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Material
FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
Surface Finish
HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek)
Description
1. Complete products contract PCB assembly and manufacturing services
2. Circuit boards 2 to 30 layers PCB layout, fabrication, PCB assembly and box build
3.Active and passive components source is directly from original manufacturer
4. Enclosure cabinet case plastic injection molding, metal stamping, manufacture and assembly
5. High-precision 0201 size components SMT technology and lead-free
6. RoHS technology SMT process
7. IC pre-program
8. High-precision E-Testing include: ICT in circuit, BGA repaire device, etc.
Prototype and Mass Printed Board Assembly (PCBA)
Services:
1.Single-sided, double side & multi-layer PCB with competitive price, good quality and excellent service.
2. Cem-1, fr-4, fr-4 high tg, aluminum base material.
3. Hal, hal lead free, immersion gold/ silver/tin, osp surface treatment.
4.100% e-test.
Product Details:
Payment & Shipping Terms:
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| Copper Thickness: | 1/2 Oz Min; 12 Oz Max | Board Thickness: | 0.2mm-6mm(8mil-126mil) |
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| Min. Hole Size: | 0.1mm(4mil) | Min. Line Width: | 0.075mm(3mil) |
| Min. Line Spacing: | 0.1mm | Surface Finishing: | HASL / HASL Lead Free, Chemical Tin, Chemical Gold,OSP |
| Insulation Resistance: | 10Kohm-20Mohm | Test Voltage: | 10-300V |
| LED PCBA: | PCB Assembly | ||
| High Light: | custom pcb boards,electronic printed circuit board |
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Various PCB and PCBA with many years experience,We can provide a reasonable price with high quality products.
* 1. PCB layout, PCB design
* 2: Make high difficulty PCB(1 to 38 layers)
* 3: Provide all Electronic component
* 4: PCB assembly
* 5: Write programs for clients
* 6: PCBA/finished product Test. etc.
PCB Specification detail.
| Item | Specification | |
| 1 | Numbr of Layer | 1-38Layers |
| 2 | Material | FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate |
| 3 | Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) |
| 4 | Minimun Core Thickness | 0.075mm(3mil) |
| 5 | Copper Thickness | 1/2 oz min;12 oz max |
| 6 | Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| 7 | Min.Hole Diameter for CNC Driling | 0.1mm(4mil) |
| 8 | Min.Hole Diameter for punching | 0.9mm(35mil) |
| 9 | Biggest panel size | 610mm*508mm |
| 10 | Hole Positon | +/-0.075mm(3mil) CNC Driling |
| 11 | Conductor Width(W) | 0.05mm(2mil)or;+/-20% of original artwork |
| 12 | Hole Diameter(H) | PTH L:+/-0.075mm(3mil);Non-PTH L:+/-0.05mm(2mil) |
| 13 | Outline Tolerance | 0.125mm(5mil) CNC Routing;+/-0.15mm(6mil) by Punching |
| 14 | Warp & Twist | 0.70% |
| 15 | Insulation Resistance | 10Kohm-20Mohm |
| 16 | Conductivity | <50ohm |
| 17 | Test Voltage | 10-300V |
| 18 | Panel Size | 110×100mm(min);660×600mm(max) |
| 19 | Layer-layer misregistration | 4 layers:0.15mm(6mil)max;6 layers:0.25mm(10mil)max |
| 20 | Min.spacing between hole edge to circuity pqttern of an inner layer | 0.25mm(10mil) |
| 21 | Min.spacing between board oulineto circuitry pattern of an inner layer | 0.25mm(10mil) |
| 22 | Board thickness tolerance | 4 layers:+/-0.13mm(5mil);6 layers:+/-0.15mm(6mil) |
| 23 | Impedance Control | +/-10% |
| 24 | Different Impendance | +-/10% |
Details for PCB Assembly
Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
