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Introduction
We can make single/double sided board, multi-layer board, high density board, including MLB with blind/buried via holes
Main Base Material
FR-1, FR-2, FR-4, CEM-1, CEM-3, High Frequency Laminate with various dielectric constant (imported or from local supplier), Aluminum base laminate, Metal core Aluminum
We choose the best base material suppliers as our partners, such as KB and Shengyi to guarantee our products with high quality.
Surface Finish
Hot air Lev p lead free HASL, immersion gold/silver/tin, plating gold, OSP
Board Thickness
Inner core thickness 0.15-1.5mm, finished board thickness 0.20-3mm
Service
*- Comprehensive documents audit to prevent mistakes in PCB Gerber and Bom.
*- Suggest best quality replacement with lower price.
*- Engineering support for test and provide suggestions for mass production.
*- Suggest best shipment method.
*- Sign NDA to keep your design safe.
Product Details:
Payment & Shipping Terms:
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| Number Of Layers: | 10-Layer | Base Material: | FR4 |
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| Copper Thickness: | 1OZ | Board Thickness: | 1.2mm |
| Min. Hole Size: | 0.2mm | Min. Line Width: | 0.1mm |
| Min. Line Spacing: | 0.1mm | Surface Finishing: | ENIG |
| Soldermask Colour: | Blue/white/green/yellow... | Process Finish: | OSP, HASL, Gold Plating, ENIG |
| Other Service: | PCB Copy, PCB Assembly Service | ||
| High Light: | mobile phone pcb,mobile phone circuit board |
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1.Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Advantage
1.PCB factory directly
2.PCB Have the comprehensive quality control system
3.PCB good price
4.PCB quick turn delivery time from 48hours.
5.PCB certification(ISO/UL E354810/RoHS)
6.8 years experience in exporting service
7.PCB is no MOQ/MOV.
8.PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
The information about our company's process capacity for your reference:
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Specification Inch (mm) |
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Material |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium |
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Layer No. |
1-30 |
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Board thickness |
0.015"(0.4mm)-0.125"(3.2mm) |
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Board Thickness Tolerance |
±10% |
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Cooper thickness |
1/2OZ-3OZ |
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Impedance Control |
±10% |
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Warpage |
0.075%-1.5% |
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Peelable |
0.012"(0.3mm)-0.02’(0.5mm) |
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Min Trace Width (a) |
0.005"(0.125mm) |
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Min Space Width (b) |
0.005"(0.125mm) |
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Min Annular Ring |
0.005"(0.125mm) |
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SMD Pitch (a) |
0.012"(0.3mm) |
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BGA Pitch (b) |
0.027"(0.675mm) |
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Regesiter torlerance |
0.05mm |
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Min Solder Mask Dam (a) |
0.005"(0.125mm) |
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Soldermask Clearance (b) |
0.005"(0.125mm) |
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Min SMT Pad spacing (c) |
0.004"(0.1mm) |
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Solder Mask Thickness |
0.0007"(0.018mm) |
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Hole size |
0.01"(0.25mm)-- 0.257"(6.5mm) |
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Hole Size Tol (+/-) |
±0.003"(±0.0762mm) |
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Aspect Ratio |
6:1 |
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Hole Registration |
0.004"(0.1mm) |
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Plating
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HASL |
2.5um |
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Lead free HASL |
2.5um |
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Immersion Gold |
Nickel 3-7um Au:1-3u'' |
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OSP |
0.2-0.5um |
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Outline
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Panel Outline Tol (+/-) |
±0.004''(±0.1mm) |
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Beveling |
30°45° |
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V-cut |
15° 30° 45° 60° |
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Certificate |
ROHS ISO9001:2000 TS16949 SGS UL |
Contact Person: Miss. aaa
Tel: 86 755 8546321
Fax: 86-10-66557788-2345
