08mm |
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13.Plugging vias capability |
0.2-0.8mm |
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14. Hole tolerance |
PTH: +/-3mil NPTH: +/-2mil |
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15.Outline profile |
Rout/ V-cut/ Bridge/ Stamp hole |
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16.Surface treatment |
OSP: 0.5-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U’’ ENEPIG: PB 2-5U’’/ Au 1-8U’’ Immersion Tin:0.8-1.2um Immersion silver: 0.1-1.2um Peelable blue mask Carbon ink Gold plating: Au 1-150U’’ |
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17. E-testing pass percent |
97% pass for the first time,+/-2%(tolerance) |
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FQC-Physical Lab: Reliability tests |
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18.Certificate |
ROHS UL:E327776 ISO9001:2008 IPC SGS |
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Our equipments |
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1.Drilling workshop |
4 drilling bits of drilling machine: 4 sets 2 drilling bits of drilling machine: 2 sets |
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2. photo plotting workshop |
Israel “ORBOTECH” Photo Plotters |
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3.AOI |
AOI machine |
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4.IPQC |
“OXFORD” CMI 700 Copper Thickness Tester |
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5.Impedance test |
USA “Tektronix” DSA 8200 Impedance Tester |
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6.Outline workshop |
CNC routing machine: 7 sets angle-cutting machine V-cut machine |
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7.Testing Workshop |
Surpass X-600: 2sets WTD FT-2808: 5sets WTD HV300: 1set |
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8.X-ray |
X-ray machine |
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Acceptable file format |
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GERBER file, PROTEL series, PADS series, POWER PCB series, AutoCAD series. |
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Contact Person: admin
