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Material
FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
Surface Finish
HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek)
Description
1. Complete products contract PCB assembly and manufacturing services
2. Circuit boards 2 to 30 layers PCB layout, fabrication, PCB assembly and box build
3.Active and passive components source is directly from original manufacturer
4. Enclosure cabinet case plastic injection molding, metal stamping, manufacture and assembly
5. High-precision 0201 size components SMT technology and lead-free
6. RoHS technology SMT process
7. IC pre-program
8. High-precision E-Testing include: ICT in circuit, BGA repaire device, etc.
Prototype and Mass Printed Board Assembly (PCBA)
Services:
1.Single-sided, double side & multi-layer PCB with competitive price, good quality and excellent service.
2. Cem-1, fr-4, fr-4 high tg, aluminum base material.
3. Hal, hal lead free, immersion gold/ silver/tin, osp surface treatment.
4.100% e-test.
Product Details:
Payment & Shipping Terms:
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| Base Material: | FR-4,FR-2.taconic,rogers, CEM-1 CEM-3,ceramic,crockery,metal-backed | Copper Thickness: | Min-1/2oz;max-12oz |
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| Board Thickness: | 0.2mm-6.00 Mm(8mil-126mil) | Min. Hole Size: | 0.1mm(4mil) |
| Min. Line Width: | 0.075mm(3mil) | Min. Line Spacing: | 0.1mm(4mil) |
| Surface Finishing: | OSP, HASL, ENIG, ENEPIC,Immersion Silver, Immersion Tin Etc | Impedance Control: | +/-10% |
| Certificates: | UL, ROHS, T/S16949, ISO14001 2004 &ISO9001 2000 | Min.Trace Width & Line Spacing: | 0.075mm/0.1mm(3mil/4mil) |
| Min.Hole Diameter For CNC Driling: | 0.1mm(4mil) | Character: | High Thermal Conductivity |
| High Light: | custom pcb boards,circuit board tv |
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high thermal conductivity pcb maker/manufacturer/ supplier/ factory
We can prvide a package of service for all kinds of pcb:
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Specification for PCB Manufacture:
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Item |
Specification |
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Numbr of Layer |
1-38Layers |
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Material |
FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery |
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Metal-backed Laminate |
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Remarks |
High Tg CCL Is Availabe(Tg>=170ºC) |
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Finish Board Thickness |
0.2mm-6.00 mm(8mil-126mil) |
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Minimun Core Thickness |
0.075mm(3mil) |
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Copper Thickness |
1/2 oz min;12 oz max |
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Min.Trace Width & Line Spacing |
0.075mm/0.1mm(3mil/4mil) |
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Min.Hole Diameter for CNC Driling |
0.1mm(4mil) |
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Min.Hole Diameter for punching |
0.9mm(35mil) |
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Biggest panel size |
610mm*508mm |
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Hole Positon |
+/-0.075mm(3mil) CNC Driling |
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Conductor Width(W) |
+/-0.05mm(2mil)or |
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+/-20% of original artwork |
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Hole Diameter(H) |
PTH L:+/-0.075mm(3mil) |
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Non-PTH L:+/-0.05mm(2mil) |
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Outline Tolerance |
+/-0.125mm(5mil) CNC Routing |
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+/-0.15mm(6mil) by Punching |
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Warp & Twist |
0.70% |
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Insulation Resistance |
10Kohm-20Mohm |
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Conductivity |
<50ohm |
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Test Voltage |
10-300V |
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Panel Size |
110×100mm(min) |
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660×600mm(max) |
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Layer-layer misregistration |
4 layers:0.15mm(6mil)max |
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6 layers:0.25mm(10mil)max |
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Min.spacing between hole edge to circuity pqttern of an inner layer |
0.25mm(10mil) |
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Min.spacing between board oulineto circuitry pattern of an inner layer |
0.25mm(10mil) |
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Board thickness tolerance |
4 layers:+/-0.13mm(5mil) |
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6 layers:+/-0.15mm(6mil) |
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Impedance Control |
+/-10% |
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Different Impendance |
+-/10% |
Details of tech:
PCB/ PCBA Technic
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
PCB/ PCBA Quote requirement
1).The detailed files(Gerber file/ PADS/ AutoCAD/ Protell/ Power PCB/ DWG/ schematic etc and BOM);
2).Clear pictures of PCBA or samples for us;
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
